FI3262728T3

FI3262728T3 - Method for producing a diode laser and diode laser

Info

Publication number: FI3262728T3
Application number: FIEP16706579.6T
Authority: FI
Inventors: Ralf Hülsewede; Matthias Schröder; Valentin Loyo-Maldonado
Original assignee: Jenoptik Laser Gmbh
Priority date: 2015-02-24
Filing date: 2016-02-24
Publication date: 2023-03-23
Also published as: EP3262728B1; ES2939633T3; CN107210581B; US11552453B2; DE102015002176A1; JP2018507552A; JP6764415B2; US20180138664A1; WO2016135160A1; CN107210581A; LT3262728T; EP3262728A1

Description

1 EP3 262 728

METHOD FOR PRODUCING A DIODE LASER AND DIODE LASER

Technical field

The invention relates to a method for producing a diode laser, a diode laser and the use of a metallic layer for producing a clamped connection in a diode laser.

The diode laser comprises a laser bar which is arranged between a heat-conducting body and a cover. The heat-conducting body and the cover serve as electrical contacts through which the operating current is conducted to the laser bar.

Prior art

Methods for producing a diode laser have been known for a long time, with which a laser bar is soldered on the p-side onto a heat sink and contacting takes place on the n-side via bonding wires, for example from US 5105429 A and US 4716568

A. The limited current-carrying capacity of the bonding wires is a disadvantage.

A higher current-carrying capacity of the n-side current connection can be achieved by using a solid cover, which can be designed as a second heat- conducting body. It is known from WO 2009143835 and WO 2009146683 to solder the laser bar between two heat-conducting bodies. The soldering process can lead to stresses in the laser bar which can impair the electro-optical properties. A method for producing a diode laser without involving a soldering process is known from WO 2011029846, with which a first metallic layer is used between the first contact area of the laser bar and the first heat-conducting body and a second metallic layer between the second contact area of the laser bar and the second heat-conducting body. These layers, which can consist of indium, for example, effect a material bond during clamping. The disadvantage is that very high demands have to be made on the flatness of the laser bar and on the flatness of the terminal areas of the two heat-conducting bodies and on compliance with the parallelism of the surfaces during assembly. Deviations in the um range can already lead to large-area cavities where there is no material bond. In particular, a poorly formed material bond on the p-side contact area of the laser bar can lead to overheating and even to melting loss of the laser bar. In addition, migration of material of the indium layers can occur. This can lead to failure of the laser.

2 EP3 262 728

Object of the invention

The object of the invention is to specify a method for producing a diode laser which is designed for a high operating current. During assembly and in operation, the laser bar should not experience any undesirable mechanical stresses which could impair the electro-optical properties. The method should be tolerant of unevennesses of the laser bar and/or of the contact areas of the heat-conducting body or of the cover. The p-side contact area of the laser bar (epitaxial side) facing the heat-conducting body is intended to have the best possible flatness after assembly. As a result, the lowest possible smile value is to be achieved for the laser bar. The failure probability of the diode laser should be low. In addition to the method of production, such an advantageous diode laser is specified.

Achievement of the task

The object is achieved by a method for producing a diode laser, comprising the following steps: a. Providing at least one laser bar, which on the substrate side of the laser bar has a first contact area on a first side, which is designed as at least one p contact, and has a second contact area on a second side opposite the first side, which second contact area is formed as at least one n contact, b. Providing a heat-conducting body having a first terminal area,

C. Providing a cover having a second terminal area, d. Providing a first metallic layer, wherein the first metallic layer has a uniform layer thickness, e. Providing a second metallic layer as a nubbed structure, which has a plurality of raised locations and a plurality of depressed locations in a sectional plane, wherein with respect to the raised locations the second metallic layer is made thicker than the first metallic layer, wherein the second metallic layer comprises indium, and wherein the nubbed structure has a coverage density with at least one nub per square millimeter of the area of the layer,

3 EP3 262 728 f. Arranging the laser bar between the heat-conducting body and the cover, the first contact area facing the first terminal area of the first heat-conducting body and the second contact area facing the second terminal area of the cover, and during arrangement of the laser bar, the first metal layer is arranged at least in sections between the first terminal area and the first contact area, and the second metal layer is arranged at least in sections between the second terminal area and the second contact area, g. Producing at least one force which has a component that presses the cover in the direction of the heat-conducting body, the first contact area being pressed flat against the first terminal area under the action of the force, the second metallic layer undergoing a plastic deformation at least in portions in the region of the raised locations, and h. Establishing a mechanical connection of the cover to the heat-conducting body.

This method can be used to produce a diode laser according to Claim 9, which achieves the task of the invention. In particular, a second metallic layer designed as a nubbed structure according to Claim 11 can be used to produce a clamped connection in the above-mentioned method according to the invention.

Advantages of the invention

Themethod according to the invention can advantageously be used to produce a diode laser which is designed for a high operating current. The method is tolerant of unevennesses of the laser bar and/or of the contact areas of the heat- conducting body or of the cover. The yield during production of the lasers can thus be increased. The p-contact area of the laser bar, which faces the heat-conducting body, has a particularly good flatness after assembly. As a result, the laser bar can have as low a smile value as possible, making it outstandingly suitable for beamforming. Furthermore, the problem of the migration of solder material of a p- side metallic layer can be avoided. The assembly of the laser bar is mechanically low-stress. For this reason, excellent electro-optical properties can be achieved, for example a high degree of polarization, a uniform near-field distribution of the

4 EP3 262 728 laser radiation and a high steepness of the power-flow characteristic. In addition, the p-side current input can be improved.

Description

The diode laser according to the invention is a device for emitting laser radiation which has a laser bar as beam source. In a known manner, the laser bar can be designed as edge-emitting diode laser bar and comprise one or preferably a plurality of emitters which can each be arranged offset to one another in a y direction. The laser bar can preferably have a width between 0.3 mm and 12 mm in the y direction. It can preferably have 1 to 49 emitters. The thickness of the laser bar can preferably be between 0.05 mm and 0.2 mm in a z direction. The length of the emitters of the laser bar in an x direction can preferably be between 0.5 mm and6mm. The direction of the central beams of the emitted laser radiation can be the x direction. The x, y and z directions can be at right angles to one another. The laser bar can have a known epitaxially produced layer seguence as a p-n junction with one or more guantum wells. The epitaxial layer can be considerably thinner than the substrate. The epitaxial layer can, for example, be between 3 um and um thick. The substrate can be, for example, between 50 um and 200 um thick.

The individual emitters can preferably be designed as broad stripe emitters or as a ridge waveguides or as trapezoidal lasers. A plurality of layer sequences, i.e. a 20 plurality of p-n transitions lying electrically in series, may even be present. Such bars are also referred to as nanostacks. In this case, a plurality of emitters can be stacked one above the other in the z direction.

The facets of the laser bar can be provided with mirrors, for example a highly reflective mirror layer can be attached to the rear facet of the laser element and a low-reflective mirror layer with a reflectivity of, for example, 0.1 % to 10 %, can be attached to the opposite exit-side facet, which contains the exit aperture. The mirrors can define a laser resonator that enables laser operation. However, the laser bar can also be designed as a gain element which is only provided for laser operation in interaction with an external resonator. In this case, for example, a wavelength-dependent feedback can be provided by the external resonator, which serves to determine the wavelength of the laser. Such an electro-optical gain

EP3 262 728 element is also to be understood as a laser bar within the meaning of the invention.

The laser bar is pumped by an electrical current. The operating current can be, for example, 1A to 1000A. A first contact area and a second contact area are 5 provided on the laser bar for current input. The p-side contact area is referred to as the first contact area.

The first contact area can be the anode of the diode laser bar. The n-side contact area of the laser bar is referred to as the second contact area.

The second contact area can be the cathode of the laser bar. The first and the second contact areas can each lie in an xy plane. The first contact area is arranged on the epitaxial side of the laser bar, which can be referred to as the first side, while the second contact area is arranged on the substrate side of the laser bar, which can be referred to as the second side.

During operation, the laser bar can develop waste heat which must be dissipated.

For this purpose, a heat-conducting body with a first terminal area is provided.

Since the pn junction of the diode laser can be located in the epitaxial layer (i.e. close to the first side) and the predominant part of the waste heat can arise in the pn junction, the heat-conducting body is connected to the first side of the laser bar.

The first contact area is electrically and thermally connected to the first terminal area and the second contact area is electrically connected to the second terminal area.

The method according to the invention serves to produce a diode laser. For this purpose, a laser bar is provided, which has a first contact area on a first side, which is designed as at least one p contact, and has a second contact surface on a second side opposite the first side, which is designed as at least one n contact.

The first contact area can be designed as a contact area for all emitters. However, it can also consist of a plurality of individual sub-areas which can be separated from one another, for example a sub-area for each emitter. The first contact area can for example be a metallization; the outer layer can for example be a gold layer. Preferably, a galvanically reinforced gold layer with a thickness preferably greater than 0.5 um, particularly preferably between 1 um and 10 um, can be

6 EP3 262 728 used. The second contact area can be designed as a contact area for all emitters.

However, it can also consist of a plurality of individual sub-areas, for example a sub-area for each emitter. The second contact area can for example be a metallization; the outer layer can for example be a gold layer.

A plurality of laser bars can also be provided, which can be arranged, for example, next to one another or one above the other on the heat sink.

In addition, a heat-conducting body having a first terminal area is provided. The heat-conducting body can consist, for example, at least in part of copper, aluminum or of a copper-diamond aluminum-diamond or silver-diamond composite material or comprise such a material. It can be designed, for example, as a copper body with an inlay made of a composite material. However, it can also be made entirely of copper, for example. The heat-conducting body can have a metallization, for example Ag/Au, or Ni/Au or Ti/Pt/Au, wherein the gold layer is preferably provided on the outside. The first terminal area can be designed with a particularly good flatness in order to then achieve a low smile value (the deviation of the individual emitters from a straight line). Further first terminal areas for further laser bars can also be provided.

In addition, at least one cover is provided with a second terminal area. The cover is provided for electrically contacting the n contact of the laser bar. It can, but does not have to, also be provided for heat dissipation. It can consist of an electrically highly conductive material, for example at least partially of copper, aluminum or of a copper-diamond aluminum-diamond or silver-diamond composite material or comprise such a material. It can be designed, for example, as a copper body with an inlay made of a composite material. However, it can also be made entirely of copper, for example. The cover can have a metallization, for example Ag/Au, or

Ni/Au or Ti/Pt/Au, wherein the gold layer is preferably provided on the outside.

According to the invention, a second metallic layer is provided, which in a sectional plane has a plurality of raised locations and a plurality of depressed locations.

Within the meaning of the present invention, the layer thickness of the second metallic layer can be location-dependent. A plurality of raised locations and/or a plurality of depressed locations can be present. The raised locations refer to those

7 EP3 262 728 locations of the second metallic layer which have a maximum of the layer thickness. A raised location is therefore a location that projects further beyond the surface than surrounding locations. When viewed topographically, a raised location can be formed as a dome, as a plateau or as a ridge. As depressed locations of a layer, such locations are so designated which each have a minimum of the layer thickness. When viewed topographically, a depressed location can be formed as a crater, as a trough or as a basin. The layer thickness at the depressed locations can be greater than or equal to zero. In the second case, no layer material may be present at the depressed locations, and the layer can thus have interruptions. At the raised locations, the layer thickness can be the same and have a value D. The raised locations can be formed as a topologically contiguous area or as a plurality of sub-areas. The depressed locations can be formed as a topologically contiguous area or as a plurality of sub-areas. In a sectional plane, which can be perpendicular to the layer plane, a plurality of raised and a plurality of depressed locations can be cut. The sectional plane can thus be selected such that it contains a normal of the layer plane. In such a sectional representation, a plurality of depressed locations can be visible, for example. Even if these locations can be formed as a contiguous area when viewed three-dimensionally, the sectional plane can nevertheless have the plurality of depressed locations in the sense according to the invention. The same applies to the raised locations. It should also be pointed out that a plurality of raised and a plurality of depressed locations need not be present in any arbitrary sectional plane perpendicular to the layer plane. For example, the plurality of raised and depressed locations can be visible in a cross-section, while not being visible in a longitudinal section.

In a preferred embodiment, the raised locations can be formed as strip-shaped plateaus of height D, which run, for example, in the x direction, no layer material being present between the strips. In the sense according to the invention, the second metallic layer would then have a plurality of raised and a plurality of depressed locations in an yz sectional plane (cross-section).

According to the invention, the second metallic layer, which has a plurality of raised locations and a plurality of depressed locations in a sectional plane, is provided by the second metallic layer being applied as a nubbed structure to the second contact area or to the second terminal area. In this case, the raised

8 EP3 262 728 locations can be designed as circular plateaus of height D, which can be imagined, for example, as cylindrical nubs, no layer material being present between the nubs. Such a layer can be produced, for example, by a coating process using a perforated mask. The depressed locations of the layer can then be a contiguous area when viewed three-dimensionally and topologically. This area could be regarded as a lowland area (basin). In the sense according to the invention, the second metallic layer can have a plurality of raised and a plurality of depressed locations in an yz sectional plane (cross-section). According to the invention, the nubbed structure is formed with a coverage density of at least one nub per square millimeter of layer area, particularly advantageously with at least 5 nubs per square millimeter. The distance between adjacent nubs should not be selected too large; a maximum distance of 1 mm measured from edge to edge of adjacent nubs can be advantageous. The second metallic layer can differ from conventional solder bumps in particular by the finer structure and the smaller layer thickness.

According to the invention, the laser bar is arranged between the heat-conducting body and the cover, wherein the first contact area faces the first terminal area of the first heat-conducting body and the second contact area faces the second terminal area of the cover, and the second metal layer is arranged at least in sections between the second terminal area and the second contact area,

According to the invention, at least one force is generated, which has a component which presses the cover in the direction of the heat-conducting body. This can be the z direction. Under the action of the force, the first contact area is pressed flat against the first terminal area. This can result in a clamped connection. At this contact pressure, unevennesses of the second contact area can be compensated.

In this case, the laser bar can be elastically deformed. The second metallic layer here can experience a plastic deformation at least in sections in the region of the raised locations. At these locations, the yield point of the layer material (crushing limit) can be exceeded. The second contact area can now be electrically connected to the second terminal area by means of the second metallic layer. The second metallic layer can have cavities at the depressed locations. The second metallic layer can thus have not only connected locations on which the second contact area is continuously connected to the second terminal area in the direction of the normal n, but also interrupted locations at which the second contact area is

9 EP3 262 728 not connected continuously to the second terminal area in the direction of the normal n. The layer normal n can be the normal of the second contact area, i.e. the z direction. For this reason, the connected locations and the interrupted locations can be projected onto an xy plane. In this case, the interrupted locations can advantageously have a total area which is at least 20 % of the surface area of the second contact area. In order to avoid an uneven current input into the second contact area, the interrupted locations, considered individually, should not be selected too large. In the projection onto the xy plane, for each point belonging to an interrupted location, the distance to the nearest point belonging to a connected location should be no more than 0.5 mm, advantageously no more than 0.25 mm.

Furthermore, the setting-up of a mechanical connection of the cover to the heat- conducting body is provided. Advantageously, an electrically insulating connection can be provided, so that the laser bar is not short-circuited. The connection can be effected by means of a joining agent. For example, an adhesive can be used as the joining agent. A flat bonding using a heat-conducting adhesive can be used particularly advantageously. A distance or a separating trench can be provided between the laser bar and the joining surface in order to prevent the laser bar from being wetted with adhesive. The setting-up of the mechanical connection can be accompanied by a volume shrinkage of the joining agent. The mechanical connection can be provided for generating and/or maintaining the force. As a result, the clamped connection of the laser bar between the heat-conducting body and the cover can also be maintained.

The second metallic layer can be designed as a relief. The layer thickness can be location-dependent. The topography of the layer thickness can be such that it can be represented in a single-area projection. The minimum length dimension of raised locations can be considered as a feature size. This can be, for example, the diameter of circular plateaus or the width of strip-shaped plateaus. In order to determine a minimum feature size in the general case, the contour lines of an average height between the level of the depressed locations and the raised locations can be used. The feature size can be, for example, the dome diameter at half the dome height or the ridge width at half the ridge height. The minimum feature size can advantageously be between 10 um and 1000 um. The average contour line can have a total length. In the case of a non-contiguous average

10 EP3 262 728 contour line, the total length is to be understood as the sum of the lengths of the individual segments of the average contour line. In other words, the total length of the average contour line can also be considered to be the sum of the circumferences of the sectional surfaces cut at the average contour line. The total length L of the average contour line within a specific base area A can be set in relation to this base area, for example the total area of the second metallic layer.

This ratio, i.e. the quotient L/A, can advantageously be between 1000 m/m? and 100000 m/m?. If the relief is to be roughly structured, i.e. the ratio L/A is too small, the plastic deformation of the second metallic layer can be impaired. If the relief is too finely structured, that is to say the ratio L/A is too large, it can happen that the thermal and electrical connection of the laser bar to the heat-conducting body or to the cover deteriorates over time.

The second metallic layer can consist of a soft metal, which preferably has a yield point under compressive load (crushing limit) of less than 50 MPa, particularly preferably less than 20 MPa or very particularly preferably less than 10 MPa.

According to the invention, the second metallic layer comprises indium.

The plastic deformation of the second metallic layer can take place at room temperature without heating. However, heating can also be provided, so that plastic deformation can take place at an elevated temperature. The temperature can advantageously be below the liquidus temperature and/or below the solidus temperature of the second metallic layer. As a result, melting of the second metallic layer can be prevented. It has been found that an advantageous more uniform power distribution of the laser radiation over the individual emitters of a laser bar can be achieved when the second metallic layer is not melted.

The plastic deformation of the second metallic layer can take place without volume compression. During deformation, the thickness of the second metallic layer can be reduced at least in sections at the raised locations. Excess material can be pressed in the direction of the depressed locations without the total volume of the material experiencing any noticeable change. This would not be possible in the case of a uniformly thick layer.

11 EP3 262 728

After the plastic deformation of the second metallic layer, intermetallic phases can form at the raised locations of the second metallic layer, which limit or prevent further plastic deformation. Such intermetallic phases can be effected by diffusion, for example at room temperature or at a tempering process below the respective melting temperature (solidus temperature) of the material of the second layer and of the intermetallic phases. Such a diffusion process can take place very slowly, for example it can take several minutes, hours, days, weeks or months. For example, the surface of the second terminal area and/or of the second contact area can be gold-plated. Gold can then diffuse at least partially into the second metallic layer consisting, for example, of indium. In this case, a very hard gold- indium phase can result compared to the indium, which phase can then no longer be plastically deformed. Since the formation of intermetallic phases can take a very long time, the plastic deformation according to the invention of the second metallic layer is not hindered by the action of the force.

According to the invention, a first metallic layer is also provided. During arrangement of the laser bar, the first metallic layer can be arranged at least in sections between the first terminal area and the first contact area. The first metallic layer has a uniform layer thickness. This can be advantageous, because a better flatness of the p-side of the laser bar can then be achieved. The first metallic layer can consist of a soft heavy metal such as tin, lead, indium or cadmium or comprise one such. Preference is given to using indium and/or tin, since lead and cadmium are less environmentally compatible.

The first or the second metallic layer can also project beyond the first or second contact area.

The first or the second metallic layer can be produced by coating. In manufacturing technology, coating is understood to mean a main group of manufacturing processes according to DIN 8580, which are used to apply an adherent layer of amorphous material to the surface of a workpiece. The corresponding process and the applied layer itself are also referred to as coating.

A coating can be a thin layer or a thick layer as well as a plurality of interconnected layers; the distinction is not precisely defined and is based on the coating method

12 EP3 262 728 and application. Within the meaning of the present invention, a coating with a location-dependent layer thickness is also referred to as a layer.

The second metallic layer can be produced by coating the second terminal area.

Galvanic or physical (e.g., vapor deposition, sputtering) coating methods can be used for this purpose. The coating can be carried out with a mask in order to produce the depressed and raised locations. Alternatively, a layer of uniform thickness can also be coated, and the depressed and raised locations be produced, for example, by stamping, scoring or etching. The second metallic layer can also be produced by coating the second contact area of the laser bar.

The second metallic layer can also be designed as a self-supporting layer, which can be produced, for example, by embossing a metal foil.

The second metallic layer is thicker, relative to the raised locations, than the first metallic layer. The second metallic layer can at the raised locations preferably have a thickness of 3 um to 100 um, particularly preferably between 5 um and 15 um. The first metallic layer can preferably have a uniform thickness of less than 5 um, particularly preferably less than 3 um.

The second metallic layer can be applied to the second terminal area. If provided, the first metallic layer can be applied to the first terminal area. The second metallic layer can be applied to the second contact area. If provided, the first metallic layer can be applied to the first contact area. Furthermore, further metallic layers can also be provided between the second contact area and the second terminal area.

The second metallic layer can have a volume fill level which lies preferably between 5 % and 95 % and/or particularly preferably between 10 % and 50 %.

The volume fill level is to be understood as the ratio of the material volume to the product of base area D and layer thickness D of the virgin (not yet deformed) layer. In this calculation, the layer thickness D is the layer thickness at the raised locations.

The invention further includes a diode laser according to Claim 9. The diode laser comprises at least one edge-emitting laser bar having a first contact area, which is formed as a p contact, and a second contact area which is formed as an n contact,

13 EP3 262 728 a heat-conducting body having a first terminal area, a cover having a second terminal area, a second metallic layer. The laser bar is arranged between the heat- conducting body and the cover. The second metallic layer is arranged at least in sections between the second terminal area and the second contact area. The cover is mechanically connected to the heat-conducting body. The first contact area is thermally and electrically connected to the first terminal area of the first heat-conducting body over the surface area. This means that the best possible heat dissipation of the waste heat from the laser bar to the heat-conducting body is possible via this connection and at the same time an electrical connection that is as low-resistance as possible for the supply of the operating current to the laser bar is made possible. The second contact area is electrically connected to the second terminal area by means of the second metallic layer. This means that this connection also should be designed as low-resistance as possible. The second metallic layer has connected locations at which the second contact area is continuously connected to the second terminal area in the direction of the normal n, i.e. in the z direction. In addition, the second metallic layer has interrupted locations at which the second contact area is not continuously connected to the second terminal area in the direction of the normal n. The decisive factor as to whether a point is to be assigned to the layer plane of a connected location or of an interrupted location is whether a continuous material bond is present at this point in the normal direction n or whether at least one cavity is present in the normal direction n. The layer normal n can be the normal of the second contact area, i.e. the z direction. For this reason, the connected locations and the interrupted locations can be projected onto an xy plane. The interrupted locations can advantageously have a total area which is at least 20 % of the surface area of the second contact area. In order to avoid an uneven current input into the second contact area, the interrupted locations, considered individually, should not be selected too large. In the projection onto the xy plane, for each point belonging to an interrupted location, the distance to the nearest point belonging to a connected location should be no more than 0.5 mm, advantageously no more than 0.25 mm.

Advantageously, the cover can be provided making a contribution to heat dissipation from the second contact area. The cavities in the second metallic layer, i.e. the interrupted locations, can remain free or alternatively be filled with a further

14 EP3 262 728 joining agent, for example an epoxy resin. The cavities can be filled in a further method step. If necessary, the mechanical strength of the connection can thereby be improved compared to a connection with unfilled cavities. The cover can be thermally and mechanically connected to the heat-conducting body by means of an electrically insulating joining agent.

Advantageously, the use according to the invention of a second metallic layer produced with the involvement of a coating process and which has a nubbed structure, the nubbed structure having a coverage density with at least one nub per square millimeter of the area of the layer, can be for producing a clamped connection in a diode laser, wherein the second metallic layer is arranged between a second n-side contact area of a laser bar and a second terminal area of a cover and the second metallic layer is applied to the second contact area or to the second terminal area.

The figures show the following:

Fig. 1 shows the principle of action on a first exemplary embodiment before assembly

Fig. 2 shows the principle of action on the first exemplary embodiment after assembly; Fig. 3 shows the first exemplary embodiment in a side view;

Fig. 4 shows a second exemplary embodiment

Fig. 5 shows a third exemplary embodiment

Fig. 6 shows the cover of a fourth exemplary embodiment

Fig. 7 shows the cover of a fifth exemplary embodiment

Fig. 8 shows the cover of a sixth exemplary embodiment

Fig. 9 shows the cover of a seventh exemplary embodiment

Fig. 10 shows a longitudinal section of the third exemplary embodiment

Fig. 11 shows a cross-section of the third exemplary embodiment

15 EP3 262 728

Fig. 12 shows a longitudinal section of the fifth exemplary embodiment

Fig. 13 shows a cross-section of the fifth exemplary embodiment

Fig. 14 shows a longitudinal section of an eighth exemplary embodiment

Fig. 15 shows a cross-section of the eighth exemplary embodiment

Fig. 16 shows a longitudinal section of a ninth exemplary embodiment

Fig. 17 shows a cross-section of the ninth exemplary embodiment

Fig. 18 shows a cross-section of a tenth exemplary embodiment

Fig. 19 shows a cross-section of an eleventh exemplary embodiment

Fig. 20 shows a single-area projection of the second metallic layer

It should be noted that the figures are not drawn to scale. Exaggerated representations are required to illustrate the invention.

Exemplary embodiments:

The invention is to be illustrated by means of a first exemplary embodiment in Fig. 1, Fig. 2 and Fig. 3. Fig. 1 shows in a front view the principle of action on a first exemplary embodiment before assembly of the diode laser 1. Shown is a laser bar 3 provided with a plurality of emitters 6, which has on a first side 7 a first contact area 8, which is designed as a p contact (anode), and has a second contact area 10 on a side, opposite the first side, of second side 9, which is formed as n-contact (cathode). The laser bar has thickness fluctuations and a curvature. These features are shown highly exaggerated in order to illustrate the operating principle of the invention. Furthermore, a heat-conducting body 11 provided is shown with a first terminal area 12. The first terminal area is coated with a first metallic layer 16 (shown with cross-hatching) made of indium. In addition, a provided cover 14 with a second terminal area 15 is shown. This area has a slight unevenness, which is shown exaggerated. On the second terminal area, a second metallic layer 17 made of indium (shown with cross-hatching) is applied, which has a plurality of raised locations 19 and a plurality of depressed locations 20. The second metallic

16 EP3 262 728 layer can thus be provided together with the cover. There is no layer material in the depressed locations 20. The laser bar is arranged between the heat- conducting body 11 and the cover 14, wherein the first contact area 8 faces the first terminal area 12 of the heat-conducting body and the second contact area 10 faces the second terminal area 15 of the cover and the second metallic layer 17 is arranged at least in sections between the second terminal area 15 and the second contact area 10. In this example, the second metallic layer is provided in such a way that it does not project beyond the second contact area in the y direction.

However, in one section it does project in the -x direction beyond the contact area, as can be seen from Fig. 3 described below.

Fig. 2 shows diode laser 1 during or after assembly. At least one force 24 is generated, which has a component which presses the cover 14 in the direction of the heat-conducting body 11. Under the action of the force, the first contact area 8 is pressed flat against the first terminal area 12, wherein the second metallic layer 17 undergoes a plastic deformation at least in sections in the region of the raised locations 19. The volume of the layer material remains intact, wherein excess material can be pressed into the depressed locations. As can be seen, the above- mentioned irregularities, variations in thickness and curvatures are compensated and the emitters 6 are then in a line. The laser bar can here be elastically deformed. The first metallic layer is not or is scarcely compressed, since it is designed with a uniform thickness. As can be seen, the second metallic layer 17 establishes a connection of the second contact area to the second terminal area at the raised locations in the normal direction, i.e. in the z direction. At the depressed locations there is no continuous connection of the second contact area to the second terminal area in the normal direction. Interrupted locations 23, at which there is no material bond, are present there. A continuous connection in the normal direction exists only at the connected locations 22.

Fig. 3 shows the setting-up of a mechanical connection of the cover 14 to the heat- conducting body 11 in a side view of the first exemplary embodiment. The mechanical connection is effected by means of an electrically insulating joining agent 31. The finished diode laser emits laser radiation 2 in the direction x. The position of the epitaxial layer structure 5 close to the first contact area of the laser bar is also indicated by a dotted line.

17 EP3 262 728

It should be pointed out as a precaution that the cross-hatchings in Figs. 1 to 9 are merely intended to highlight the metallic layers, they do not represent cut surfaces.

In a modification (not shown) of the first exemplary embodiment, no first metallic layer is present. The first contact area is placed directly on the first terminal area.

Fig. 4 shows the front view of a second exemplary embodiment before the assembly of the diode laser 1. The second metallic layer 17 is applied to the second side of the laser bar and is provided together with the laser bar.

Fig. 5 shows the front view of a third exemplary embodiment before assembly of the diode laser 1. The second metallic layer 17 is provided as a self-supporting layer. In this example, the depressed locations 20 have a layer thickness greater than zero.

Fig. 6 shows a plan view (underside view) of the cover 14 of a fourth exemplary embodiment with viewing direction z. The raised locations 19 of the second metallic layer are designed as strip-shaped plateaus.

Fig. 7 shows a plan view (underside view) of the cover 14 of a fifth exemplary embodiment with viewing direction z. The raised locations 19 of the second metallic layer are designed as strip-shaped plateaus.

Fig. 8 shows a plan view (underside view) of the cover 14 of a sixth exemplary embodiment having a nubbed structure with a viewing direction z. The raised locations 19 of the second metallic layer are designed as circular plateaus. In the illustration, the raised locations are highlighted by a cross-hatching. These plateaus can also be referred to as cylindrical nubs. This nubbed structure is present on a base area A 18. The depressed locations form a contiguous surface which can be imagined as a basin (lowland area), while the raised locations are individual non-contiguous plateau areas. In the topological sense, the lowland area is a multiply contiguous area.

Fig. 9 shows a plan view (underside view) of the cover 14 of a seventh exemplary embodiment with viewing direction z. The raised locations 19 of the second metallic layer are designed as circular plateaus of different sizes. The nubbed structure is present on a base area 18 and is distributed unevenly over this area.

18 EP3 262 728

As a result, an excessively high pressure on the laser bars can be avoided, for example in the edge region.

Fig. 10 shows a longitudinal section A-A of the third exemplary embodiment. The raised locations 19 are formed as strip-shaped plateaus 27 on the second terminal area 15. In this xz sectional plane (longitudinal section), a strip-shaped plateau 27 is shown In section.

Fig. 11 shows a cross-section B-B of the third exemplary embodiment. The raised locations 19 are formed as strip-shaped plateaus 27 on the second terminal area 15, while the depressed locations 20 are designed as a basin 30. The dimension of the feature size s and the layer thickness D, which is to be measured at the raised locations, is also given. In this yz sectional plane (cross-section) a plurality of raised locations 19 and a plurality of depressed locations 20 are present.

Fig. 12 shows a longitudinal section C-C of the fifth exemplary embodiment. The raised locations 19 are formed as circular plateaus 27 on the second terminal area 15. A plurality of raised locations 19 and a plurality of depressed locations 20 are present in this xy sectional plane (longitudinal section).

Fig. 13 shows a cross-section of the fifth exemplary embodiment. In this example, a plurality of raised locations 19 and a plurality of depressed locations 20 are also present in the illustrated yz sectional plane (cross-section).

Fig. 14 shows a longitudinal section of an eighth exemplary embodiment. Here, the raised locations 19 of the second metallic layer are formed as ridges 26. The position of the sectional planes AA, BB, CC and DD can correspond to those of the aforementioned third and fifth exemplary embodiments.

Fig. 15 shows a cross-section of an eighth exemplary embodiment.

Fig. 16 shows a longitudinal section of a ninth exemplary embodiment. Here, the raised locations 19 of the second metallic layer are formed as domes 25. The second metallic layer is designed here as a nubbed structure.

Fig. 17 shows a cross-section of the ninth exemplary embodiment.

19 EP3 262 728

Fig. 18 shows a cross-section of a tenth exemplary embodiment. Here, the depressed locations 20 are formed as troughs 29.

Fig. 19 shows a cross-section of an eleventh exemplary embodiment. Here, the depressed locations 20 are designed as craters 28. The craters can be rotationally symmetrical about the crest axis. The raised locations 19 form a contiguous plateau area 27, which can be multiply contiguous in the topological sense. In this case, the depressed locations are not contiguous, since each crater is surrounded on all sides by the plateau surface.

Fig. 20 shows a single-area projection of the second metallic layer 17 of a twelfth exemplary embodiment. Here, the raised locations 19 of the second metallic layer are embodied as domes 25 which are arranged in a matrix. This example is intended to illustrate the determination of the contour lines. A base area A 18 with a plurality of raised locations can be selected. This can also be the entire base area of the second metallic layer. Each individual dome has an average contour line 21, which has a certain length. The sum of all lengths of the average contour line gives a total length L. The ratio L/A can be determined from this.

In a modification (not shown) of the first to twelfth exemplary embodiments, the second metallic layer is produced by coating the second side of the laser bar. The exemplary embodiments mentioned can be combined with one another.

20 EP3 262 728

Reference signs: 1. Diode laser 2. Laser radiation 3. Laser bar 4. Substrate 5. Epitaxial layer 6. Emitter 7. First side 8. First contact area 9. Second side 10. Second contact area 11. Heat-conducting body 12. — First terminal area 13. Core 14. Cover 15. Second terminal area 16. First metallic layer 17. Second metallic layer 18. Base area 19. Raised location 20. Depressed location

21 EP3 262 728 21. Average contour line 22. Location connected in the normal direction 23. Location interrupted in the normal direction 24. Force 25. Dome 26. Ridge 27. Plateau 28. Crater 29. Trough 30. Basin 31. Joining agent

Claims

1 EP3 262 728 METHOD FOR PRODUCING A DIODE LASER AND DIODE LASER Technical field The invention relates to a method for producing a diode laser, a diode laser and the use of a metallic layer for producing a clamped connection in a diode laser. The diode laser comprises a laser bar which is arranged between a heat-conducting body and a cover. The heat-conducting body and the cover serve as electrical contacts through which the operating current is conducted to the laser bar. Prior art Methods for producing a diode laser have been known for a long time, with which a laser bar is soldered on the p-side onto a heat sink and contacting takes place on the n-side via bonding wires, for example from US 5105429 A and US 4716568

A. The limited current-carrying capacity of the bonding wires is a disadvantage. A higher current-carrying capacity of the n-side current connection can be achieved by using a solid cover, which can be designed as a second heat- conducting body. It is known from WO 2009143835 and WO 2009146683 to solder the laser bar between two heat-conducting bodies. The soldering process can lead to stresses in the laser bar which can impair the electro-optical properties. A method for producing a diode laser without involving a soldering process is known from WO 2011029846, with which a first metallic layer is used between the first contact area of the laser bar and the first heat-conducting body and a second metallic layer between the second contact area of the laser bar and the second heat-conducting body. These layers, which can consist of indium, for example, effect a material bond during clamping. The disadvantage is that very high demands have to be made on the flatness of the laser bar and on the flatness of the terminal areas of the two heat-conducting bodies and on compliance with the parallelism of the surfaces during assembly. Deviations in the um range can already lead to large-area cavities where there is no material bond. In particular, a poorly formed material bond on the p-side contact area of the laser bar can lead to overheating and even to melting loss of the laser bar. In addition, migration of material of the indium layers can occur. This can lead to failure of the laser.

2 EP3 262 728 Object of the invention The object of the invention is to specify a method for producing a diode laser which is designed for a high operating current. During assembly and in operation, the laser bar should not experience any undesirable mechanical stresses which could impair the electro-optical properties. The method should be tolerant of unevennesses of the laser bar and/or of the contact areas of the heat-conducting body or of the cover. The p-side contact area of the laser bar (epitaxial side) facing the heat-conducting body is intended to have the best possible flatness after assembly. As a result, the lowest possible smile value is to be achieved for the laser bar. The failure probability of the diode laser should be low. In addition to the method of production, such an advantageous diode laser is specified. Achievement of the task The object is achieved by a method for producing a diode laser, comprising the following steps:

a. Providing at least one laser bar, which on the substrate side of the laser bar has a first contact area on a first side, which is designed as at least one p contact, and has a second contact area on a second side opposite the first side, which second contact area is formed as at least one n contact,

b. Providing a heat-conducting body having a first terminal area,

C. Providing a cover having a second terminal area,

d. Providing a first metallic layer, wherein the first metallic layer has a uniform layer thickness,

e. Providing a second metallic layer as a nubbed structure, which has a plurality of raised locations and a plurality of depressed locations in a sectional plane, wherein with respect to the raised locations the second metallic layer is made thicker than the first metallic layer, wherein the second metallic layer comprises indium, and wherein the nubbed structure has a coverage density with at least one nub per square millimeter of the area of the layer,

3 EP3 262 728 f. Arranging the laser bar between the heat-conducting body and the cover, the first contact area facing the first terminal area of the first heat-conducting body and the second contact area facing the second terminal area of the cover, and during arrangement of the laser bar, the first metal layer is arranged at least in sections between the first terminal area and the first contact area, and the second metal layer is arranged at least in sections between the second terminal area and the second contact area,

g. Producing at least one force which has a component that presses the cover in the direction of the heat-conducting body, the first contact area being pressed flat against the first terminal area under the action of the force, the second metallic layer undergoing a plastic deformation at least in portions in the region of the raised locations, and h. Establishing a mechanical connection of the cover to the heat-conducting body. This method can be used to produce a diode laser according to Claim 9, which achieves the task of the invention. In particular, a second metallic layer designed as a nubbed structure according to Claim 11 can be used to produce a clamped connection in the above-mentioned method according to the invention. Advantages of the invention Themethod according to the invention can advantageously be used to produce a diode laser which is designed for a high operating current. The method is tolerant of unevennesses of the laser bar and/or of the contact areas of the heat- conducting body or of the cover. The yield during production of the lasers can thus be increased. The p-contact area of the laser bar, which faces the heat-conducting body, has a particularly good flatness after assembly. As a result, the laser bar can have as low a smile value as possible, making it outstandingly suitable for beamforming. Furthermore, the problem of the migration of solder material of a p- side metallic layer can be avoided. The assembly of the laser bar is mechanically low-stress. For this reason, excellent electro-optical properties can be achieved, for example a high degree of polarization, a uniform near-field distribution of the

4 EP3 262 728 laser radiation and a high steepness of the power-flow characteristic.

In addition, the p-side current input can be improved.

Description The diode laser according to the invention is a device for emitting laser radiation which has a laser bar as beam source.

In a known manner, the laser bar can be designed as edge-emitting diode laser bar and comprise one or preferably a plurality of emitters which can each be arranged offset to one another in a y direction.

The laser bar can preferably have a width between 0.3 mm and 12 mm in the y direction.

It can preferably have 1 to 49 emitters.

The thickness of the laser bar can preferably be between 0.05 mm and 0.2 mm in a z direction.

The length of the emitters of the laser bar in an x direction can preferably be between 0.5 mm and6mm.

The direction of the central beams of the emitted laser radiation can be the x direction.

The x, y and z directions can be at right angles to one another.

The laser bar can have a known epitaxially produced layer seguence as a p-n junction with one or more guantum wells.

The epitaxial layer can be considerably thinner than the substrate.

The epitaxial layer can, for example, be between 3 um and um thick.

The substrate can be, for example, between 50 um and 200 um thick.

The individual emitters can preferably be designed as broad stripe emitters or as a ridge waveguides or as trapezoidal lasers.

A plurality of layer sequences, i.e. a

20 plurality of p-n transitions lying electrically in series, may even be present.

Such bars are also referred to as nanostacks.

In this case, a plurality of emitters can be stacked one above the other in the z direction.

The facets of the laser bar can be provided with mirrors, for example a highly reflective mirror layer can be attached to the rear facet of the laser element and a low-reflective mirror layer with a reflectivity of, for example, 0.1 % to 10 %, can be attached to the opposite exit-side facet, which contains the exit aperture.

The mirrors can define a laser resonator that enables laser operation.

However, the laser bar can also be designed as a gain element which is only provided for laser operation in interaction with an external resonator.

In this case, for example, a wavelength-dependent feedback can be provided by the external resonator, which serves to determine the wavelength of the laser.

Such an electro-optical gain

The laser bar is pumped by an electrical current.

The operating current can be, for example, 1A to 1000A.

A first contact area and a second contact area are 5 provided on the laser bar for current input.

The p-side contact area is referred to as the first contact area.

The first contact area can be the anode of the diode laser bar.

The n-side contact area of the laser bar is referred to as the second contact area.

The second contact area can be the cathode of the laser bar.

The first and the second contact areas can each lie in an xy plane.

The first contact area is arranged on the epitaxial side of the laser bar, which can be referred to as the first side, while the second contact area is arranged on the substrate side of the laser bar, which can be referred to as the second side.

The method according to the invention serves to produce a diode laser.

For this purpose, a laser bar is provided, which has a first contact area on a first side, which is designed as at least one p contact, and has a second contact surface on a second side opposite the first side, which is designed as at least one n contact.

The first contact area can be designed as a contact area for all emitters.

However, it can also consist of a plurality of individual sub-areas which can be separated from one another, for example a sub-area for each emitter.

The first contact area can for example be a metallization; the outer layer can for example be a gold layer.

Preferably, a galvanically reinforced gold layer with a thickness preferably greater than 0.

5 um, particularly preferably between 1 um and 10 um, can be

6 EP3 262 728 used.

The second contact area can be designed as a contact area for all emitters.

However, it can also consist of a plurality of individual sub-areas, for example a sub-area for each emitter.

The second contact area can for example be a metallization; the outer layer can for example be a gold layer.

A plurality of laser bars can also be provided, which can be arranged, for example,

next to one another or one above the other on the heat sink.

In addition, a heat-conducting body having a first terminal area is provided.

The heat-conducting body can consist, for example, at least in part of copper, aluminum or of a copper-diamond aluminum-diamond or silver-diamond composite material or comprise such a material.

It can be designed, for example, as a copper body with an inlay made of a composite material.

However, it can also be made entirely of copper, for example.

The heat-conducting body can have a metallization, for example Ag/Au, or Ni/Au or Ti/Pt/Au, wherein the gold layer is preferably provided on the outside.

The first terminal area can be designed with a particularly good flatness in order to then achieve a low smile value (the deviation of the individual emitters from a straight line). Further first terminal areas for further laser bars can also be provided.

In addition, at least one cover is provided with a second terminal area.

The cover is provided for electrically contacting the n contact of the laser bar.

It can, but does not have to, also be provided for heat dissipation.

It can consist of an electrically highly conductive material, for example at least partially of copper, aluminum or of a copper-diamond aluminum-diamond or silver-diamond composite material or comprise such a material.

However, it can also be made entirely of copper, for example.

The cover can have a metallization, for example Ag/Au, or Ni/Au or Ti/Pt/Au, wherein the gold layer is preferably provided on the outside.

Within the meaning of the present invention, the layer thickness of the second metallic layer can be location-dependent.

A plurality of raised locations and/or a plurality of depressed locations can be present.

The raised locations refer to those

7 EP3 262 728 locations of the second metallic layer which have a maximum of the layer thickness.

A raised location is therefore a location that projects further beyond the surface than surrounding locations.

When viewed topographically, a raised location can be formed as a dome, as a plateau or as a ridge.

As depressed locations of a layer, such locations are so designated which each have a minimum of the layer thickness.

When viewed topographically, a depressed location can be formed as a crater, as a trough or as a basin.

The layer thickness at the depressed locations can be greater than or equal to zero.

In the second case, no layer material may be present at the depressed locations, and the layer can thus have interruptions.

At the raised locations, the layer thickness can be the same and have a value D.

The raised locations can be formed as a topologically contiguous area or as a plurality of sub-areas.

The depressed locations can be formed as a topologically contiguous area or as a plurality of sub-areas.

In a sectional plane, which can be perpendicular to the layer plane, a plurality of raised and a plurality of depressed locations can be cut.

The sectional plane can thus be selected such that it contains a normal of the layer plane.

In such a sectional representation, a plurality of depressed locations can be visible, for example.

Even if these locations can be formed as a contiguous area when viewed three-dimensionally, the sectional plane can nevertheless have the plurality of depressed locations in the sense according to the invention.

The same applies to the raised locations.

It should also be pointed out that a plurality of raised and a plurality of depressed locations need not be present in any arbitrary sectional plane perpendicular to the layer plane.

For example, the plurality of raised and depressed locations can be visible in a cross-section, while not being visible in a longitudinal section.

In a preferred embodiment, the raised locations can be formed as strip-shaped plateaus of height D, which run, for example, in the x direction, no layer material being present between the strips.

In the sense according to the invention, the second metallic layer would then have a plurality of raised and a plurality of depressed locations in an yz sectional plane (cross-section).

According to the invention, the second metallic layer, which has a plurality of raised locations and a plurality of depressed locations in a sectional plane, is provided by the second metallic layer being applied as a nubbed structure to the second contact area or to the second terminal area.

In this case, the raised

8 EP3 262 728 locations can be designed as circular plateaus of height D, which can be imagined, for example, as cylindrical nubs, no layer material being present between the nubs.

Such a layer can be produced, for example, by a coating process using a perforated mask.

The depressed locations of the layer can then be a contiguous area when viewed three-dimensionally and topologically.

This area could be regarded as a lowland area (basin). In the sense according to the invention, the second metallic layer can have a plurality of raised and a plurality of depressed locations in an yz sectional plane (cross-section). According to the invention, the nubbed structure is formed with a coverage density of at least one nub per square millimeter of layer area, particularly advantageously with at least 5 nubs per square millimeter.

The distance between adjacent nubs should not be selected too large; a maximum distance of 1 mm measured from edge to edge of adjacent nubs can be advantageous.

The second metallic layer can differ from conventional solder bumps in particular by the finer structure and the smaller layer thickness.

According to the invention, at least one force is generated, which has a component which presses the cover in the direction of the heat-conducting body.

This can be the z direction.

Under the action of the force, the first contact area is pressed flat against the first terminal area.

This can result in a clamped connection.

At this contact pressure, unevennesses of the second contact area can be compensated.

In this case, the laser bar can be elastically deformed.

The second metallic layer here can experience a plastic deformation at least in sections in the region of the raised locations.

At these locations, the yield point of the layer material (crushing limit) can be exceeded.

The second contact area can now be electrically connected to the second terminal area by means of the second metallic layer.

The second metallic layer can have cavities at the depressed locations.

The second metallic layer can thus have not only connected locations on which the second contact area is continuously connected to the second terminal area in the direction of the normal n, but also interrupted locations at which the second contact area is

9 EP3 262 728 not connected continuously to the second terminal area in the direction of the normal n.

The layer normal n can be the normal of the second contact area, i.e. the z direction.

For this reason, the connected locations and the interrupted locations can be projected onto an xy plane.

In this case, the interrupted locations can advantageously have a total area which is at least 20 % of the surface area of the second contact area.

In order to avoid an uneven current input into the second contact area, the interrupted locations, considered individually, should not be selected too large.

In the projection onto the xy plane, for each point belonging to an interrupted location, the distance to the nearest point belonging to a connected location should be no more than 0.5 mm, advantageously no more than 0.25 mm.

Furthermore, the setting-up of a mechanical connection of the cover to the heat- conducting body is provided.

Advantageously, an electrically insulating connection can be provided, so that the laser bar is not short-circuited.

The connection can be effected by means of a joining agent.

For example, an adhesive can be used as the joining agent.

A flat bonding using a heat-conducting adhesive can be used particularly advantageously.

A distance or a separating trench can be provided between the laser bar and the joining surface in order to prevent the laser bar from being wetted with adhesive.

The setting-up of the mechanical connection can be accompanied by a volume shrinkage of the joining agent.

The mechanical connection can be provided for generating and/or maintaining the force.

As a result, the clamped connection of the laser bar between the heat-conducting body and the cover can also be maintained.

The second metallic layer can be designed as a relief.

The layer thickness can be location-dependent.

The topography of the layer thickness can be such that it can be represented in a single-area projection.

The minimum length dimension of raised locations can be considered as a feature size.

This can be, for example, the diameter of circular plateaus or the width of strip-shaped plateaus.

In order to determine a minimum feature size in the general case, the contour lines of an average height between the level of the depressed locations and the raised locations can be used.

The feature size can be, for example, the dome diameter at half the dome height or the ridge width at half the ridge height.

The minimum feature size can advantageously be between 10 um and 1000 um.

The average contour line can have a total length.

In the case of a non-contiguous average

10 EP3 262 728 contour line, the total length is to be understood as the sum of the lengths of the individual segments of the average contour line.

In other words, the total length of the average contour line can also be considered to be the sum of the circumferences of the sectional surfaces cut at the average contour line.

The total length L of the average contour line within a specific base area A can be set in relation to this base area, for example the total area of the second metallic layer.

This ratio, i.e. the quotient L/A, can advantageously be between 1000 m/m? and 100000 m/m?. If the relief is to be roughly structured, i.e. the ratio L/A is too small, the plastic deformation of the second metallic layer can be impaired.

If the relief is too finely structured, that is to say the ratio L/A is too large, it can happen that the thermal and electrical connection of the laser bar to the heat-conducting body or to the cover deteriorates over time.

According to the invention, the second metallic layer comprises indium.

The plastic deformation of the second metallic layer can take place at room temperature without heating.

However, heating can also be provided, so that plastic deformation can take place at an elevated temperature.

The temperature can advantageously be below the liquidus temperature and/or below the solidus temperature of the second metallic layer.

As a result, melting of the second metallic layer can be prevented.

It has been found that an advantageous more uniform power distribution of the laser radiation over the individual emitters of a laser bar can be achieved when the second metallic layer is not melted.

The plastic deformation of the second metallic layer can take place without volume compression.

During deformation, the thickness of the second metallic layer can be reduced at least in sections at the raised locations.

Excess material can be pressed in the direction of the depressed locations without the total volume of the material experiencing any noticeable change.

This would not be possible in the case of a uniformly thick layer.

11 EP3 262 728

After the plastic deformation of the second metallic layer, intermetallic phases can form at the raised locations of the second metallic layer, which limit or prevent further plastic deformation.

Such intermetallic phases can be effected by diffusion, for example at room temperature or at a tempering process below the respective melting temperature (solidus temperature) of the material of the second layer and of the intermetallic phases.

Such a diffusion process can take place very slowly, for example it can take several minutes, hours, days, weeks or months.

For example, the surface of the second terminal area and/or of the second contact area can be gold-plated.

Gold can then diffuse at least partially into the second metallic layer consisting, for example, of indium.

In this case, a very hard gold- indium phase can result compared to the indium, which phase can then no longer be plastically deformed.

Since the formation of intermetallic phases can take a very long time, the plastic deformation according to the invention of the second metallic layer is not hindered by the action of the force.

According to the invention, a first metallic layer is also provided.

During arrangement of the laser bar, the first metallic layer can be arranged at least in sections between the first terminal area and the first contact area.

The first metallic layer has a uniform layer thickness.

This can be advantageous, because a better flatness of the p-side of the laser bar can then be achieved.

The first metallic layer can consist of a soft heavy metal such as tin, lead, indium or cadmium or comprise one such.

Preference is given to using indium and/or tin, since lead and cadmium are less environmentally compatible.

The first or the second metallic layer can be produced by coating.

In manufacturing technology, coating is understood to mean a main group of manufacturing processes according to DIN 8580, which are used to apply an adherent layer of amorphous material to the surface of a workpiece.

The corresponding process and the applied layer itself are also referred to as coating.

12 EP3 262 728 and application.

Within the meaning of the present invention, a coating with a location-dependent layer thickness is also referred to as a layer.

The second metallic layer can be produced by coating the second terminal area.

Galvanic or physical (e.g., vapor deposition, sputtering) coating methods can be used for this purpose.

The coating can be carried out with a mask in order to produce the depressed and raised locations.

Alternatively, a layer of uniform thickness can also be coated, and the depressed and raised locations be produced, for example, by stamping, scoring or etching.

The second metallic layer can also be produced by coating the second contact area of the laser bar.

The second metallic layer is thicker, relative to the raised locations, than the first metallic layer.

The second metallic layer can at the raised locations preferably have a thickness of 3 um to 100 um, particularly preferably between 5 um and 15 um.

The first metallic layer can preferably have a uniform thickness of less than 5 um, particularly preferably less than 3 um.

The second metallic layer can be applied to the second terminal area.

If provided, the first metallic layer can be applied to the first terminal area.

The second metallic layer can be applied to the second contact area.

If provided, the first metallic layer can be applied to the first contact area.

Furthermore, further metallic layers can also be provided between the second contact area and the second terminal area.

The second metallic layer can have a volume fill level which lies preferably between 5 % and 95 % and/or particularly preferably between 10 % and 50 %. The volume fill level is to be understood as the ratio of the material volume to the product of base area D and layer thickness D of the virgin (not yet deformed) layer.

In this calculation, the layer thickness D is the layer thickness at the raised locations.

13 EP3 262 728 a heat-conducting body having a first terminal area, a cover having a second terminal area, a second metallic layer. The laser bar is arranged between the heat- conducting body and the cover. The second metallic layer is arranged at least in sections between the second terminal area and the second contact area. The cover is mechanically connected to the heat-conducting body. The first contact area is thermally and electrically connected to the first terminal area of the first heat-conducting body over the surface area. This means that the best possible heat dissipation of the waste heat from the laser bar to the heat-conducting body is possible via this connection and at the same time an electrical connection that is as low-resistance as possible for the supply of the operating current to the laser bar is made possible. The second contact area is electrically connected to the second terminal area by means of the second metallic layer. This means that this connection also should be designed as low-resistance as possible. The second metallic layer has connected locations at which the second contact area is continuously connected to the second terminal area in the direction of the normal n, i.e. in the z direction. In addition, the second metallic layer has interrupted locations at which the second contact area is not continuously connected to the second terminal area in the direction of the normal n. The decisive factor as to whether a point is to be assigned to the layer plane of a connected location or of an interrupted location is whether a continuous material bond is present at this point in the normal direction n or whether at least one cavity is present in the normal direction n. The layer normal n can be the normal of the second contact area, i.e. the z direction. For this reason, the connected locations and the interrupted locations can be projected onto an xy plane. The interrupted locations can advantageously have a total area which is at least 20 % of the surface area of the second contact area. In order to avoid an uneven current input into the second contact area, the interrupted locations, considered individually, should not be selected too large. In the projection onto the xy plane, for each point belonging to an interrupted location, the distance to the nearest point belonging to a connected location should be no more than 0.5 mm, advantageously no more than 0.25 mm. Advantageously, the cover can be provided making a contribution to heat dissipation from the second contact area. The cavities in the second metallic layer,

i.e. the interrupted locations, can remain free or alternatively be filled with a further

14 EP3 262 728 joining agent, for example an epoxy resin. The cavities can be filled in a further method step. If necessary, the mechanical strength of the connection can thereby be improved compared to a connection with unfilled cavities. The cover can be thermally and mechanically connected to the heat-conducting body by means of an electrically insulating joining agent. Advantageously, the use according to the invention of a second metallic layer produced with the involvement of a coating process and which has a nubbed structure, the nubbed structure having a coverage density with at least one nub per square millimeter of the area of the layer, can be for producing a clamped connection in a diode laser, wherein the second metallic layer is arranged between a second n-side contact area of a laser bar and a second terminal area of a cover and the second metallic layer is applied to the second contact area or to the second terminal area. The figures show the following:

Fig. 4 shows a second exemplary embodiment

Fig. 5 shows a third exemplary embodiment

Fig. 6 shows the cover of a fourth exemplary embodiment

Fig. 7 shows the cover of a fifth exemplary embodiment

Fig. 8 shows the cover of a sixth exemplary embodiment

Fig. 9 shows the cover of a seventh exemplary embodiment

Fig. 10 shows a longitudinal section of the third exemplary embodiment

Fig. 11 shows a cross-section of the third exemplary embodiment

15 EP3 262 728

Fig. 12 shows a longitudinal section of the fifth exemplary embodiment

Fig. 13 shows a cross-section of the fifth exemplary embodiment

Fig. 14 shows a longitudinal section of an eighth exemplary embodiment

Fig. 15 shows a cross-section of the eighth exemplary embodiment

Fig. 16 shows a longitudinal section of a ninth exemplary embodiment

Fig. 17 shows a cross-section of the ninth exemplary embodiment

Fig. 18 shows a cross-section of a tenth exemplary embodiment

Fig. 19 shows a cross-section of an eleventh exemplary embodiment

Fig. 20 shows a single-area projection of the second metallic layer It should be noted that the figures are not drawn to scale. Exaggerated representations are required to illustrate the invention. Exemplary embodiments: The invention is to be illustrated by means of a first exemplary embodiment in Fig. 1, Fig. 2 and Fig. 3. Fig. 1 shows in a front view the principle of action on a first exemplary embodiment before assembly of the diode laser 1. Shown is a laser bar 3 provided with a plurality of emitters 6, which has on a first side 7 a first contact area 8, which is designed as a p contact (anode), and has a second contact area 10 on a side, opposite the first side, of second side 9, which is formed as n-contact (cathode). The laser bar has thickness fluctuations and a curvature. These features are shown highly exaggerated in order to illustrate the operating principle of the invention. Furthermore, a heat-conducting body 11 provided is shown with a first terminal area 12. The first terminal area is coated with a first metallic layer 16 (shown with cross-hatching) made of indium. In addition, a provided cover 14 with a second terminal area 15 is shown. This area has a slight unevenness, which is shown exaggerated. On the second terminal area, a second metallic layer 17 made of indium (shown with cross-hatching) is applied, which has a plurality of raised locations 19 and a plurality of depressed locations 20. The second metallic

16 EP3 262 728 layer can thus be provided together with the cover. There is no layer material in the depressed locations 20. The laser bar is arranged between the heat- conducting body 11 and the cover 14, wherein the first contact area 8 faces the first terminal area 12 of the heat-conducting body and the second contact area 10 faces the second terminal area 15 of the cover and the second metallic layer 17 is arranged at least in sections between the second terminal area 15 and the second contact area 10. In this example, the second metallic layer is provided in such a way that it does not project beyond the second contact area in the y direction. However, in one section it does project in the -x direction beyond the contact area, as can be seen from Fig. 3 described below.

17 EP3 262 728 It should be pointed out as a precaution that the cross-hatchings in Figs. 1 to 9 are merely intended to highlight the metallic layers, they do not represent cut surfaces. In a modification (not shown) of the first exemplary embodiment, no first metallic layer is present. The first contact area is placed directly on the first terminal area.

18 EP3 262 728 As a result, an excessively high pressure on the laser bars can be avoided, for example in the edge region.

Fig. 12 shows a longitudinal section C-C of the fifth exemplary embodiment. The raised locations 19 are formed as circular plateaus 27 on the second terminal area

15. A plurality of raised locations 19 and a plurality of depressed locations 20 are present in this xy sectional plane (longitudinal section).

Fig. 15 shows a cross-section of an eighth exemplary embodiment.

Fig. 17 shows a cross-section of the ninth exemplary embodiment.

19 EP3 262 728

Fig. 20 shows a single-area projection of the second metallic layer 17 of a twelfth exemplary embodiment. Here, the raised locations 19 of the second metallic layer are embodied as domes 25 which are arranged in a matrix. This example is intended to illustrate the determination of the contour lines. A base area A 18 with a plurality of raised locations can be selected. This can also be the entire base area of the second metallic layer. Each individual dome has an average contour line 21, which has a certain length. The sum of all lengths of the average contour line gives a total length L. The ratio L/A can be determined from this. In a modification (not shown) of the first to twelfth exemplary embodiments, the second metallic layer is produced by coating the second side of the laser bar. The exemplary embodiments mentioned can be combined with one another.

20 EP3 262 728 Reference signs:

1. Diode laser

2. Laser radiation

3. Laser bar

4. Substrate

5. Epitaxial layer

6. Emitter

7. First side

8. First contact area

9. Second side

10. Second contact area

11. Heat-conducting body

12. — First terminal area

13. Core

14. Cover

15. Second terminal area

16. First metallic layer

17. Second metallic layer

18. Base area

19. Raised location

20. Depressed location

21 EP3 262 728

21. Average contour line

22. Location connected in the normal direction

23. Location interrupted in the normal direction

24. Force

25. Dome

26. Ridge

27. Plateau

28. Crater

29. Trough

30. Basin

31. Joining agent