FR1024823A - Perfectionnements aux soudures - Google Patents

Perfectionnements aux soudures

Info

Publication number
FR1024823A
FR1024823A FR1024823DA FR1024823A FR 1024823 A FR1024823 A FR 1024823A FR 1024823D A FR1024823D A FR 1024823DA FR 1024823 A FR1024823 A FR 1024823A
Authority
FR
France
Prior art keywords
welding
welding improvements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imperial Chemical Industries Ltd
Original Assignee
Imperial Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imperial Chemical Industries Ltd filed Critical Imperial Chemical Industries Ltd
Application granted granted Critical
Publication of FR1024823A publication Critical patent/FR1024823A/fr
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR1024823D 1949-11-16 1950-09-22 Perfectionnements aux soudures Expired FR1024823A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB289438X 1949-11-16

Publications (1)

Publication Number Publication Date
FR1024823A true FR1024823A (fr) 1953-04-07

Family

ID=10283692

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1024823D Expired FR1024823A (fr) 1949-11-16 1950-09-22 Perfectionnements aux soudures

Country Status (4)

Country Link
US (1) US2552935A (fr)
CH (1) CH289438A (fr)
FR (1) FR1024823A (fr)
GB (1) GB671079A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2195502A1 (en) * 1972-08-07 1974-03-08 Asahi Glass Co Ltd Lead-tin solder - with high adhesion to oxide (coatings) and ceramics
CN104526180A (zh) * 2014-12-11 2015-04-22 徐国华 一种含铈铷锌的无铅焊料及其制备方法
CN104607817A (zh) * 2014-12-11 2015-05-13 徐国华 一种镧硒铯锌锡合金焊料及其制备方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2998334A (en) * 1958-03-07 1961-08-29 Transitron Electronic Corp Method of making transistors
DE1176451B (de) * 1958-09-10 1964-08-20 Siemens Ag Verfahren zur Herstellung eines Halbleiter-bauelementes
EP0058802A1 (fr) * 1980-12-19 1982-09-01 Universal Solder Company (Pty) Limited Soudure tendre
US5147471A (en) * 1991-04-08 1992-09-15 Kronberg James W Solder for oxide layer-building metals and alloys
DE69524912T2 (de) * 1994-09-30 2002-08-22 At & T Corp Bleifreie Legierungen zum Weichlöten
DE102004050441A1 (de) * 2004-10-16 2006-04-20 Stannol Gmbh Lotmaterial
CN100366376C (zh) * 2005-12-23 2008-02-06 南京航空航天大学 含铈的Sn-Cu-Ni钎料
CN101585120B (zh) * 2009-06-29 2012-08-22 铜陵森泰金属材料有限公司 一种锡锌基无铅钎料合金
CN104588911A (zh) * 2014-12-11 2015-05-06 徐国华 一种无铅焊料及其制备方法
US9953908B2 (en) * 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2195502A1 (en) * 1972-08-07 1974-03-08 Asahi Glass Co Ltd Lead-tin solder - with high adhesion to oxide (coatings) and ceramics
CN104526180A (zh) * 2014-12-11 2015-04-22 徐国华 一种含铈铷锌的无铅焊料及其制备方法
CN104607817A (zh) * 2014-12-11 2015-05-13 徐国华 一种镧硒铯锌锡合金焊料及其制备方法

Also Published As

Publication number Publication date
CH289438A (de) 1953-03-15
GB671079A (en) 1952-04-30
US2552935A (en) 1951-05-15

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