FI903182A0 - ELECTRIC LED STRUCTURE. - Google Patents

ELECTRIC LED STRUCTURE.

Info

Publication number
FI903182A0
FI903182A0 FI903182A FI903182A FI903182A0 FI 903182 A0 FI903182 A0 FI 903182A0 FI 903182 A FI903182 A FI 903182A FI 903182 A FI903182 A FI 903182A FI 903182 A0 FI903182 A0 FI 903182A0
Authority
FI
Finland
Prior art keywords
led structure
electric led
electric
led
Prior art date
Application number
FI903182A
Other languages
Finnish (fi)
Inventor
Henning Giesecke
Horst Dieter Wilde
Armin Bonack
Original Assignee
Bayer Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Ag filed Critical Bayer Ag
Publication of FI903182A0 publication Critical patent/FI903182A0/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
FI903182A 1988-10-27 1990-06-25 ELECTRIC LED STRUCTURE. FI903182A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3836605 1988-10-27
DE3932017A DE3932017A1 (en) 1988-10-27 1989-09-26 ELECTRICALLY LEADING STRUCTURES
PCT/EP1989/001268 WO1990004913A1 (en) 1988-10-27 1989-10-24 Electrically conductive structures

Publications (1)

Publication Number Publication Date
FI903182A0 true FI903182A0 (en) 1990-06-25

Family

ID=25873666

Family Applications (1)

Application Number Title Priority Date Filing Date
FI903182A FI903182A0 (en) 1988-10-27 1990-06-25 ELECTRIC LED STRUCTURE.

Country Status (5)

Country Link
EP (1) EP0404891B1 (en)
JP (1) JPH03504060A (en)
DE (2) DE3932017A1 (en)
FI (1) FI903182A0 (en)
WO (1) WO1990004913A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4235019C1 (en) * 1992-10-16 1994-04-21 Ame Gmbh Printed circuit board manufacture as well as assembly and contacting processes for components by electroless metal deposition
FR2700659B1 (en) * 1993-01-18 1995-03-24 Matra Sep Imagerie Inf Method for manufacturing multilayer circuits and circuits thus obtained.
GB2395365B8 (en) * 2002-11-13 2006-11-02 Peter Leslie Moran Electrical circuit board
DE10317793B4 (en) * 2003-04-16 2007-02-22 AHC-Oberflächentechnik GmbH & Co. OHG Use of an article as an electrical or electronic component
DE10331574A1 (en) * 2003-07-11 2005-02-17 eupec Europäische Gesellschaft für Leistungshalbleiter mbH The power semiconductor module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486755A1 (en) * 1980-07-11 1982-01-15 Socapex SUPPORT FOR ELECTRONIC COMPONENTS FOR HIGH-DIMENSIONAL HYBRID CIRCUITS
DE3138987C2 (en) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Device for preventing damage to components or conductor tracks on a circuit board
DE3733002A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Electroconductive pattern metallised additively
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
US4728751A (en) * 1986-10-06 1988-03-01 International Business Machines Corporation Flexible electrical connection and method of making same

Also Published As

Publication number Publication date
DE3932017A1 (en) 1990-05-03
EP0404891B1 (en) 1994-06-01
EP0404891A1 (en) 1991-01-02
JPH03504060A (en) 1991-09-05
WO1990004913A1 (en) 1990-05-03
DE58907789D1 (en) 1994-07-07

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Legal Events

Date Code Title Description
FA Application withdrawn

Owner name: BAYER AKTIENGESELLSCHAFT