FI971881A - Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti - Google Patents

Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti Download PDF

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Publication number
FI971881A
FI971881A FI971881A FI971881A FI971881A FI 971881 A FI971881 A FI 971881A FI 971881 A FI971881 A FI 971881A FI 971881 A FI971881 A FI 971881A FI 971881 A FI971881 A FI 971881A
Authority
FI
Finland
Prior art keywords
heat sink
installing
sink
heat
Prior art date
Application number
FI971881A
Other languages
English (en)
Swedish (sv)
Other versions
FI971881A0 (fi
Inventor
Goesta Baarman
Tapio Tuomainen
Seppo Pelkonen
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Priority to FI971881A priority Critical patent/FI971881A/fi
Publication of FI971881A0 publication Critical patent/FI971881A0/fi
Priority to AU70481/98A priority patent/AU7048198A/en
Priority to PCT/FI1998/000374 priority patent/WO1998051137A1/en
Publication of FI971881A publication Critical patent/FI971881A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI971881A 1997-05-02 1997-05-02 Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti FI971881A (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI971881A FI971881A (fi) 1997-05-02 1997-05-02 Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti
AU70481/98A AU7048198A (en) 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element
PCT/FI1998/000374 WO1998051137A1 (en) 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI971881A FI971881A (fi) 1997-05-02 1997-05-02 Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti

Publications (2)

Publication Number Publication Date
FI971881A0 FI971881A0 (fi) 1997-05-02
FI971881A true FI971881A (fi) 1998-11-03

Family

ID=8548777

Family Applications (1)

Application Number Title Priority Date Filing Date
FI971881A FI971881A (fi) 1997-05-02 1997-05-02 Menetelmä jäähdytyselementin asentamiseksi ja jäähdytyselementti

Country Status (3)

Country Link
AU (1) AU7048198A (fi)
FI (1) FI971881A (fi)
WO (1) WO1998051137A1 (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246577A1 (de) * 2002-10-05 2004-04-15 Hella Kg Hueck & Co. Leiterplatte mit Metallgehäuse
US8804337B2 (en) * 2012-03-26 2014-08-12 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices

Also Published As

Publication number Publication date
WO1998051137A1 (en) 1998-11-12
AU7048198A (en) 1998-11-27
FI971881A0 (fi) 1997-05-02

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