FI20051009A0 - Mittausmenetelmä, järjestely ja ohjelmistotuote - Google Patents

Mittausmenetelmä, järjestely ja ohjelmistotuote

Info

Publication number
FI20051009A0
FI20051009A0 FI20051009A FI20051009A FI20051009A0 FI 20051009 A0 FI20051009 A0 FI 20051009A0 FI 20051009 A FI20051009 A FI 20051009A FI 20051009 A FI20051009 A FI 20051009A FI 20051009 A0 FI20051009 A0 FI 20051009A0
Authority
FI
Finland
Prior art keywords
arrangement
measurement method
software product
software
product
Prior art date
Application number
FI20051009A
Other languages
English (en)
Swedish (sv)
Other versions
FI121555B (fi
FI20051009A (fi
Inventor
Hele Savin
Antti Haarahiltunen
Marko Veli Yli-Koski
Original Assignee
Teknillinen Korkeakoulu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknillinen Korkeakoulu filed Critical Teknillinen Korkeakoulu
Priority to FI20051009A priority Critical patent/FI121555B/fi
Publication of FI20051009A0 publication Critical patent/FI20051009A0/fi
Priority to EP06794103.9A priority patent/EP1931975B1/en
Priority to PCT/FI2006/000327 priority patent/WO2007042606A1/en
Priority to US12/083,091 priority patent/US8624582B2/en
Publication of FI20051009A publication Critical patent/FI20051009A/fi
Application granted granted Critical
Publication of FI121555B publication Critical patent/FI121555B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0095—Semiconductive materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • G01N2021/1719—Carrier modulation in semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
FI20051009A 2005-10-07 2005-10-07 Mittausmenetelmä, järjestely ja ohjelmistotuote FI121555B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20051009A FI121555B (fi) 2005-10-07 2005-10-07 Mittausmenetelmä, järjestely ja ohjelmistotuote
EP06794103.9A EP1931975B1 (en) 2005-10-07 2006-10-06 Measuring method and software product
PCT/FI2006/000327 WO2007042606A1 (en) 2005-10-07 2006-10-06 Measuring method, arrangement and software product
US12/083,091 US8624582B2 (en) 2005-10-07 2006-10-06 Measuring method, arrangement and software product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20051009 2005-10-07
FI20051009A FI121555B (fi) 2005-10-07 2005-10-07 Mittausmenetelmä, järjestely ja ohjelmistotuote

Publications (3)

Publication Number Publication Date
FI20051009A0 true FI20051009A0 (fi) 2005-10-07
FI20051009A FI20051009A (fi) 2007-04-08
FI121555B FI121555B (fi) 2010-12-31

Family

ID=35185151

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20051009A FI121555B (fi) 2005-10-07 2005-10-07 Mittausmenetelmä, järjestely ja ohjelmistotuote

Country Status (4)

Country Link
US (1) US8624582B2 (fi)
EP (1) EP1931975B1 (fi)
FI (1) FI121555B (fi)
WO (1) WO2007042606A1 (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008154186A1 (en) * 2007-06-06 2008-12-18 Semiconductor Diagnostics, Inc. Enhanced sensitivity non-contact electrical monitoring of copper contamination on silicon surface
JP6344168B2 (ja) * 2014-09-11 2018-06-20 株式会社Sumco ボロンドープｐ型シリコンウェーハの金属汚染評価方法および評価装置、ならびにボロンドープｐ型シリコンウェーハの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278037A (ja) * 1988-04-28 1989-11-08 Nec Corp 半導体装置の製造方法
US6146135A (en) * 1991-08-19 2000-11-14 Tadahiro Ohmi Oxide film forming method
JP2672743B2 (ja) * 1992-05-14 1997-11-05 日本電信電話株式会社 汚染不純物の評価方法
US6150175A (en) * 1998-12-15 2000-11-21 Lsi Logic Corporation Copper contamination control of in-line probe instruments
US6607927B2 (en) 2001-09-28 2003-08-19 Agere Systems, Inc. Method and apparatus for monitoring in-line copper contamination
JP2005142359A (ja) * 2003-11-06 2005-06-02 Toshiba Ceramics Co Ltd 半導体ウェーハのライフタイム評価方法

Also Published As

Publication number Publication date
US8624582B2 (en) 2014-01-07
FI121555B (fi) 2010-12-31
US20090160431A1 (en) 2009-06-25
EP1931975A4 (en) 2014-07-23
FI20051009A (fi) 2007-04-08
EP1931975A1 (en) 2008-06-18
WO2007042606A1 (en) 2007-04-19
EP1931975B1 (en) 2018-03-14

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Legal Events

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MM Patent lapsed