FI20160184A7 - Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä - Google Patents

Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä Download PDF

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Publication number
FI20160184A7
FI20160184A7 FI20160184A FI20160184A FI20160184A7 FI 20160184 A7 FI20160184 A7 FI 20160184A7 FI 20160184 A FI20160184 A FI 20160184A FI 20160184 A FI20160184 A FI 20160184A FI 20160184 A7 FI20160184 A7 FI 20160184A7
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FI
Finland
Prior art keywords
polymerization
siloxane monomers
siloxane
monomers
Prior art date
Application number
FI20160184A
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English (en)
Swedish (sv)
Other versions
FI127462B (fi
Inventor
Juha Rantala
Jyri Paulasaari
Original Assignee
Inkron Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inkron Oy filed Critical Inkron Oy
Priority to FI20160184A priority Critical patent/FI127462B/fi
Priority to EP17754387.3A priority patent/EP3484896B1/en
Priority to JP2019501528A priority patent/JP6951412B2/ja
Priority to US16/317,576 priority patent/US10889690B2/en
Priority to PCT/FI2017/050542 priority patent/WO2018011475A1/en
Priority to KR1020197004298A priority patent/KR102555391B1/ko
Priority to CN201780057253.4A priority patent/CN109715635B/zh
Publication of FI20160184A7 publication Critical patent/FI20160184A7/fi
Application granted granted Critical
Publication of FI127462B publication Critical patent/FI127462B/fi

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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • C07F7/1872Preparation; Treatments not provided for in C07F7/20
    • C07F7/1876Preparation; Treatments not provided for in C07F7/20 by reactions involving the formation of Si-C linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0803Compounds with Si-C or Si-Si linkages
    • C07F7/081Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0834Compounds having one or more O-Si linkage
    • C07F7/0838Compounds with one or more Si-O-Si sequences
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0834Compounds having one or more O-Si linkage
    • C07F7/0838Compounds with one or more Si-O-Si sequences
    • C07F7/0872Preparation and treatment thereof
    • C07F7/0874Reactions involving a bond of the Si-O-Si linkage
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • C08G77/08Preparatory processes characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/52Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K19/54Additives having no specific mesophase characterised by their chemical composition
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Electroluminescent Light Sources (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
FI20160184A 2016-07-14 2016-07-14 Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä FI127462B (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20160184A FI127462B (fi) 2016-07-14 2016-07-14 Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä
EP17754387.3A EP3484896B1 (en) 2016-07-14 2017-07-14 Siloxane monomers, their polymerization and uses thereof
JP2019501528A JP6951412B2 (ja) 2016-07-14 2017-07-14 シロキサンモノマー、それらの重合およびそれらの使用
US16/317,576 US10889690B2 (en) 2016-07-14 2017-07-14 Siloxane monomers, their polymerization and uses thereof
PCT/FI2017/050542 WO2018011475A1 (en) 2016-07-14 2017-07-14 Siloxane monomers, their polymerization and uses thereof
KR1020197004298A KR102555391B1 (ko) 2016-07-14 2017-07-14 실록산 단량체, 그들의 중합 및 이의 용도
CN201780057253.4A CN109715635B (zh) 2016-07-14 2017-07-14 硅氧烷单体、其聚合和用途

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20160184A FI127462B (fi) 2016-07-14 2016-07-14 Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä

Publications (2)

Publication Number Publication Date
FI20160184A7 true FI20160184A7 (fi) 2018-01-15
FI127462B FI127462B (fi) 2018-06-29

Family

ID=59656090

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20160184A FI127462B (fi) 2016-07-14 2016-07-14 Siloksaanimonomeerejä, niiden polymerisaatio ja käyttöjä

Country Status (7)

Country Link
US (1) US10889690B2 (fi)
EP (1) EP3484896B1 (fi)
JP (1) JP6951412B2 (fi)
KR (1) KR102555391B1 (fi)
CN (1) CN109715635B (fi)
FI (1) FI127462B (fi)
WO (1) WO2018011475A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018222315A1 (en) * 2017-06-01 2018-12-06 Dow Silicones Corporation Polysiloxane comprising substituents having multiple aryl groups
CN110437449B (zh) * 2019-08-13 2024-01-02 青岛科技大学 一种环硅氧烷原位开环聚合制备聚硅氧烷薄膜的方法
JP7468399B2 (ja) * 2020-03-17 2024-04-16 信越化学工業株式会社 シリコーンコーティング剤組成物及び物品
CN113234100B (zh) * 2021-05-06 2022-08-12 吉林奥来德光电材料股份有限公司 一种含硅单体、封装组合物、封装结构及光电器件

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Publication number Priority date Publication date Assignee Title
US2258221A (en) * 1940-04-27 1941-10-07 Gen Electric Aroxy silicones and insulated conductors and other products utilizing the same
FR1470523A (fr) * 1965-03-04 1967-02-24 Gen Electric Cyclopolysiloxanes substitués stables à température élevée, et procédé pour leur préparation
US3385878A (en) * 1965-03-04 1968-05-28 Gen Electric Cyclopolysiloxanes
SU427943A1 (ru) * 1972-09-13 1974-05-15 Способ получения ялрл-замещенных феноксифенилхлорсиланов
US4278784A (en) 1980-02-06 1981-07-14 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions
FI845161A0 (fi) * 1984-12-28 1984-12-28 Ksv Chemicals Oy Ytbehandlingsmedel.
US6492204B1 (en) 1999-01-26 2002-12-10 Jp Ox Engineering Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
US20100178620A1 (en) * 2007-05-21 2010-07-15 Jsr Corporation Inverted pattern forming method and resin composition
JP5302586B2 (ja) * 2007-07-27 2013-10-02 ローム アンド ハース カンパニー (チオ)フェノキシフェニルシラン組成物およびその製造方法
US8637627B2 (en) 2007-12-06 2014-01-28 Rohm And Haas Company Phenoxyphenyl polysiloxane composition and method for making and using same
KR101674703B1 (ko) * 2009-10-30 2016-11-09 제이에스알 가부시끼가이샤 반전 패턴 형성 방법 및 폴리실록산 수지 조성물
US8258636B1 (en) * 2011-05-17 2012-09-04 Rohm And Haas Electronic Materials Llc High refractive index curable liquid light emitting diode encapsulant formulation
FI127433B (fi) * 2011-06-14 2018-05-31 Pibond Oy Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö
US8450445B2 (en) 2011-08-17 2013-05-28 Rohm And Haas Electronic Materials Llc Light emitting diode manufacturing method
US8455607B2 (en) * 2011-08-17 2013-06-04 Rohm And Haas Electronic Materials Llc Curable liquid composite light emitting diode encapsulant
FI126130B (fi) * 2015-03-20 2016-07-15 Inkron Oy Korkean taitekertoimen siloksaanimonomeerit, niiden polymerointi sekä niiden käyttö

Also Published As

Publication number Publication date
JP2019528246A (ja) 2019-10-10
EP3484896A1 (en) 2019-05-22
JP6951412B2 (ja) 2021-10-20
US20190225756A1 (en) 2019-07-25
KR102555391B1 (ko) 2023-07-12
KR20190029665A (ko) 2019-03-20
WO2018011475A1 (en) 2018-01-18
US10889690B2 (en) 2021-01-12
CN109715635B (zh) 2022-04-26
CN109715635A (zh) 2019-05-03
EP3484896B1 (en) 2023-11-22
FI127462B (fi) 2018-06-29

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