WO1998051137A1 - Method for mounting a cooling element on an apparatus and such a cooling element - Google Patents

Method for mounting a cooling element on an apparatus and such a cooling element Download PDF

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Publication number
WO1998051137A1
WO1998051137A1 PCT/FI1998/000374 FI9800374W WO9851137A1 WO 1998051137 A1 WO1998051137 A1 WO 1998051137A1 FI 9800374 W FI9800374 W FI 9800374W WO 9851137 A1 WO9851137 A1 WO 9851137A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling element
printed circuit
circuit board
cooling
mounting
Prior art date
Application number
PCT/FI1998/000374
Other languages
French (fr)
Inventor
Gösta BAARMAN
Tapio Tuomainen
Seppo Pelkonen
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Priority to AU70481/98A priority Critical patent/AU7048198A/en
Publication of WO1998051137A1 publication Critical patent/WO1998051137A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the invention relates to a method according to the preamble of claim 1 for mounting a cooling element.
  • the invention also relates to a cooling element according to the preamble of claim 5.
  • the invention eliminates the disadvantages of known arrangements.
  • the method according to the invention for mounting a cooling element is characterized by what is expressed in the characterizing part of claim 1.
  • the cooling element according to the invention is characterized by what is expressed in the characterizing part of claim 5.
  • Preferred embodiments of the invention are described in the dependent claims.
  • the cooling element in itself is made a component that can be attached to a substrate, particularly a printed circuit board, together with other components, particularly electronic components, placed on the printed circuit board. It is required of the substrate that at least one layer structure in it is comprised of a material that has good thermal conductivity. One or more cooling elements are then attached to the thermally conductive layer of the substrate.
  • the cooling element according to the invention is preferably realized in the form of a surface-mounted component which is attached on the substrate, such as a printed circuit board, using the surface mounting technique.
  • the attachment part of the cooling element is preferably identical in its construction with the attachment parts of electronic components. This way it can be handled in the mounting phase as a simple component which in its mechanical construction partly corresponds to small electronic components such as resistors, capacitors, semiconductors or integrated circuits, for example.
  • the cooling element can be packaged e.g. individually in a tape package used in the surface mounting technique so that it can be directly inserted onto a printed circuit board by an automatic insertion machine.
  • the cooling element according to the invention and its substrate can be implemented such that the cooling element can be attached to the substrate using surface mounting and furthermore preferably such that the attachment to the substrate, such as a printed circuit board, is carried out at the same time that other electronic components are mounted on it.
  • the cooling element together with its substrate, such as a printed circuit board, constitutes a construction that conducts heat well.
  • the cooling element in itself is preferably realized such that its jacket is tubular, allowing air, which serves as a cooling medium, to move around the jacket so that the cooling element effectively absorbs heat from the substrate through the attachment part.
  • cooling element can be realized as a component manufactured automatically.
  • the cooling element can easily be manufactured from a sheet or tape preform, such as metal tape, in simple phases. The manufacturing costs of the cooling element will then be small compared to e.g. cast or machined cooling elements.
  • the cooling element according to the invention is preferably small in size and fits in spaces between components mounted on a printed circuit board, for example. Then the distance traveled by heat in the printed circuit board is short and the cooling power of the cooling element with respect to its size is relatively high.
  • cooling element by means of the cooling element according to the invention it is possible to remove heat from locations of a printed circuit board or other such substrate that expose a metal or plastic layer or other surface which has good thermal conductivity and essentially belongs to said substrate. It is further an advantage of the invention that such a cooling arrangement allows electronic components on the printed circuit board to have power losses greater than before.
  • Fig. 1 is a frontal view of a cooling element according to the invention
  • Fig. 2 is a side view of the cooling element according to Fig. 1;
  • Fig. 3a shows a solder pad pattern arranged on a printed circuit board for the cooling element according to Figs. 1 and 2;
  • FFiigg-. 33bb is a cross-section A-A of Fig. 3a at a solder pad;
  • Fig. 4 is a perspective of a cooling element mounted on a printed circuit board
  • Fig. 5 shows a printed circuit board onto which cooling elements according to the invention have been mounted among other things; and Fig. 6 illustrates a possible tape-like preform for manufacturing cooling elements.
  • Figs. 1 and 2 show a cooling element 1 according to the invention.
  • the cooling element 1 comprises a cooling jacket 2 and connector part 3.
  • the cooling jacket 2 is preferably a tubular part enveloping a cavity 2a.
  • the jacket 2 is connected with the connector part 3.
  • the cavity 2a formed by the tubular jacket 1 is open at its both ends so that air cooling the jacket can easily pass through the cavity 2a.
  • the connector part 3 of the cooling element 1 comprises at least one leg part 3a, 3b.
  • the leg parts 3a, 3b are bent in the shape of L preferably in the longitudinal direction B-B of the cooling jacket 2.
  • leg parts 3a, 3b serving as connector parts 3 are arranged as leg pairs 3a 1 , 3b 1; 3a2, 3b ⁇ ; 3a-*, 3b- preferably in the longitudinal direction B-B of the cooling jacket 2. Additionally, both legs of a leg pair, say, 3a *, 3a2, 3a- are in this embodiment divided into two segments such as 3a 1, 3al2; 3a21, 3a ⁇ 2; 3a- 1, 3a- 2.
  • leg part 3a, 3b The above is just an example of the realization of the leg part 3a, 3b. It is obvious that the leg parts 3 a, 3 b in the connector parts 3 can be realized in many different ways.
  • the cooling element 1 is connected to a substrate for electronic components, especially to a printed circuit board, by its connector part 3.
  • the substrate shall comprise a structure that conducts heat well.
  • the connector part 3 of the cooling element 1 has a coupling surface 4.
  • the cooling element 1 is attached by the connector part 3 and particularly by its coupling surface 4 to a substrate. Through the coupling surface 4 heat is easily transferred from the substrate to the connector part 3 and further to the cooling jacket 2.
  • the coupling surface 4 of the connector part 3 is comprised of outwardly oriented free bottom or outer surfaces 4a, 4b in the leg parts 3a, 3b.
  • the cooling element according to the invention is attached to its substrate using preferably surface mounting.
  • the cooling element is then made a surface-mountable component.
  • Figs. 3 and 4 illustrate the use of surface mounting technique in the attachment of the cooling element according to the invention to a substrate.
  • the substrate be a printed circuit board 5 onto which electronic components requiring cooling are mounted.
  • the printed circuit board includes material layers 5a, 5b, 5c. Of these layers at least one is a layer 5b that has good thermal conductivity.
  • Onto the printed circuit board 5 it is mounted cooling elements 1 according to the invention.
  • a mounting area 6 is arranged on the printed circuit board.
  • the shape of the mounting area 6 corresponds to the shape of the coupling surface 4 of the connector part 3 of the cooling element 1.
  • the mounting area 6 includes a set of separate sub-areas, i.e.
  • solder pad patterns 6a, 6b, 6c, 6d, 6e, 6f the shape of which in this case corresponds to the shape of the coupling surfaces 4a, 4b of the cooling element's leg parts 3a, 3b.
  • the mounting area 6; 6a, 6b, 6c, 6d, 6e, 6f of the printed circuit board is in direct contact with the thermally conductive layer 5b of the printed circuit board 5.
  • the topmost layer 5 a of the printed circuit board has a hole in the mounting area extending through to the layer 5b which has good thermal conductivity.
  • a cooling element 1 is attached by its coupling surface 4; 4a, 4b.
  • Fig. 4 shows a cooling element 1 attached to a printed circuit board 5.
  • One or more cooling elements 1 can be mounted on a printed circuit board in connection with the mounting of other electronic components mounted on the printed circuit board.
  • Fig. 5 illustrates a printed circuit board 7 equipped with cooling elements 10.
  • At least one layer of the printed circuit board 7 is formed of a material that has good thermal conductivity. It includes e.g. two insulating layers 7a, 7c and a copper layer 7b between them. All these layers 7a, 7b, 7c can have good thermal conductivity but in particular the copper layer 7b.
  • the printed circuit board includes heat-generating components 8, 9 and cooling elements 10 around said components.
  • the solder patterns connecting the components 8, 9 are arranged e.g. on the outer surfaces of the insulating layers 7a, 7c.
  • the printed circuit board 7 has, particularly in connection with the insulating layer 7a, in the mounting area of each cooling element a solder pad pattern such as the one shown in Fig. 3, for instance. Said mounting area is in direct contact with the copper layer 7b of the printed circuit board 7, e.g. in the manner described in conjunction with Figs. 3a and 3b.
  • the cooling element according to the invention is advantageously manufactured from a tape-like material such as metal tape, say, copper or aluminum tape.
  • a tape-like material such as metal tape, say, copper or aluminum tape.
  • the tape 11 is run through a workstation wherein holes 12 are made in it (cf. connector parts 3) and it is cut along cutting lines 13 into cooling element preforms 14; 14a, 14b.
  • the preforms 14 are bent in a predetermined manner into the form of the cooling element 1 so that the cooling jacket 2 and connector parts 3 obtain their individual forms such as depicted in Fig. 1, for example.
  • Completed cooling elements are packaged individually into a tape package used in surface mounting, for example.
  • the cooling element tape package can be directly used at an automatic insertion machine with which the cooling elements can be inserted on a printed circuit board to predetermined locations, i.e. mounting areas, at the same time that other printed circuit board components, such as components 8, 9 in Fig. 5, are inserted on the printed circuit board.
  • so-called tin paste is spread in a known manner on the mounting area of the cooling element on the printed circuit board, the cooling element is mounted and the printed circuit board is soldered in the normal manner, and the cooling element is ready for operation after the printed circuit board has cooled down.
  • the dimensions of the cooling element 1 are advantageously about the same as those of electronic components. Then the measures of the cooling element may be e.g. 10 x 10 x 10 mm (width x height x length).
  • Thermal losses of the components 8, 9 (cf. Fig. 5) on the printed circuit board are conducted via the legs of the components to the printed circuit board where heat spreads towards cooler parts of the printed circuit board.
  • Cooling elements on the printed circuit board absorb heat from the printed circuit board because their temperature is lower than that of the printed circuit board: the air flowing through the cavities of the cooling elements makes the elements cooler than the printed circuit board.
  • Use of cooling elements makes it possible that electronic components inserted on a printed circuit board can have relatively high dissipation rates compared to a situation where the printed circuit board has no cooling elements at all.
  • the invention is not limited in its application to the embodiments described above but many modifications are possible within the scope of the inventional idea defined by the claims set forth below.

Abstract

The invention pertains to a method for coupling a cooling element to an apparatus or its part including electronic components to be cooled. The cooling element (1) according to the invention is preferably surface mounted to a thermally conductive printed circuit board (5). The invention also pertains to a cooling element comprising a cooling jacket (2) and connector part (3; 3a, 3b). The cooling element (1) is surface mountable by its connector part (3; 3a, 3b) to a printed circuit board (5).

Description

METHOD FOR MOUNTING A COOLING ELEMENT ON AN APPARATUS AND SUCH A COOLING ELEMENT
The invention relates to a method according to the preamble of claim 1 for mounting a cooling element.
The invention also relates to a cooling element according to the preamble of claim 5.
From the prior art it is known a cooling arrangement for an apparatus comprising electronic components wherein a cooling element is mounted in conjunction with a component to be cooled.
Known cooling arrangements and elements have the disadvantage that they do not allow the utilization of the thermal transfer characteristics of new printed circuit board structures. There are now commercially available printed circuit boards wherein heat conduction is good in the direction of the surface of the board. Another disadvantage of known cooling arrangements is that prior-art cooling elements are mounted after the mounting of components. Thus it is needed one separate manufacturing stage to implement the cooling arrangement.
It is an object of the invention to provide a new method for mounting a cooling element and a new cooling element. The invention eliminates the disadvantages of known arrangements.
The method according to the invention for mounting a cooling element is characterized by what is expressed in the characterizing part of claim 1. The cooling element according to the invention is characterized by what is expressed in the characterizing part of claim 5. Preferred embodiments of the invention are described in the dependent claims.
The basic idea of the invention is that the cooling element in itself is made a component that can be attached to a substrate, particularly a printed circuit board, together with other components, particularly electronic components, placed on the printed circuit board. It is required of the substrate that at least one layer structure in it is comprised of a material that has good thermal conductivity. One or more cooling elements are then attached to the thermally conductive layer of the substrate. The cooling element according to the invention is preferably realized in the form of a surface-mounted component which is attached on the substrate, such as a printed circuit board, using the surface mounting technique. It is an advantage of the invention that the attachment part of the cooling element is preferably identical in its construction with the attachment parts of electronic components. This way it can be handled in the mounting phase as a simple component which in its mechanical construction partly corresponds to small electronic components such as resistors, capacitors, semiconductors or integrated circuits, for example.
It is another advantage of the invention that the cooling element can be packaged e.g. individually in a tape package used in the surface mounting technique so that it can be directly inserted onto a printed circuit board by an automatic insertion machine. The cooling element according to the invention and its substrate can be implemented such that the cooling element can be attached to the substrate using surface mounting and furthermore preferably such that the attachment to the substrate, such as a printed circuit board, is carried out at the same time that other electronic components are mounted on it.
It is an advantage of the invention that together with its substrate, such as a printed circuit board, the cooling element constitutes a construction that conducts heat well. The cooling element in itself is preferably realized such that its jacket is tubular, allowing air, which serves as a cooling medium, to move around the jacket so that the cooling element effectively absorbs heat from the substrate through the attachment part.
It is a further advantage of the cooling element according to the invention that it can be realized as a component manufactured automatically. The cooling element can easily be manufactured from a sheet or tape preform, such as metal tape, in simple phases. The manufacturing costs of the cooling element will then be small compared to e.g. cast or machined cooling elements.
It is yet an advantage of the cooling element according to the invention that it is preferably small in size and fits in spaces between components mounted on a printed circuit board, for example. Then the distance traveled by heat in the printed circuit board is short and the cooling power of the cooling element with respect to its size is relatively high.
It is also an advantage of the invention that by means of the cooling element according to the invention it is possible to remove heat from locations of a printed circuit board or other such substrate that expose a metal or plastic layer or other surface which has good thermal conductivity and essentially belongs to said substrate. It is further an advantage of the invention that such a cooling arrangement allows electronic components on the printed circuit board to have power losses greater than before.
The invention will now be described in more detail with reference to the ac- companying drawing wherein
Fig. 1 is a frontal view of a cooling element according to the invention;
Fig. 2 is a side view of the cooling element according to Fig. 1;
Fig. 3a shows a solder pad pattern arranged on a printed circuit board for the cooling element according to Figs. 1 and 2; and
FFiigg-. 33bb is a cross-section A-A of Fig. 3a at a solder pad;
Fig. 4 is a perspective of a cooling element mounted on a printed circuit board;
Fig. 5 shows a printed circuit board onto which cooling elements according to the invention have been mounted among other things; and Fig. 6 illustrates a possible tape-like preform for manufacturing cooling elements.
Figs. 1 and 2 show a cooling element 1 according to the invention. The cooling element 1 comprises a cooling jacket 2 and connector part 3. The cooling jacket 2 is preferably a tubular part enveloping a cavity 2a. The jacket 2 is connected with the connector part 3. The cavity 2a formed by the tubular jacket 1 is open at its both ends so that air cooling the jacket can easily pass through the cavity 2a.
The connector part 3 of the cooling element 1 comprises at least one leg part 3a, 3b. In this embodiment there are two leg parts 3a, 3b. The leg parts 3a, 3b are bent in the shape of L preferably in the longitudinal direction B-B of the cooling jacket 2.
The leg parts 3a, 3b serving as connector parts 3 are arranged as leg pairs 3a1, 3b 1; 3a2, 3b^; 3a-*, 3b- preferably in the longitudinal direction B-B of the cooling jacket 2. Additionally, both legs of a leg pair, say, 3a *, 3a2, 3a- are in this embodiment divided into two segments such as 3a 1, 3al2; 3a21, 3a^2; 3a- 1, 3a- 2.
The above is just an example of the realization of the leg part 3a, 3b. It is obvious that the leg parts 3 a, 3 b in the connector parts 3 can be realized in many different ways.
The cooling element 1 according to the invention is connected to a substrate for electronic components, especially to a printed circuit board, by its connector part 3. The substrate shall comprise a structure that conducts heat well. The connector part 3 of the cooling element 1 has a coupling surface 4. The cooling element 1 is attached by the connector part 3 and particularly by its coupling surface 4 to a substrate. Through the coupling surface 4 heat is easily transferred from the substrate to the connector part 3 and further to the cooling jacket 2. In the embodi- ment described, the coupling surface 4 of the connector part 3 is comprised of outwardly oriented free bottom or outer surfaces 4a, 4b in the leg parts 3a, 3b.
The cooling element according to the invention is attached to its substrate using preferably surface mounting. The cooling element is then made a surface-mountable component.
Figs. 3 and 4 illustrate the use of surface mounting technique in the attachment of the cooling element according to the invention to a substrate. Let the substrate be a printed circuit board 5 onto which electronic components requiring cooling are mounted. The printed circuit board includes material layers 5a, 5b, 5c. Of these layers at least one is a layer 5b that has good thermal conductivity. Onto the printed circuit board 5 it is mounted cooling elements 1 according to the invention. For each cooling element 1 required a mounting area 6 is arranged on the printed circuit board. The shape of the mounting area 6 corresponds to the shape of the coupling surface 4 of the connector part 3 of the cooling element 1. In this embodiment the mounting area 6 includes a set of separate sub-areas, i.e. solder pad patterns 6a, 6b, 6c, 6d, 6e, 6f the shape of which in this case corresponds to the shape of the coupling surfaces 4a, 4b of the cooling element's leg parts 3a, 3b. The mounting area 6; 6a, 6b, 6c, 6d, 6e, 6f of the printed circuit board is in direct contact with the thermally conductive layer 5b of the printed circuit board 5. In this case, the topmost layer 5 a of the printed circuit board has a hole in the mounting area extending through to the layer 5b which has good thermal conductivity. To this mounting area 6 a cooling element 1 is attached by its coupling surface 4; 4a, 4b. Fig. 4 shows a cooling element 1 attached to a printed circuit board 5. One or more cooling elements 1 can be mounted on a printed circuit board in connection with the mounting of other electronic components mounted on the printed circuit board.
Fig. 5 illustrates a printed circuit board 7 equipped with cooling elements 10. At least one layer of the printed circuit board 7 is formed of a material that has good thermal conductivity. It includes e.g. two insulating layers 7a, 7c and a copper layer 7b between them. All these layers 7a, 7b, 7c can have good thermal conductivity but in particular the copper layer 7b. The printed circuit board includes heat-generating components 8, 9 and cooling elements 10 around said components. The solder patterns connecting the components 8, 9 are arranged e.g. on the outer surfaces of the insulating layers 7a, 7c. The printed circuit board 7 has, particularly in connection with the insulating layer 7a, in the mounting area of each cooling element a solder pad pattern such as the one shown in Fig. 3, for instance. Said mounting area is in direct contact with the copper layer 7b of the printed circuit board 7, e.g. in the manner described in conjunction with Figs. 3a and 3b.
The cooling element according to the invention is advantageously manufactured from a tape-like material such as metal tape, say, copper or aluminum tape. As illustrated in Fig. 6, the tape 11 is run through a workstation wherein holes 12 are made in it (cf. connector parts 3) and it is cut along cutting lines 13 into cooling element preforms 14; 14a, 14b. After that, the preforms 14 are bent in a predetermined manner into the form of the cooling element 1 so that the cooling jacket 2 and connector parts 3 obtain their individual forms such as depicted in Fig. 1, for example. Completed cooling elements are packaged individually into a tape package used in surface mounting, for example. After that, the cooling element tape package can be directly used at an automatic insertion machine with which the cooling elements can be inserted on a printed circuit board to predetermined locations, i.e. mounting areas, at the same time that other printed circuit board components, such as components 8, 9 in Fig. 5, are inserted on the printed circuit board. In the insertion phase, so-called tin paste is spread in a known manner on the mounting area of the cooling element on the printed circuit board, the cooling element is mounted and the printed circuit board is soldered in the normal manner, and the cooling element is ready for operation after the printed circuit board has cooled down.
The dimensions of the cooling element 1 are advantageously about the same as those of electronic components. Then the measures of the cooling element may be e.g. 10 x 10 x 10 mm (width x height x length).
Thermal losses of the components 8, 9 (cf. Fig. 5) on the printed circuit board are conducted via the legs of the components to the printed circuit board where heat spreads towards cooler parts of the printed circuit board. Cooling elements on the printed circuit board absorb heat from the printed circuit board because their temperature is lower than that of the printed circuit board: the air flowing through the cavities of the cooling elements makes the elements cooler than the printed circuit board. Use of cooling elements makes it possible that electronic components inserted on a printed circuit board can have relatively high dissipation rates compared to a situation where the printed circuit board has no cooling elements at all. The invention is not limited in its application to the embodiments described above but many modifications are possible within the scope of the inventional idea defined by the claims set forth below.

Claims

Claims
1. A method for mounting a cooling element on an apparatus or its part which includes electronic components to be cooled and in which the cooling element (1; 10) is coupled to a thermally conductive structure (5b; 7b) of a substrate for electronic components, specifically a printed circuit board (5; 7), characterized in that a mounting area (6) for a cooling element (1) is formed on the substrate, specifically a printed circuit board (5; 7), which has a thermally conductive layer, such that the shape of said mounting area corresponds to the shape of the coupling surface (4; 4a, 4b) of the connector part (3; 3a, 3b) of the cooling element (1), and said mounting area (6) is in direct contact with the thermally conductive layer (7c) of the printed circuit board, and the cooling element (1) is attached to said mounting area (6) by its coupling surface (4; 4a, 4b) using surface mounting technique.
2. The method of claim 1, characterized in that one or more cooling elements (1; 10) are mounted on a printed circuit board (7) in connection with the mounting of other electronic components (8, 9).
3. A cooling element (1) for an apparatus including electronic components to be cooled, specifically for cooling electronic components, comprising a cooling jacket (2) and a connector part (3; 3a, 3b) in connection with the jacket (2), through which connector part (3; 3a, 3b) the cooling element (1) can be coupled to a thermally conductive substrate, specifically a printed circuit board (5; 7), characterized in that the coupling surface (4; 4a, 4b) of the connector part (3; 3a, 3b) of the cooling element (1; 10) is shaped such that it corresponds to a pattern (6a, 6b, 6c, 6d, 6e, 6f) arranged on a mounting area (6) of a printed circuit board (5) or similar substrate, the mounting area (6) being in direct contact with a thermally conductive layer (5b) of the printed circuit board (5), and the cooling element (1; 10) being surface mountable by its connector part (3; 3a, 3b) to the mounting area (6).
4. The cooling element of claim 3, characterized in that the cooling jacket (2) is tubular in form and has a cavity (2a) running through it to allow cooling air to flow in it.
5. The cooling element of claim 3 or 4, characterized in that the cooling element (1) is formed of one element preform (12).
6. The cooling element of any one of the preceding claims 3, 4 or 5, characterized in that the dimensions of the cooling element (1) are in the order of magnitude of 10 x 10 x 10 mm (width x height x length).
PCT/FI1998/000374 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element WO1998051137A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU70481/98A AU7048198A (en) 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI971881A FI971881A (en) 1997-05-02 1997-05-02 Method of installing the heat sink and the heat sink
FI971881 1997-05-02

Publications (1)

Publication Number Publication Date
WO1998051137A1 true WO1998051137A1 (en) 1998-11-12

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Country Status (3)

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AU (1) AU7048198A (en)
FI (1) FI971881A (en)
WO (1) WO1998051137A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246577A1 (en) * 2002-10-05 2004-04-15 Hella Kg Hueck & Co. Circuit board with metal housing, e.g. for motor vehicle control circuit, has spring member for making contact between circuit board or power semiconductor device and metal housing for heat removal
EP2645838A3 (en) * 2012-03-26 2016-09-14 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246577A1 (en) * 2002-10-05 2004-04-15 Hella Kg Hueck & Co. Circuit board with metal housing, e.g. for motor vehicle control circuit, has spring member for making contact between circuit board or power semiconductor device and metal housing for heat removal
EP2645838A3 (en) * 2012-03-26 2016-09-14 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

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FI971881A (en) 1998-11-03
FI971881A0 (en) 1997-05-02
AU7048198A (en) 1998-11-27

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