FI20096363A0 - Järjestely nestejäähdyttimessä - Google Patents

Järjestely nestejäähdyttimessä

Info

Publication number
FI20096363A0
FI20096363A0 FI20096363A FI20096363A FI20096363A0 FI 20096363 A0 FI20096363 A0 FI 20096363A0 FI 20096363 A FI20096363 A FI 20096363A FI 20096363 A FI20096363 A FI 20096363A FI 20096363 A0 FI20096363 A0 FI 20096363A0
Authority
FI
Finland
Prior art keywords
arrangement
liquid cooler
cooler
liquid
Prior art date
Application number
FI20096363A
Other languages
English (en)
Swedish (sv)
Other versions
FI124731B (fi
FI20096363A (fi
Original Assignee
Vacon Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacon Oyj filed Critical Vacon Oyj
Priority to FI20096363A priority Critical patent/FI124731B/fi
Publication of FI20096363A0 publication Critical patent/FI20096363A0/fi
Priority to DK10190297.1T priority patent/DK2337436T3/da
Priority to EP10190297A priority patent/EP2337436B1/en
Priority to US12/949,386 priority patent/US9022101B2/en
Priority to CN201010601124.7A priority patent/CN102123577B/zh
Publication of FI20096363A publication Critical patent/FI20096363A/fi
Application granted granted Critical
Publication of FI124731B publication Critical patent/FI124731B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20096363A 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä FI124731B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä
DK10190297.1T DK2337436T3 (da) 2009-12-18 2010-11-08 Arrangement i en væskekøler
EP10190297A EP2337436B1 (en) 2009-12-18 2010-11-08 Arrangement in a liquid cooler
US12/949,386 US9022101B2 (en) 2009-12-18 2010-11-18 Arrangement in a liquid cooler
CN201010601124.7A CN102123577B (zh) 2009-12-18 2010-12-17 一种液体冷却器中的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä
FI20096363 2009-12-18

Publications (3)

Publication Number Publication Date
FI20096363A0 true FI20096363A0 (fi) 2009-12-18
FI20096363A FI20096363A (fi) 2011-06-19
FI124731B FI124731B (fi) 2014-12-31

Family

ID=41462821

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä

Country Status (5)

Country Link
US (1) US9022101B2 (fi)
EP (1) EP2337436B1 (fi)
CN (1) CN102123577B (fi)
DK (1) DK2337436T3 (fi)
FI (1) FI124731B (fi)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20126218A (fi) 2012-11-20 2014-05-21 Vacon Oyj Tehoelektroniikkalaite
WO2017047151A1 (ja) * 2015-09-14 2017-03-23 三菱電機株式会社 冷却器、電力変換装置、及び冷却システム
CN105234016A (zh) * 2015-09-28 2016-01-13 洛阳帝博石化装备有限公司 一种适用于二流体喷嘴的冷却部件
WO2018095552A1 (de) * 2016-11-28 2018-05-31 Siemens Aktiengesellschaft Stromrichter
FR3084810B1 (fr) * 2018-07-31 2022-01-14 Valeo Systemes Thermiques Element de regulation thermique d'un composant electrique, d'un vehicule automobile, susceptible de degager de la chaleur lors de son fonctionnement

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3063682A (en) * 1960-08-15 1962-11-13 American Air Filter Co Heat exchange unit
US4303124A (en) * 1979-06-04 1981-12-01 The A.P.V. Company Limited Plate heat exchanger
EP0234021B1 (de) * 1986-01-16 1991-12-18 Siemens Aktiengesellschaft Vorrichtung für eine Flüssigkeitskühlung eines elektrischen Bauelementes, insbesondere Halbleiter-Bauelementes
US5178209A (en) * 1988-07-12 1993-01-12 Sanden Corporation Condenser for automotive air conditioning systems
FR2729044B1 (fr) 1994-12-30 1997-01-24 Atherm Element refroisisseur et connecteur pour un composant electronique de puissance refroidi par un fluide electriquement isole du composant
CA2203213A1 (en) 1996-05-31 1997-11-30 R-Theta Inc. Heat sink with coolant accelerator
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6032726A (en) 1997-06-30 2000-03-07 Solid State Cooling Systems Low-cost liquid heat transfer plate and method of manufacturing therefor
US6031751A (en) 1998-01-20 2000-02-29 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US7017656B2 (en) * 2001-05-24 2006-03-28 Honeywell International, Inc. Heat exchanger with manifold tubes for stiffening and load bearing
FI117838B (fi) 2003-06-04 2007-03-15 Vacon Oyj Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely
EP1600208A1 (en) * 2004-05-24 2005-11-30 Methanol Casale S.A. Plate-type heat-exchanger
EP1844269A4 (en) * 2005-02-02 2010-07-07 Carrier Corp TUBULAR INSERT AND DOUBLE-FLOW DEVICE FOR A COLLECTOR OF A HEAT PUMP
DE502006005141D1 (de) * 2005-12-08 2009-11-26 Sew Eurodrive Gmbh & Co Gerät, baureihe von geräten, vorrichtung mit gehäuund verwendung eines flüssigkeitskühlers
DE102006057796B4 (de) * 2005-12-08 2011-03-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung für Wärme erzeugende elektrische Komponenten und elektrisches Gerät damit
CN101005747B (zh) * 2006-01-21 2010-05-26 富准精密工业(深圳)有限公司 液冷散热装置及用于该液冷散热装置的热交换器
DE602008002507D1 (de) * 2007-08-27 2010-10-28 Abb Research Ltd Wärmetauscher für Komponenten der Leistungselektronik
US20090173482A1 (en) * 2008-01-09 2009-07-09 Beamer Henry E Distributor tube subassembly
JP4785878B2 (ja) * 2008-02-06 2011-10-05 本田技研工業株式会社 冷却装置及び該冷却装置を備える電気車両

Also Published As

Publication number Publication date
US20110146962A1 (en) 2011-06-23
EP2337436B1 (en) 2012-11-21
EP2337436A2 (en) 2011-06-22
FI124731B (fi) 2014-12-31
US9022101B2 (en) 2015-05-05
CN102123577A (zh) 2011-07-13
EP2337436A3 (en) 2011-08-03
CN102123577B (zh) 2014-02-19
FI20096363A (fi) 2011-06-19
DK2337436T3 (da) 2013-03-11

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