FI20060358L - Menetelmä ablaatiokynnyksen säätämiseksi - Google Patents

Menetelmä ablaatiokynnyksen säätämiseksi Download PDF

Info

Publication number
FI20060358L
FI20060358L FI20060358A FI20060358A FI20060358L FI 20060358 L FI20060358 L FI 20060358L FI 20060358 A FI20060358 A FI 20060358A FI 20060358 A FI20060358 A FI 20060358A FI 20060358 L FI20060358 L FI 20060358L
Authority
FI
Finland
Prior art keywords
ablation threshold
regulating
procedure
ablated
laser
Prior art date
Application number
FI20060358A
Other languages
English (en)
Swedish (sv)
Other versions
FI20060358A0 (fi
Inventor
Reijo Lappalainen
Jari Ruuttu
Vesa Myllymaeki
Juha Maekitalo
Lasse Pulli
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Priority to FI20060358A priority Critical patent/FI20060358L/fi
Publication of FI20060358A0 publication Critical patent/FI20060358A0/fi
Priority to PCT/FI2006/000251 priority patent/WO2007006850A2/en
Priority to US11/988,663 priority patent/US20100181706A1/en
Priority to EP06778481A priority patent/EP1910013A2/en
Priority to FI20070158A priority patent/FI20070158L/fi
Priority to PCT/FI2007/000094 priority patent/WO2007116124A1/en
Publication of FI20060358L publication Critical patent/FI20060358L/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
FI20060358A 2005-07-13 2006-04-12 Menetelmä ablaatiokynnyksen säätämiseksi FI20060358L (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20060358A FI20060358L (fi) 2006-04-12 2006-04-12 Menetelmä ablaatiokynnyksen säätämiseksi
PCT/FI2006/000251 WO2007006850A2 (en) 2005-07-13 2006-07-13 Radiation arrangement
US11/988,663 US20100181706A1 (en) 2005-07-13 2006-07-13 Radiation Arrangement
EP06778481A EP1910013A2 (en) 2005-07-13 2006-07-13 Radiation arrangement
FI20070158A FI20070158L (fi) 2006-02-23 2007-02-23 Järjestely
PCT/FI2007/000094 WO2007116124A1 (en) 2006-04-12 2007-04-12 Method for adjusting ablation threshold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20060358A FI20060358L (fi) 2006-04-12 2006-04-12 Menetelmä ablaatiokynnyksen säätämiseksi

Publications (2)

Publication Number Publication Date
FI20060358A0 FI20060358A0 (fi) 2006-04-12
FI20060358L true FI20060358L (fi) 2007-10-13

Family

ID=36293754

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20060358A FI20060358L (fi) 2005-07-13 2006-04-12 Menetelmä ablaatiokynnyksen säätämiseksi

Country Status (2)

Country Link
FI (1) FI20060358L (fi)
WO (1) WO2007116124A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20085295L (fi) * 2008-04-09 2009-10-10 Metso Paper Inc Menetelmä kuiturainakoneen kone-elimen pinnan muokkaamiseksi ja kuiturainakoneen kone-elin

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598039A (en) * 1984-07-02 1986-07-01 At&T Bell Laboratories Formation of features in optical material
GB2233334A (en) * 1989-06-29 1991-01-09 Exitech Ltd Surface treatment of polymer materials by the action of pulses of UV radiation
US5569399A (en) * 1995-01-20 1996-10-29 General Electric Company Lasing medium surface modification
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining
US7419912B2 (en) * 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby

Also Published As

Publication number Publication date
WO2007116124A1 (en) 2007-10-18
FI20060358A0 (fi) 2006-04-12

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Legal Events

Date Code Title Description
FD Application lapsed