FI933128A - Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille - Google Patents

Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille Download PDF

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Publication number
FI933128A
FI933128A FI933128A FI933128A FI933128A FI 933128 A FI933128 A FI 933128A FI 933128 A FI933128 A FI 933128A FI 933128 A FI933128 A FI 933128A FI 933128 A FI933128 A FI 933128A
Authority
FI
Finland
Prior art keywords
semiconductor wafers
forming contact
contact bumps
chemically forming
chemically
Prior art date
Application number
FI933128A
Other languages
English (en)
Swedish (sv)
Other versions
FI98667B (fi
FI933128A0 (fi
FI98667C (fi
Inventor
Ahti Aintila
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Priority to FI933128A priority Critical patent/FI98667C/fi
Publication of FI933128A0 publication Critical patent/FI933128A0/fi
Priority to DE4494863T priority patent/DE4494863T1/de
Priority to PCT/FI1994/000313 priority patent/WO1995002257A1/en
Priority to US08/578,691 priority patent/US5804456A/en
Publication of FI933128A publication Critical patent/FI933128A/fi
Publication of FI98667B publication Critical patent/FI98667B/fi
Application granted granted Critical
Publication of FI98667C publication Critical patent/FI98667C/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
FI933128A 1993-07-08 1993-07-08 Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille FI98667C (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI933128A FI98667C (fi) 1993-07-08 1993-07-08 Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille
DE4494863T DE4494863T1 (de) 1993-07-08 1994-07-06 Verfahren und Vorrichtung zum chemischen Erzeugen von Anschlußerhebungen auf Halbleiterscheiben
PCT/FI1994/000313 WO1995002257A1 (en) 1993-07-08 1994-07-06 Method and apparatus for chemically generating terminal bumps on semiconductor wafers
US08/578,691 US5804456A (en) 1993-07-08 1994-07-06 Method and apparatus for chemically generating terminal bumps on semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI933128A FI98667C (fi) 1993-07-08 1993-07-08 Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille

Publications (4)

Publication Number Publication Date
FI933128A0 FI933128A0 (fi) 1993-07-08
FI933128A true FI933128A (fi) 1995-01-09
FI98667B FI98667B (fi) 1997-04-15
FI98667C FI98667C (fi) 1997-07-25

Family

ID=8538297

Family Applications (1)

Application Number Title Priority Date Filing Date
FI933128A FI98667C (fi) 1993-07-08 1993-07-08 Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille

Country Status (4)

Country Link
US (1) US5804456A (fi)
DE (1) DE4494863T1 (fi)
FI (1) FI98667C (fi)
WO (1) WO1995002257A1 (fi)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
US6955747B2 (en) * 2002-09-23 2005-10-18 International Business Machines Corporation Cam driven paddle assembly for a plating cell
US7654221B2 (en) * 2003-10-06 2010-02-02 Applied Materials, Inc. Apparatus for electroless deposition of metals onto semiconductor substrates
US7827930B2 (en) 2004-01-26 2010-11-09 Applied Materials, Inc. Apparatus for electroless deposition of metals onto semiconductor substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1052646A (fi) *
US3934054A (en) * 1969-08-25 1976-01-20 Electro Chemical Engineering Gmbh Electroless metal plating
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath
US4205099A (en) * 1978-04-14 1980-05-27 Sprague Electric Company Method for making terminal bumps on semiconductor wafers
US4262044A (en) * 1980-05-16 1981-04-14 Kuczma Jr John J Method for the electroless nickel plating of long bodies
US4622917A (en) * 1982-09-27 1986-11-18 Etd Technology, Inc. Apparatus and method for electroless plating
US5077099B1 (en) * 1990-03-14 1997-12-02 Macdermid Inc Electroless copper plating process and apparatus
US5198089A (en) * 1991-10-29 1993-03-30 National Semiconductor Corporation Plating tank
JPH07211669A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd めっき装置及びめっき方法

Also Published As

Publication number Publication date
FI98667B (fi) 1997-04-15
WO1995002257A1 (en) 1995-01-19
DE4494863T1 (de) 1996-08-22
FI933128A0 (fi) 1993-07-08
US5804456A (en) 1998-09-08
FI98667C (fi) 1997-07-25

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