FI981374A - Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuv a lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitout uvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi - Google Patents

Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuv a lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitout uvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi Download PDF

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Publication number
FI981374A
FI981374A FI981374A FI981374A FI981374A FI 981374 A FI981374 A FI 981374A FI 981374 A FI981374 A FI 981374A FI 981374 A FI981374 A FI 981374A FI 981374 A FI981374 A FI 981374A
Authority
FI
Finland
Prior art keywords
heat exchanger
binding
producing
binding heat
exchanger binding
Prior art date
Application number
FI981374A
Other languages
English (en)
Swedish (sv)
Other versions
FI981374A0 (fi
FI110030B (fi
Inventor
Carl Axel Ingemar Kabrell
Reijo Lehtiniemi
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI980381A external-priority patent/FI980381A0/fi
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI981374A priority Critical patent/FI110030B/fi
Publication of FI981374A0 publication Critical patent/FI981374A0/fi
Priority to AU25238/99A priority patent/AU2523899A/en
Priority to EP99904893A priority patent/EP1056981A1/en
Priority to PCT/FI1999/000131 priority patent/WO1999042781A1/en
Publication of FI981374A publication Critical patent/FI981374A/fi
Application granted granted Critical
Publication of FI110030B publication Critical patent/FI110030B/fi

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/0014—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping tubes or blown tubular films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/18—Heat-exchangers or parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
FI981374A 1998-02-19 1998-06-12 Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi FI110030B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI981374A FI110030B (fi) 1998-02-19 1998-06-12 Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi
AU25238/99A AU2523899A (en) 1998-02-19 1999-02-18 Heat exchanger and method for producing the heat exchanger
EP99904893A EP1056981A1 (en) 1998-02-19 1999-02-18 Heat exchanger and method for producing the heat exchanger
PCT/FI1999/000131 WO1999042781A1 (en) 1998-02-19 1999-02-18 Heat exchanger and method for producing the heat exchanger

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FI980381A FI980381A0 (fi) 1998-02-19 1998-02-19 Vaermeoeverfoerare, vars funktion baserar sig pao vaermeenergi, som uppbinds i ett arbetsmediums fasfoerandring
FI980381 1998-02-19
FI981374 1998-06-12
FI981374A FI110030B (fi) 1998-02-19 1998-06-12 Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi

Publications (3)

Publication Number Publication Date
FI981374A0 FI981374A0 (fi) 1998-06-12
FI981374A true FI981374A (fi) 1999-08-20
FI110030B FI110030B (fi) 2002-11-15

Family

ID=26160543

Family Applications (1)

Application Number Title Priority Date Filing Date
FI981374A FI110030B (fi) 1998-02-19 1998-06-12 Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi

Country Status (4)

Country Link
EP (1) EP1056981A1 (fi)
AU (1) AU2523899A (fi)
FI (1) FI110030B (fi)
WO (1) WO1999042781A1 (fi)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2002080270A1 (en) * 2001-03-30 2002-10-10 Thermotek, Inc. Cooling apparatus having low profile extrusion
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
WO2003046463A2 (en) 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
SG142174A1 (en) 2006-10-11 2008-05-28 Iplato Pte Ltd Method for heat transfer and device therefor
DE102007038909B4 (de) * 2007-08-17 2021-07-15 Osram Gmbh Wärmeleitrohr und Anordnung mit Wärmeleitrohr
TWI738179B (zh) * 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4279294A (en) * 1978-12-22 1981-07-21 United Technologies Corporation Heat pipe bag system
SE8003579L (sv) * 1980-05-13 1981-11-14 Ericsson Telefon Ab L M Kylanordning for diskreta eller pa kretskort monterade elektroniska komponenter
DE3144089C1 (de) * 1981-11-06 1983-04-21 Daimler-Benz Ag, 7000 Stuttgart Flaechenheizkoerper,insbesondere fuer Fahrzeuge
KR930009932B1 (ko) * 1987-12-09 1993-10-13 후지 꾸라 덴센 가부시끼가이샤 히트파이프 및 그의 제조방법
US5314010A (en) * 1987-12-09 1994-05-24 Fujikura Ltd. Heat pipe and method of manufacturing the same
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler

Also Published As

Publication number Publication date
WO1999042781A1 (en) 1999-08-26
FI981374A0 (fi) 1998-06-12
AU2523899A (en) 1999-09-06
EP1056981A1 (en) 2000-12-06
FI110030B (fi) 2002-11-15

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