FI20061165L - Kylmätyöstö - Google Patents

Kylmätyöstö Download PDF

Info

Publication number
FI20061165L
FI20061165L FI20061165A FI20061165A FI20061165L FI 20061165 L FI20061165 L FI 20061165L FI 20061165 A FI20061165 A FI 20061165A FI 20061165 A FI20061165 A FI 20061165A FI 20061165 L FI20061165 L FI 20061165L
Authority
FI
Finland
Prior art keywords
ablation
laser radiation
arrangement
radiation
source
Prior art date
Application number
FI20061165A
Other languages
English (en)
Swedish (sv)
Inventor
Jari Ruuttu
Reijo Lappalainen
Vesa Myllymaeki
Lasse Pulli
Juha Maekitalo
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20060182A external-priority patent/FI20060182L/fi
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Priority to FI20061165A priority Critical patent/FI20061165L/fi
Priority to PCT/FI2007/000047 priority patent/WO2007096462A1/en
Priority to FI20070158A priority patent/FI20070158L/fi
Publication of FI20061165L publication Critical patent/FI20061165L/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
FI20061165A 2006-02-23 2006-12-29 Kylmätyöstö FI20061165L (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20061165A FI20061165L (fi) 2006-02-23 2006-12-29 Kylmätyöstö
PCT/FI2007/000047 WO2007096462A1 (en) 2006-02-23 2007-02-23 A cold-work method
FI20070158A FI20070158L (fi) 2006-02-23 2007-02-23 Järjestely

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060182A FI20060182L (fi) 2005-07-13 2006-02-23 Ablaatiotekniikkaan liittyvä pinnankäsittelytekniikka ja pinnankäsittelylaitteisto
FI20061165A FI20061165L (fi) 2006-02-23 2006-12-29 Kylmätyöstö

Publications (1)

Publication Number Publication Date
FI20061165L true FI20061165L (fi) 2007-08-24

Family

ID=38169520

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20061165A FI20061165L (fi) 2006-02-23 2006-12-29 Kylmätyöstö

Country Status (2)

Country Link
FI (1) FI20061165L (fi)
WO (1) WO2007096462A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102658076B (zh) * 2012-05-11 2015-06-03 中山大学 一种微纳米材料及其制备方法、装置、应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099830A (en) * 1976-12-15 1978-07-11 A. J. Bingley Limited Optical systems including polygonal mirrors rotatable about two axes
IT1179293B (it) * 1984-03-22 1987-09-16 Gd Spa Dispositivo per praticare perforazioni in articoli a forma di barretta
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
KR20000026066A (ko) * 1998-10-17 2000-05-06 윤종용 회전반사경 조립체 및 이를 채용한 인쇄장치
KR100565051B1 (ko) * 2002-09-16 2006-03-30 삼성전자주식회사 광주사유닛 및 이를 채용한 전자사진방식 화상형성장치
US6852946B2 (en) * 2002-12-20 2005-02-08 Caterpillar Inc Laser-induced plasma micromachining

Also Published As

Publication number Publication date
WO2007096462A1 (en) 2007-08-30

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