CH342659A - Halbleiteranordnung, bei der der Halbleiterkörper in einem metallischen Behälter hermetisch eingeschlossen ist - Google Patents

Halbleiteranordnung, bei der der Halbleiterkörper in einem metallischen Behälter hermetisch eingeschlossen ist

Info

Publication number
CH342659A
CH342659A CH342659DA CH342659A CH 342659 A CH342659 A CH 342659A CH 342659D A CH342659D A CH 342659DA CH 342659 A CH342659 A CH 342659A
Authority
CH
Switzerland
Prior art keywords
semiconductor
metallic container
hermetically enclosed
arrangement
semiconductor body
Prior art date
Application number
Other languages
English (en)
Inventor
F Losco Ezekiel
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH342659A publication Critical patent/CH342659A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00Heat exchange
    • Y10S165/905Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
CH342659D 1955-01-20 1956-01-16 Halbleiteranordnung, bei der der Halbleiterkörper in einem metallischen Behälter hermetisch eingeschlossen ist CH342659A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US483072A US2752541A (en) 1955-01-20 1955-01-20 Semiconductor rectifier device

Publications (1)

Publication Number Publication Date
CH342659A true CH342659A (de) 1959-11-30

Family

ID=23918528

Family Applications (1)

Application Number Title Priority Date Filing Date
CH342659D CH342659A (de) 1955-01-20 1956-01-16 Halbleiteranordnung, bei der der Halbleiterkörper in einem metallischen Behälter hermetisch eingeschlossen ist

Country Status (4)

Country Link
US (1) US2752541A (de)
CH (1) CH342659A (de)
DE (1) DE1045551B (de)
FR (1) FR1094755A (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3299331A (en) * 1955-05-10 1967-01-17 Texas Instruments Inc Transistor structure with heatconductive housing for cooling
US2830238A (en) * 1955-09-30 1958-04-08 Hughes Aircraft Co Heat dissipating semiconductor device
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
US2930948A (en) * 1956-03-09 1960-03-29 Sarkes Tarzian Semiconductor device
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
US2878432A (en) * 1956-10-12 1959-03-17 Rca Corp Silicon junction devices
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
DE1170553B (de) * 1957-03-27 1964-05-21 Licentia Gmbh Verfahren zum Einbau einer Halbleiteranordnung in ein Gehaeuse
US2981873A (en) * 1957-05-02 1961-04-25 Sarkes Tarzian Semiconductor device
US2909714A (en) * 1957-05-27 1959-10-20 Int Rectifier Corp Hermetically sealed rectifier
US3021460A (en) * 1957-08-20 1962-02-13 Texas Instruments Inc Semiconductor translating device with silicone fluid filler
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US3054032A (en) * 1958-11-17 1962-09-11 Rolland C Sabins Heat sink for a. c.-d. c. rectifier
DE1205626B (de) * 1959-01-28 1965-11-25 Bosch Gmbh Robert Halbleiteranordnung
DE1160549B (de) * 1960-02-10 1964-01-02 Siemens Ag Verfahren zur Herstellung einer Verbindung durch Loetung bzw. Legierung an Halbleiteranordnungen
DE1207011C2 (de) * 1960-02-11 1966-06-30 Siemens Ag Verfahren zum Herstellen von Halbleiter-bauelementen
US3152293A (en) * 1960-12-16 1964-10-06 Ruben Samuel Sealed semiconductor device and mounting means therefor
US3229348A (en) * 1961-02-24 1966-01-18 Hughes Aircraft Co Method of making semiconductor devices
US3223903A (en) * 1961-02-24 1965-12-14 Hughes Aircraft Co Point contact semiconductor device with a lead having low effective ratio of length to diameter
DE1209209C2 (de) * 1961-07-24 1966-07-28 Siemens Ag In einer isolierenden Masse vergossenes Halbleiterelment
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device
US3277957A (en) * 1964-04-03 1966-10-11 Westinghouse Electric Corp Heat transfer apparatus for electronic component
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
US3925809A (en) * 1973-07-13 1975-12-09 Ford Motor Co Semi-conductor rectifier heat sink
DE2931596C2 (de) * 1979-08-03 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Einbringen eines Getterstoffes in das Gehäuse eines elektrischen Bauelementes
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
KR20180002419A (ko) * 2016-06-29 2018-01-08 현대자동차주식회사 파워 모듈 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665399A (en) * 1954-01-05 Rectifier assembly
US2197115A (en) * 1937-01-27 1940-04-16 Gen Motors Corp Electric thermogauge engine unit
US2572801A (en) * 1943-06-23 1951-10-23 Sylvania Electric Prod Electrical rectifier
FR1050940A (fr) * 1952-02-19 1954-01-12 Westinghouse Freins & Signaux élément redresseur protégé contre les agents extérieurs
IT504354A (de) * 1952-08-08
US2712619A (en) * 1954-06-17 1955-07-05 Westinghouse Air Brake Co Dry disk rectifier assemblies

Also Published As

Publication number Publication date
FR1094755A (de) 1955-05-24
DE1045551B (de) 1958-12-04
US2752541A (en) 1956-06-26

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