FI20160184A7 - Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä - Google Patents
Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä Download PDFInfo
- Publication number
- FI20160184A7 FI20160184A7 FI20160184A FI20160184A FI20160184A7 FI 20160184 A7 FI20160184 A7 FI 20160184A7 FI 20160184 A FI20160184 A FI 20160184A FI 20160184 A FI20160184 A FI 20160184A FI 20160184 A7 FI20160184 A7 FI 20160184A7
- Authority
- FI
- Finland
- Prior art keywords
- polymerization
- siloxane monomers
- siloxane
- monomers
- Prior art date
Links
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title 1
- 239000000178 monomer Substances 0.000 title 1
- 238000006116 polymerization reaction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
- C07F7/1872—Preparation; Treatments not provided for in C07F7/20
- C07F7/1876—Preparation; Treatments not provided for in C07F7/20 by reactions involving the formation of Si-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
- C07F7/0872—Preparation and treatment thereof
- C07F7/0874—Reactions involving a bond of the Si-O-Si linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
- C09K19/54—Additives having no specific mesophase characterised by their chemical composition
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Silicon Polymers (AREA)
- Electroluminescent Light Sources (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20160184A FI127462B (fi) | 2016-07-14 | 2016-07-14 | Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä |
| EP17754387.3A EP3484896B1 (en) | 2016-07-14 | 2017-07-14 | Siloxane monomers, their polymerization and uses thereof |
| JP2019501528A JP6951412B2 (ja) | 2016-07-14 | 2017-07-14 | シロキサンモノマー、それらの重合およびそれらの使用 |
| US16/317,576 US10889690B2 (en) | 2016-07-14 | 2017-07-14 | Siloxane monomers, their polymerization and uses thereof |
| PCT/FI2017/050542 WO2018011475A1 (en) | 2016-07-14 | 2017-07-14 | Siloxane monomers, their polymerization and uses thereof |
| KR1020197004298A KR102555391B1 (ko) | 2016-07-14 | 2017-07-14 | 실록산 단량체, 그들의 중합 및 이의 용도 |
| CN201780057253.4A CN109715635B (zh) | 2016-07-14 | 2017-07-14 | 硅氧烷单体、其聚合和用途 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20160184A FI127462B (fi) | 2016-07-14 | 2016-07-14 | Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI20160184A7 true FI20160184A7 (fi) | 2018-01-15 |
| FI127462B FI127462B (fi) | 2018-06-29 |
Family
ID=59656090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20160184A FI127462B (fi) | 2016-07-14 | 2016-07-14 | Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10889690B2 (fi) |
| EP (1) | EP3484896B1 (fi) |
| JP (1) | JP6951412B2 (fi) |
| KR (1) | KR102555391B1 (fi) |
| CN (1) | CN109715635B (fi) |
| FI (1) | FI127462B (fi) |
| WO (1) | WO2018011475A1 (fi) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018222315A1 (en) * | 2017-06-01 | 2018-12-06 | Dow Silicones Corporation | Polysiloxane comprising substituents having multiple aryl groups |
| CN110437449B (zh) * | 2019-08-13 | 2024-01-02 | 青岛科技大学 | 一种环硅氧烷原位开环聚合制备聚硅氧烷薄膜的方法 |
| JP7468399B2 (ja) * | 2020-03-17 | 2024-04-16 | 信越化学工業株式会社 | シリコーンコーティング剤組成物及び物品 |
| CN113234100B (zh) * | 2021-05-06 | 2022-08-12 | 吉林奥来德光电材料股份有限公司 | 一种含硅单体、封装组合物、封装结构及光电器件 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2258221A (en) * | 1940-04-27 | 1941-10-07 | Gen Electric | Aroxy silicones and insulated conductors and other products utilizing the same |
| FR1470523A (fr) * | 1965-03-04 | 1967-02-24 | Gen Electric | Cyclopolysiloxanes substitués stables à température élevée, et procédé pour leur préparation |
| US3385878A (en) * | 1965-03-04 | 1968-05-28 | Gen Electric | Cyclopolysiloxanes |
| SU427943A1 (ru) * | 1972-09-13 | 1974-05-15 | Способ получения ялрл-замещенных феноксифенилхлорсиланов | |
| US4278784A (en) | 1980-02-06 | 1981-07-14 | Western Electric Company, Inc. | Encapsulated electronic devices and encapsulating compositions |
| FI845161A0 (fi) * | 1984-12-28 | 1984-12-28 | Ksv Chemicals Oy | Ytbehandlingsmedel. |
| US6492204B1 (en) | 1999-01-26 | 2002-12-10 | Jp Ox Engineering | Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions |
| TW200427111A (en) * | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
| US20100178620A1 (en) * | 2007-05-21 | 2010-07-15 | Jsr Corporation | Inverted pattern forming method and resin composition |
| JP5302586B2 (ja) * | 2007-07-27 | 2013-10-02 | ローム アンド ハース カンパニー | (チオ)フェノキシフェニルシラン組成物およびその製造方法 |
| US8637627B2 (en) | 2007-12-06 | 2014-01-28 | Rohm And Haas Company | Phenoxyphenyl polysiloxane composition and method for making and using same |
| KR101674703B1 (ko) * | 2009-10-30 | 2016-11-09 | 제이에스알 가부시끼가이샤 | 반전 패턴 형성 방법 및 폴리실록산 수지 조성물 |
| US8258636B1 (en) * | 2011-05-17 | 2012-09-04 | Rohm And Haas Electronic Materials Llc | High refractive index curable liquid light emitting diode encapsulant formulation |
| FI127433B (fi) * | 2011-06-14 | 2018-05-31 | Pibond Oy | Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö |
| US8450445B2 (en) | 2011-08-17 | 2013-05-28 | Rohm And Haas Electronic Materials Llc | Light emitting diode manufacturing method |
| US8455607B2 (en) * | 2011-08-17 | 2013-06-04 | Rohm And Haas Electronic Materials Llc | Curable liquid composite light emitting diode encapsulant |
| FI126130B (fi) * | 2015-03-20 | 2016-07-15 | Inkron Oy | Korkean taitekertoimen siloksaanimonomeerit, niiden polymerointi sekä niiden käyttö |
-
2016
- 2016-07-14 FI FI20160184A patent/FI127462B/fi active
-
2017
- 2017-07-14 US US16/317,576 patent/US10889690B2/en active Active
- 2017-07-14 JP JP2019501528A patent/JP6951412B2/ja active Active
- 2017-07-14 WO PCT/FI2017/050542 patent/WO2018011475A1/en not_active Ceased
- 2017-07-14 KR KR1020197004298A patent/KR102555391B1/ko active Active
- 2017-07-14 CN CN201780057253.4A patent/CN109715635B/zh active Active
- 2017-07-14 EP EP17754387.3A patent/EP3484896B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019528246A (ja) | 2019-10-10 |
| EP3484896A1 (en) | 2019-05-22 |
| JP6951412B2 (ja) | 2021-10-20 |
| US20190225756A1 (en) | 2019-07-25 |
| KR102555391B1 (ko) | 2023-07-12 |
| KR20190029665A (ko) | 2019-03-20 |
| WO2018011475A1 (en) | 2018-01-18 |
| US10889690B2 (en) | 2021-01-12 |
| CN109715635B (zh) | 2022-04-26 |
| CN109715635A (zh) | 2019-05-03 |
| EP3484896B1 (en) | 2023-11-22 |
| FI127462B (fi) | 2018-06-29 |
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