FI20065282L - Menetelmä piirilevyllä varustetun kuoren valmistamiseksi - Google Patents

Menetelmä piirilevyllä varustetun kuoren valmistamiseksi Download PDF

Info

Publication number
FI20065282L
FI20065282L FI20065282A FI20065282A FI20065282L FI 20065282 L FI20065282 L FI 20065282L FI 20065282 A FI20065282 A FI 20065282A FI 20065282 A FI20065282 A FI 20065282A FI 20065282 L FI20065282 L FI 20065282L
Authority
FI
Finland
Prior art keywords
circuit board
injection moulding
pcb
layer
producing
Prior art date
Application number
FI20065282A
Other languages
English (en)
Swedish (sv)
Other versions
FI20065282A0 (fi
Inventor
Mikko Silvennoinen
Original Assignee
Perlos Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perlos Oyj filed Critical Perlos Oyj
Priority to FI20065282A priority Critical patent/FI20065282L/fi
Publication of FI20065282A0 publication Critical patent/FI20065282A0/fi
Priority to PCT/FI2007/050238 priority patent/WO2007125178A1/en
Publication of FI20065282L publication Critical patent/FI20065282L/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0003—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor of successively moulded portions rigidly joined to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
FI20065282A 2006-05-02 2006-05-02 Menetelmä piirilevyllä varustetun kuoren valmistamiseksi FI20065282L (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20065282A FI20065282L (fi) 2006-05-02 2006-05-02 Menetelmä piirilevyllä varustetun kuoren valmistamiseksi
PCT/FI2007/050238 WO2007125178A1 (en) 2006-05-02 2007-04-27 Method of producing casing provided with circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20065282A FI20065282L (fi) 2006-05-02 2006-05-02 Menetelmä piirilevyllä varustetun kuoren valmistamiseksi

Publications (2)

Publication Number Publication Date
FI20065282A0 FI20065282A0 (fi) 2006-05-02
FI20065282L true FI20065282L (fi) 2007-09-20

Family

ID=36539983

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20065282A FI20065282L (fi) 2006-05-02 2006-05-02 Menetelmä piirilevyllä varustetun kuoren valmistamiseksi

Country Status (2)

Country Link
FI (1) FI20065282L (fi)
WO (1) WO2007125178A1 (fi)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2821262B2 (ja) * 1990-11-26 1998-11-05 株式会社日立製作所 電子装置
US6665192B2 (en) * 1997-02-18 2003-12-16 Koninklijke Philips Electronics N.V. Synthetic resin capping layer on a printed circuit
FR2778817B1 (fr) * 1998-05-18 2000-06-30 Remy Kirchdoerffer Procede de fabrication d'un appareil ou d'un instrument par surmoulage et appareil ou instrument ainsi obtenu
JP2000208905A (ja) * 1999-01-14 2000-07-28 Nec Corp プリント基板
GB2360972A (en) * 2000-04-05 2001-10-10 Nokia Mobile Phones Ltd Portable electronic apparatus with a moulded cover
US6482346B1 (en) * 2000-11-21 2002-11-19 Ross Alcazar Method for manufacturing an in-mold display
US7010121B2 (en) * 2001-08-06 2006-03-07 Siemens Communications, Inc. Mobile telephone and method for its manufacture
US20040137664A1 (en) * 2003-01-09 2004-07-15 Gidon Elazar Advanced packaging shell for pocketable consumer electronic devices

Also Published As

Publication number Publication date
WO2007125178A1 (en) 2007-11-08
FI20065282A0 (fi) 2006-05-02

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