KR960039079U - 방열판 - Google Patents

방열판

Info

Publication number
KR960039079U
KR960039079U KR2019950011936U KR19950011936U KR960039079U KR 960039079 U KR960039079 U KR 960039079U KR 2019950011936 U KR2019950011936 U KR 2019950011936U KR 19950011936 U KR19950011936 U KR 19950011936U KR 960039079 U KR960039079 U KR 960039079U
Authority
KR
South Korea
Prior art keywords
heat sink
sink
heat
Prior art date
Application number
KR2019950011936U
Other languages
English (en)
Other versions
KR0126270Y1 (ko
Inventor
박철
Original Assignee
진도산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 진도산업주식회사 filed Critical 진도산업주식회사
Priority to KR2019950011936U priority Critical patent/KR0126270Y1/ko
Publication of KR960039079U publication Critical patent/KR960039079U/ko
Application granted granted Critical
Publication of KR0126270Y1 publication Critical patent/KR0126270Y1/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the PCB
KR2019950011936U 1995-05-30 1995-05-30 방열판 KR0126270Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950011936U KR0126270Y1 (ko) 1995-05-30 1995-05-30 방열판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950011936U KR0126270Y1 (ko) 1995-05-30 1995-05-30 방열판

Publications (2)

Publication Number Publication Date
KR960039079U true KR960039079U (ko) 1996-12-18
KR0126270Y1 KR0126270Y1 (ko) 1998-12-15

Family

ID=19414465

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950011936U KR0126270Y1 (ko) 1995-05-30 1995-05-30 방열판

Country Status (1)

Country Link
KR (1) KR0126270Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455562B1 (ko) * 2002-06-26 2004-11-06 히트텍(주) 전자 부품 소자 냉각용 방열핀

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455562B1 (ko) * 2002-06-26 2004-11-06 히트텍(주) 전자 부품 소자 냉각용 방열핀

Also Published As

Publication number Publication date
KR0126270Y1 (ko) 1998-12-15

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