FI20095567A0 - Valonlähteen valmistaminen - Google Patents

Valonlähteen valmistaminen

Info

Publication number
FI20095567A0
FI20095567A0 FI20095567A FI20095567A FI20095567A0 FI 20095567 A0 FI20095567 A0 FI 20095567A0 FI 20095567 A FI20095567 A FI 20095567A FI 20095567 A FI20095567 A FI 20095567A FI 20095567 A0 FI20095567 A0 FI 20095567A0
Authority
FI
Finland
Prior art keywords
manufacture
light source
source
light
Prior art date
Application number
FI20095567A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Inventor
Vladislav E Bougrov
Maxim A Odnoblyudov
Original Assignee
Ooo Optogan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ooo Optogan filed Critical Ooo Optogan
Priority to FI20095567A priority Critical patent/FI20095567A0/fi
Publication of FI20095567A0 publication Critical patent/FI20095567A0/fi
Priority to PCT/FI2010/050411 priority patent/WO2010133772A1/fr
Priority to TW99116437A priority patent/TW201104165A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
FI20095567A 2009-05-22 2009-05-22 Valonlähteen valmistaminen FI20095567A0 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20095567A FI20095567A0 (fi) 2009-05-22 2009-05-22 Valonlähteen valmistaminen
PCT/FI2010/050411 WO2010133772A1 (fr) 2009-05-22 2010-05-21 Élément de source lumineuse et procédé de fabrication
TW99116437A TW201104165A (en) 2009-05-22 2010-05-24 A light source element and a method for manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095567A FI20095567A0 (fi) 2009-05-22 2009-05-22 Valonlähteen valmistaminen

Publications (1)

Publication Number Publication Date
FI20095567A0 true FI20095567A0 (fi) 2009-05-22

Family

ID=40680747

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095567A FI20095567A0 (fi) 2009-05-22 2009-05-22 Valonlähteen valmistaminen

Country Status (3)

Country Link
FI (1) FI20095567A0 (fr)
TW (1) TW201104165A (fr)
WO (1) WO2010133772A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9786811B2 (en) * 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
EP2761221B1 (fr) 2011-09-26 2017-10-25 Musco Corporation Système d'éclairage ayant un collimateur de source de lumière multiple et son procédé de fonctionnement
CN103791252B (zh) * 2012-10-30 2017-05-03 欧司朗股份有限公司 发光模块和包括该发光模块的照明装置和灯箱
CN103807627B (zh) * 2012-11-13 2017-05-10 欧司朗有限公司 发光模块和包括该发光模块的照明装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419375B (zh) * 2005-02-18 2013-12-11 Nichia Corp 具備控制配光特性用之透鏡之發光裝置
EP1861876A1 (fr) * 2005-03-24 2007-12-05 Tir Systems Ltd. Emballage pour dispositif d'eclairage a semi-conducteurs
EP1872400A4 (fr) * 2005-04-05 2009-06-24 Tir Technology Lp Ensemble de montage pour des dispositifs optoelectroniques
EP1872053A2 (fr) * 2005-04-06 2008-01-02 Tir Systems Ltd. Module d'eclairage dote de composants optiques de melange et de collimation de couleurs
JP5357379B2 (ja) * 2006-02-23 2013-12-04 パナソニック株式会社 発光装置
JP2008294309A (ja) * 2007-05-25 2008-12-04 Showa Denko Kk 発光装置、表示装置

Also Published As

Publication number Publication date
TW201104165A (en) 2011-02-01
WO2010133772A1 (fr) 2010-11-25

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Legal Events

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