FI981909A - Lämmönsiirrin - Google Patents
Lämmönsiirrin Download PDFInfo
- Publication number
- FI981909A FI981909A FI981909A FI981909A FI981909A FI 981909 A FI981909 A FI 981909A FI 981909 A FI981909 A FI 981909A FI 981909 A FI981909 A FI 981909A FI 981909 A FI981909 A FI 981909A
- Authority
- FI
- Finland
- Prior art keywords
- heat exchanger
- exchanger
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI981909A FI981909A (fi) | 1998-09-07 | 1998-09-07 | Lämmönsiirrin |
| AU55200/99A AU5520099A (en) | 1998-09-07 | 1999-09-07 | Heat exchanger, cabinet for telecommunication devices and method of cooling electronic devices |
| PCT/FI1999/000719 WO2000014469A1 (fi) | 1998-09-07 | 1999-09-07 | Heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI981909A FI981909A (fi) | 1998-09-07 | 1998-09-07 | Lämmönsiirrin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI981909A0 FI981909A0 (fi) | 1998-09-07 |
| FI981909A true FI981909A (fi) | 2000-03-08 |
Family
ID=8552431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI981909A FI981909A (fi) | 1998-09-07 | 1998-09-07 | Lämmönsiirrin |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU5520099A (fi) |
| FI (1) | FI981909A (fi) |
| WO (1) | WO2000014469A1 (fi) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6694730B2 (en) | 2002-05-30 | 2004-02-24 | Superconductor Technologies, Inc. | Stirling cycle cryocooler with improved magnet ring assembly and gas bearings |
| US6892801B1 (en) * | 2004-01-15 | 2005-05-17 | Sun Microsystems, Inc. | Thermal control apparatus for electronic systems |
| EP2117288A1 (en) | 2008-05-07 | 2009-11-11 | 3M Innovative Properties Company | Heat-management system for a cabinet containing electronic equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4638854A (en) * | 1983-06-15 | 1987-01-27 | Noren Don W | Heat pipe assembly |
| WO1991010346A1 (en) * | 1989-12-28 | 1991-07-11 | Alcatel N.V. | Cooling system |
| JPH04366393A (ja) * | 1991-06-14 | 1992-12-18 | Fujitsu Ltd | ヒートパイプの取付け構造 |
| US5313099A (en) * | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
| US5699227A (en) * | 1996-06-28 | 1997-12-16 | Intel Corporation | Heat pipe to baseplate attachment method |
| EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
-
1998
- 1998-09-07 FI FI981909A patent/FI981909A/fi unknown
-
1999
- 1999-09-07 AU AU55200/99A patent/AU5520099A/en not_active Abandoned
- 1999-09-07 WO PCT/FI1999/000719 patent/WO2000014469A1/fi active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| AU5520099A (en) | 2000-03-27 |
| FI981909A0 (fi) | 1998-09-07 |
| WO2000014469A1 (fi) | 2000-03-16 |
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