FI873944A0 - Foerfarande foer framstaellning av vaermebestaendiga, pao epoxihartsbasis strukturerade skikt. - Google Patents

Foerfarande foer framstaellning av vaermebestaendiga, pao epoxihartsbasis strukturerade skikt.

Info

Publication number
FI873944A0
FI873944A0 FI873944A FI873944A FI873944A0 FI 873944 A0 FI873944 A0 FI 873944A0 FI 873944 A FI873944 A FI 873944A FI 873944 A FI873944 A FI 873944A FI 873944 A0 FI873944 A0 FI 873944A0
Authority
FI
Finland
Prior art keywords
vaermebestaigiga
strukturerade
epoxihartsbasis
skikt
pao
Prior art date
Application number
FI873944A
Other languages
English (en)
Other versions
FI873944A (fi
Inventor
Hellmut Ahne
Winfried Plundrich
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI873944A0 publication Critical patent/FI873944A0/fi
Publication of FI873944A publication Critical patent/FI873944A/fi

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
FI873944A 1986-09-11 1987-09-11 Foerfarande foer framstaellning av vaermebestaendiga, pao epoxihartsbasis strukturerade skikt. FI873944A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3630956 1986-09-11

Publications (2)

Publication Number Publication Date
FI873944A0 true FI873944A0 (fi) 1987-09-11
FI873944A FI873944A (fi) 1988-03-12

Family

ID=6309379

Family Applications (1)

Application Number Title Priority Date Filing Date
FI873944A FI873944A (fi) 1986-09-11 1987-09-11 Foerfarande foer framstaellning av vaermebestaendiga, pao epoxihartsbasis strukturerade skikt.

Country Status (6)

Country Link
US (1) US4883730A (fi)
EP (1) EP0259727A3 (fi)
JP (1) JPS6381422A (fi)
KR (1) KR880004350A (fi)
DK (1) DK471987A (fi)
FI (1) FI873944A (fi)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0259726A3 (de) * 1986-09-11 1989-05-10 Siemens Aktiengesellschaft Photopolymere auf Epoxidharzbasis
US5667934A (en) * 1990-10-09 1997-09-16 International Business Machines Corporation Thermally stable photoimaging composition
DE4033294A1 (de) * 1990-10-19 1992-04-23 Siemens Ag Verfahren zur fotolithographischen herstellung von strukturen auf einem traeger
US6048375A (en) * 1998-12-16 2000-04-11 Norton Company Coated abrasive
US6531335B1 (en) * 2000-04-28 2003-03-11 Micron Technology, Inc. Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
US6582990B2 (en) * 2001-08-24 2003-06-24 International Rectifier Corporation Wafer level underfill and interconnect process
US7473377B2 (en) * 2002-06-27 2009-01-06 Tokyo Electron Limited Plasma processing method
CN101397363B (zh) * 2008-08-19 2012-01-04 东莞市佳景印刷材料有限公司 一种水性紫外光固化环氧丙烯酸酯接枝聚氨酯及其制备方法
TWI384013B (zh) 2008-10-08 2013-02-01 Eternal Chemical Co Ltd 感光型聚醯亞胺
CN102234268B (zh) * 2011-01-04 2013-10-30 南京工业大学 一种uv固化多异氰酸酯改性超支化环氧丙烯酸酯的制备方法
CN104005478B (zh) * 2014-06-17 2017-01-18 海南红杉科创实业有限公司 一种建筑室内墙体的背水面防潮抗渗结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL101499C (fi) * 1951-08-20
US3776889A (en) * 1971-01-07 1973-12-04 Powers Chemco Inc Allyl carbamate esters of hydroxy-containing polymers
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US4055606A (en) * 1976-06-21 1977-10-25 Allied Chemical Corporation Novel copolyester-polyepoxide compositions
DE2919840A1 (de) * 1979-05-16 1980-11-20 Siemens Ag Verfahren zur phototechnischen herstellung von reliefstrukturen
DE2933827A1 (de) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung hochwaermebestaendiger reliefstrukturen und deren verwendung.
US4481258A (en) * 1982-10-07 1984-11-06 Westinghouse Electric Corp. UV Curable composition and coil coatings

Also Published As

Publication number Publication date
US4883730A (en) 1989-11-28
KR880004350A (ko) 1988-06-03
JPS6381422A (ja) 1988-04-12
DK471987A (da) 1988-03-12
DK471987D0 (da) 1987-09-10
FI873944A (fi) 1988-03-12
EP0259727A2 (de) 1988-03-16
EP0259727A3 (de) 1989-02-08

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Legal Events

Date Code Title Description
FD Application lapsed
FD Application lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT