FI20070939A - Säteilyanturi menetelmä säteilyanturin valmistamiseksi ja anturin käyttö säteilyn mittaamiseksi - Google Patents
Säteilyanturi menetelmä säteilyanturin valmistamiseksi ja anturin käyttö säteilyn mittaamiseksi Download PDFInfo
- Publication number
- FI20070939A FI20070939A FI20070939A FI20070939A FI20070939A FI 20070939 A FI20070939 A FI 20070939A FI 20070939 A FI20070939 A FI 20070939A FI 20070939 A FI20070939 A FI 20070939A FI 20070939 A FI20070939 A FI 20070939A
- Authority
- FI
- Finland
- Prior art keywords
- radiation
- sensor
- manufacturing
- measure
- radiation sensor
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T3/00—Measuring neutron radiation
- G01T3/08—Measuring neutron radiation with semiconductor detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
- H01L31/035263—Doping superlattices, e.g. nipi superlattices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
- Light Receiving Elements (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20070939A FI121828B (fi) | 2007-12-04 | 2007-12-04 | Säteilynilmaisin, menetelmä säteilynilmaisimen valmistamiseksi ja ilmaisimen käyttö säteilyn mittaamiseen |
EP08858023A EP2227828A2 (en) | 2007-12-04 | 2008-12-03 | Back-thinned radiation detector with "3d" active region and corresponding methods of manufacturing and use |
EP16162571.0A EP3139409A1 (en) | 2007-12-04 | 2008-12-03 | Radiation detector, method of manufacturing a radiation detector and use of the detector for measuring radiation |
PCT/EP2008/066716 WO2009071587A2 (en) | 2007-12-04 | 2008-12-03 | Back-thinned radiation detector with '3d' active region and corresponding methods of manufacturing and use |
US12/794,627 US8461541B2 (en) | 2007-12-04 | 2010-06-04 | Radiation detector, method of manufacturing a radiation detector and use of the detector for measuring radiation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20070939A FI121828B (fi) | 2007-12-04 | 2007-12-04 | Säteilynilmaisin, menetelmä säteilynilmaisimen valmistamiseksi ja ilmaisimen käyttö säteilyn mittaamiseen |
FI20070939 | 2007-12-04 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20070939A0 FI20070939A0 (fi) | 2007-12-04 |
FI20070939A true FI20070939A (fi) | 2009-06-05 |
FI121828B FI121828B (fi) | 2011-04-29 |
Family
ID=38951476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20070939A FI121828B (fi) | 2007-12-04 | 2007-12-04 | Säteilynilmaisin, menetelmä säteilynilmaisimen valmistamiseksi ja ilmaisimen käyttö säteilyn mittaamiseen |
Country Status (4)
Country | Link |
---|---|
US (1) | US8461541B2 (fi) |
EP (2) | EP2227828A2 (fi) |
FI (1) | FI121828B (fi) |
WO (1) | WO2009071587A2 (fi) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8766392B2 (en) | 2007-05-07 | 2014-07-01 | Osi Optoelectronics, Inc. | Thin active layer fishbone photodiode with a shallow N+ layer and method of manufacturing the same |
US7576369B2 (en) * | 2005-10-25 | 2009-08-18 | Udt Sensors, Inc. | Deep diffused thin photodiodes |
US7709921B2 (en) | 2008-08-27 | 2010-05-04 | Udt Sensors, Inc. | Photodiode and photodiode array with improved performance characteristics |
US8120023B2 (en) | 2006-06-05 | 2012-02-21 | Udt Sensors, Inc. | Low crosstalk, front-side illuminated, back-side contact photodiode array |
US8519503B2 (en) | 2006-06-05 | 2013-08-27 | Osi Optoelectronics, Inc. | High speed backside illuminated, front side contact photodiode array |
US8686529B2 (en) | 2010-01-19 | 2014-04-01 | Osi Optoelectronics, Inc. | Wavelength sensitive sensor photodiodes |
US9178092B2 (en) | 2006-11-01 | 2015-11-03 | Osi Optoelectronics, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
US8005326B2 (en) * | 2008-07-10 | 2011-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical clock signal distribution using through-silicon vias |
US8399909B2 (en) | 2009-05-12 | 2013-03-19 | Osi Optoelectronics, Inc. | Tetra-lateral position sensing detector |
EP2256810A1 (en) * | 2009-05-29 | 2010-12-01 | Fondazione Bruno Kessler | Method for the production of a 3D solid-state radiation detector |
US8263940B2 (en) | 2009-10-26 | 2012-09-11 | Finphys Oy | Neutron detector with neutron converter, method for manufacturing the neutron detector and neutron imaging apparatus |
GB2474720A (en) | 2009-10-26 | 2011-04-27 | Finphys Oy | Neutron Detector |
UA111585C2 (uk) * | 2010-01-08 | 2016-05-25 | Трай Альфа Енерджи, Інк. | Перетворення високоенергетичних фотонів в електрику |
US8822897B2 (en) | 2010-03-19 | 2014-09-02 | Invisage Technologies, Inc. | Image sensors employing sensitized semiconductor diodes |
WO2011156507A1 (en) | 2010-06-08 | 2011-12-15 | Edward Hartley Sargent | Stable, sensitive photodetectors and image sensors including circuits, processes, and materials for enhanced imaging performance |
GB201107076D0 (en) | 2011-04-27 | 2011-06-08 | Finphys Oy | Neutron detector |
US8798229B2 (en) * | 2011-09-30 | 2014-08-05 | General Electric Company | Detector modules and methods of manufacturing |
WO2013121078A1 (en) * | 2012-02-15 | 2013-08-22 | Hs Foils Oy | Method and arrangement for manufacturing a radiation window |
US8912615B2 (en) | 2013-01-24 | 2014-12-16 | Osi Optoelectronics, Inc. | Shallow junction photodiode for detecting short wavelength light |
US10054691B1 (en) | 2013-03-01 | 2018-08-21 | The United States of America as Represented by the Admin of National Aeronautics and Space Administration | Fast, large area, wide band GAP UV photodetector for cherenkov light detection |
US9739898B2 (en) | 2014-03-26 | 2017-08-22 | California Institute Of Technology | Subnanosecond scintillation detector |
US10078142B2 (en) | 2014-03-26 | 2018-09-18 | California Institute Of Technology | Sensor integrated metal dielectric filters for solar-blind silicon ultraviolet detectors |
WO2015191734A1 (en) | 2014-06-10 | 2015-12-17 | Edward Hartley Sargent | Multi-terminal optoelectronic devices for light detection |
US9754992B2 (en) | 2015-01-21 | 2017-09-05 | Terapede Systems Inc. | Integrated scintillator grid with photodiodes |
CN109155321A (zh) | 2016-05-11 | 2019-01-04 | G射线工业公司 | 用于粒子检测的单片硅像素检测器以及系统和方法 |
WO2017213622A1 (en) * | 2016-06-06 | 2017-12-14 | Terapede Systems Inc. | Integrated scintillator grid with photodiodes |
CN109863603B (zh) * | 2016-10-20 | 2023-02-17 | 因维萨热技术公司 | 具有电子收集电极和空穴收集电极的图像传感器 |
GB201703785D0 (en) * | 2017-03-09 | 2017-04-26 | Univ Bristol | Radiation detector |
US10126437B1 (en) * | 2017-05-15 | 2018-11-13 | Prismatic Sensors Ab | Detector for x-ray imaging |
EP3658959A4 (en) * | 2017-07-26 | 2020-12-23 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR WITH INTEGRATED DEPOLARIZATION DEVICE |
EP3444843B8 (en) * | 2017-08-14 | 2021-03-24 | ams International AG | Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation |
KR102583562B1 (ko) * | 2017-12-27 | 2023-09-26 | 엘지디스플레이 주식회사 | 디지털 엑스레이 검출기용 어레이 기판과 이를 포함하는 엑스레이 검출기 |
WO2020142975A1 (en) * | 2019-01-10 | 2020-07-16 | Shenzhen Xpectvision Technology Co., Ltd. | Semiconductor radiation detector |
CN112083470B (zh) * | 2020-09-02 | 2023-11-24 | 重庆中易智芯科技有限责任公司 | 一种阻态敏感CdZnTe辐射探测器及其制造方法 |
US11927616B2 (en) | 2021-03-30 | 2024-03-12 | International Business Machines Corporation | Evaluation of wafer carcass alpha particle emission |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS56129380A (en) * | 1980-03-13 | 1981-10-09 | Fuji Electric Co Ltd | Semiconductor radioactive rays detector |
FR2656738B1 (fr) * | 1989-12-29 | 1995-03-17 | Telemecanique | Procede pour fabriquer un dispositif semiconducteur, dispositif et composant semiconducteur obtenus par le procede. |
FR2666453A1 (fr) * | 1990-08-31 | 1992-03-06 | Commissariat Energie Atomique | Batterie de photopiles montees en serie. |
FR2715250B1 (fr) | 1994-01-19 | 1996-04-05 | Commissariat Energie Atomique | Dispositif tridimensionnel de détection de rayonnement et procédé de fabrication de ce dispositif. |
US6259099B1 (en) * | 1996-12-18 | 2001-07-10 | Commissariat A L'energie Atomique | Ultra-thin ionizing radiation detector and methods for making same |
DE10127952A1 (de) * | 2001-06-08 | 2002-12-19 | Infineon Technologies Ag | Laterale PIN-Diode und Verfahren zur Herstellung derselben |
US6667528B2 (en) * | 2002-01-03 | 2003-12-23 | International Business Machines Corporation | Semiconductor-on-insulator lateral p-i-n photodetector with a reflecting mirror and backside contact and method for forming the same |
WO2005003816A2 (en) * | 2003-07-01 | 2005-01-13 | Bae Systems Plc | A solid state neutron detector |
US6943409B1 (en) * | 2004-05-24 | 2005-09-13 | International Business Machines Corporation | Trench optical device |
EP1833095B1 (en) * | 2006-03-06 | 2018-08-01 | ams AG | Photo diode having reduced dark current |
-
2007
- 2007-12-04 FI FI20070939A patent/FI121828B/fi active IP Right Grant
-
2008
- 2008-12-03 EP EP08858023A patent/EP2227828A2/en not_active Withdrawn
- 2008-12-03 EP EP16162571.0A patent/EP3139409A1/en not_active Withdrawn
- 2008-12-03 WO PCT/EP2008/066716 patent/WO2009071587A2/en active Application Filing
-
2010
- 2010-06-04 US US12/794,627 patent/US8461541B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2009071587A2 (en) | 2009-06-11 |
FI20070939A0 (fi) | 2007-12-04 |
WO2009071587A3 (en) | 2009-09-17 |
US20110079728A1 (en) | 2011-04-07 |
EP3139409A1 (en) | 2017-03-08 |
US8461541B2 (en) | 2013-06-11 |
FI121828B (fi) | 2011-04-29 |
EP2227828A2 (en) | 2010-09-15 |
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