FI20065282L - Method for producing a shell fitted with a circuit board - Google Patents

Method for producing a shell fitted with a circuit board Download PDF

Info

Publication number
FI20065282L
FI20065282L FI20065282A FI20065282A FI20065282L FI 20065282 L FI20065282 L FI 20065282L FI 20065282 A FI20065282 A FI 20065282A FI 20065282 A FI20065282 A FI 20065282A FI 20065282 L FI20065282 L FI 20065282L
Authority
FI
Finland
Prior art keywords
circuit board
injection moulding
pcb
layer
producing
Prior art date
Application number
FI20065282A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20065282A0 (en
Inventor
Mikko Silvennoinen
Original Assignee
Perlos Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perlos Oyj filed Critical Perlos Oyj
Priority to FI20065282A priority Critical patent/FI20065282L/en
Publication of FI20065282A0 publication Critical patent/FI20065282A0/en
Priority to PCT/FI2007/050238 priority patent/WO2007125178A1/en
Publication of FI20065282L publication Critical patent/FI20065282L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0003—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor of successively moulded portions rigidly joined to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Abstract

A method of producing a casing provided with a circuit board, the method comprising a step of forming a circuit board (PCB) having a first surface and an opposite second surface arranged to receive a display element (4). The method further comprises a first injection moulding step where a first layer of injection moulding material is formed on the first surface of the circuit board (PCB) and a second layer (82) of injection moulding material is formed on the second surface of the circuit board (PCB), an installation step where at least the display element (4) is mounted on the second surface of the circuit board (PCB), a second injection moulding step where a third layer (83) of injection moulding material is formed on the second surface of the circuit board (PCB), the layer being arranged to form an essential part of the casing's front surface. The second injection moulding step is performed after the installation step and comprises integrating at least one of the components mounted on the circuit board (PCB) in the installation step into the casing by forming a connection between the component to be integrated and the third layer of injection moulding material by means of the injection moulding material.
FI20065282A 2006-05-02 2006-05-02 Method for producing a shell fitted with a circuit board FI20065282L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20065282A FI20065282L (en) 2006-05-02 2006-05-02 Method for producing a shell fitted with a circuit board
PCT/FI2007/050238 WO2007125178A1 (en) 2006-05-02 2007-04-27 Method of producing casing provided with circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20065282A FI20065282L (en) 2006-05-02 2006-05-02 Method for producing a shell fitted with a circuit board

Publications (2)

Publication Number Publication Date
FI20065282A0 FI20065282A0 (en) 2006-05-02
FI20065282L true FI20065282L (en) 2007-09-20

Family

ID=36539983

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20065282A FI20065282L (en) 2006-05-02 2006-05-02 Method for producing a shell fitted with a circuit board

Country Status (2)

Country Link
FI (1) FI20065282L (en)
WO (1) WO2007125178A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2821262B2 (en) * 1990-11-26 1998-11-05 株式会社日立製作所 Electronic equipment
US6665192B2 (en) * 1997-02-18 2003-12-16 Koninklijke Philips Electronics N.V. Synthetic resin capping layer on a printed circuit
FR2778817B1 (en) * 1998-05-18 2000-06-30 Remy Kirchdoerffer METHOD FOR MANUFACTURING AN APPARATUS OR INSTRUMENT BY MOLDING AND APPARATUS OR INSTRUMENT THUS OBTAINED
JP2000208905A (en) * 1999-01-14 2000-07-28 Nec Corp Printed board
GB2360972A (en) * 2000-04-05 2001-10-10 Nokia Mobile Phones Ltd Portable electronic apparatus with a moulded cover
US6482346B1 (en) * 2000-11-21 2002-11-19 Ross Alcazar Method for manufacturing an in-mold display
US7010121B2 (en) * 2001-08-06 2006-03-07 Siemens Communications, Inc. Mobile telephone and method for its manufacture
US20040137664A1 (en) * 2003-01-09 2004-07-15 Gidon Elazar Advanced packaging shell for pocketable consumer electronic devices

Also Published As

Publication number Publication date
FI20065282A0 (en) 2006-05-02
WO2007125178A1 (en) 2007-11-08

Similar Documents

Publication Publication Date Title
DE502008001272D1 (en) ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE
FI20060447L (en) Method for producing a printed circuit board embedded with electronic components
TWI266568B (en) Method for manufacturing embedded thin film resistor on printed circuit board
TW200603704A (en) Rigid-flexible board and method for manufacturing the same
WO2005093862A3 (en) Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
TW200642547A (en) A substantially continuous layer of embedded transient protection for printed circuit boards
TW200742519A (en) Substrate embedded with passive device
MXPA06000842A (en) Circuit board with embedded components and method of manufacture.
TW200712582A (en) Optical waveguide film and the manufacturing method thereof, and optical/electronic circuit film and electronic machine including that
WO2007143966A3 (en) Textile layer arrangement, textile layer array and method for producing a textile layer arrangement
TW200735081A (en) Function element mounting module, manufacturing method thereof, and resin sealing board and substrate-structured unit for resin sealing used by the same
WO2010098540A3 (en) Portable terminal case with a built-in internal antenna, and method for manufacturing same
TW200735759A (en) Metal insert molding plastic of shielding case structure for hand hold device
RU2009139138A (en) ELECTRONIC CARD AND METHOD FOR PRODUCING ELECTRONIC CARDS
WO2008134530A3 (en) A capacitive microphone with integrated cavity
TW200731885A (en) Rigid-flexible printed circuit board and method of manufacturing the same
WO2008126564A1 (en) Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
CN105437449A (en) Injection molding method of liquid silicone rubber and electronic device with display screen
TW200703595A (en) Electronic control unit and process of producing the same
TW200618683A (en) Circuit board structure with embeded adjustable passive components and method for fabricating the same
FI20031796A0 (en) A method for constructing an EMI shield around a component to be embedded in a circuit board
TW200713473A (en) Method of resin-seal-molding electronic component and apparatus therefor
TW200944093A (en) Case of an electronic device and method of fabricating the same
TW200630003A (en) Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device
GB2519191A9 (en) Method for manufacturing a printed circuit board, printed circuit board and rear view device

Legal Events

Date Code Title Description
FD Application lapsed