FI981909A0 - Lämmönsiirrin - Google Patents

Lämmönsiirrin

Info

Publication number
FI981909A0
FI981909A0 FI981909A FI981909A FI981909A0 FI 981909 A0 FI981909 A0 FI 981909A0 FI 981909 A FI981909 A FI 981909A FI 981909 A FI981909 A FI 981909A FI 981909 A0 FI981909 A0 FI 981909A0
Authority
FI
Finland
Prior art keywords
heat exchanger
exchanger
heat
Prior art date
Application number
FI981909A
Other languages
English (en)
Swedish (sv)
Other versions
FI981909A (fi
Inventor
Tommi Mannerjoki
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Priority to FI981909A priority Critical patent/FI981909A/fi
Publication of FI981909A0 publication Critical patent/FI981909A0/fi
Priority to AU55200/99A priority patent/AU5520099A/en
Priority to PCT/FI1999/000719 priority patent/WO2000014469A1/fi
Publication of FI981909A publication Critical patent/FI981909A/fi

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI981909A 1998-09-07 1998-09-07 Lämmönsiirrin FI981909A (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI981909A FI981909A (fi) 1998-09-07 1998-09-07 Lämmönsiirrin
AU55200/99A AU5520099A (en) 1998-09-07 1999-09-07 Heat exchanger, cabinet for telecommunication devices and method of cooling electronic devices
PCT/FI1999/000719 WO2000014469A1 (fi) 1998-09-07 1999-09-07 Heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI981909A FI981909A (fi) 1998-09-07 1998-09-07 Lämmönsiirrin

Publications (2)

Publication Number Publication Date
FI981909A0 true FI981909A0 (fi) 1998-09-07
FI981909A FI981909A (fi) 2000-03-08

Family

ID=8552431

Family Applications (1)

Application Number Title Priority Date Filing Date
FI981909A FI981909A (fi) 1998-09-07 1998-09-07 Lämmönsiirrin

Country Status (3)

Country Link
AU (1) AU5520099A (fi)
FI (1) FI981909A (fi)
WO (1) WO2000014469A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6694730B2 (en) 2002-05-30 2004-02-24 Superconductor Technologies, Inc. Stirling cycle cryocooler with improved magnet ring assembly and gas bearings
US6892801B1 (en) * 2004-01-15 2005-05-17 Sun Microsystems, Inc. Thermal control apparatus for electronic systems
EP2117288A1 (en) 2008-05-07 2009-11-11 3M Innovative Properties Company Heat-management system for a cabinet containing electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
EP0461114A1 (en) * 1989-12-28 1991-12-18 Bell Telephone Manufacturing Company Naamloze Vennootschap Cooling system
JPH04366393A (ja) * 1991-06-14 1992-12-18 Fujitsu Ltd ヒートパイプの取付け構造
US5313099A (en) * 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
US5699227A (en) * 1996-06-28 1997-12-16 Intel Corporation Heat pipe to baseplate attachment method
EP0889524A3 (en) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system

Also Published As

Publication number Publication date
WO2000014469A1 (fi) 2000-03-16
FI981909A (fi) 2000-03-08
AU5520099A (en) 2000-03-27

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