FI20050969A0 - Palamista ehkäisevät koostumukset - Google Patents

Palamista ehkäisevät koostumukset

Info

Publication number
FI20050969A0
FI20050969A0 FI20050969A FI20050969A FI20050969A0 FI 20050969 A0 FI20050969 A0 FI 20050969A0 FI 20050969 A FI20050969 A FI 20050969A FI 20050969 A FI20050969 A FI 20050969A FI 20050969 A0 FI20050969 A0 FI 20050969A0
Authority
FI
Finland
Prior art keywords
combustion compositions
combustion
compositions
Prior art date
Application number
FI20050969A
Other languages
English (en)
Swedish (sv)
Other versions
FI20050969A (fi
Inventor
Guoren He
William D Varnell
Thomas J Williams
Original Assignee
Polyclad Laminates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyclad Laminates Inc filed Critical Polyclad Laminates Inc
Publication of FI20050969A0 publication Critical patent/FI20050969A0/fi
Publication of FI20050969A publication Critical patent/FI20050969A/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
FI20050969A 2004-09-28 2005-09-28 Palamista ehkäisevät koostumukset FI20050969A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/952,033 US7687556B2 (en) 2004-09-28 2004-09-28 Flame retardant compositions

Publications (2)

Publication Number Publication Date
FI20050969A0 true FI20050969A0 (fi) 2005-09-28
FI20050969A FI20050969A (fi) 2006-03-29

Family

ID=35151422

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050969A FI20050969A (fi) 2004-09-28 2005-09-28 Palamista ehkäisevät koostumukset

Country Status (5)

Country Link
US (2) US7687556B2 (fi)
CN (1) CN1754913A (fi)
DE (1) DE102005046132A1 (fi)
FI (1) FI20050969A (fi)
TW (1) TWI431066B (fi)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
TR201813053T4 (tr) 2006-04-26 2018-09-21 Dsm Ip Assets Bv Çok katmanlı materyal levhası.
EA013291B1 (ru) 2006-04-26 2010-04-30 ДСМ АйПи АССЕТС Б.В. Лист многослойного материала и способ его получения
US20100015391A1 (en) * 2006-04-26 2010-01-21 Jean Hubert Marie Beugels Composite article, a process for its manufacture and use
WO2009042566A2 (en) * 2007-09-25 2009-04-02 Polyone Corporation Concentric insulation sleeve having inner and outer surfaces with different properties
CN102272190A (zh) * 2009-01-06 2011-12-07 陶氏环球技术有限责任公司 环氧树脂的金属稳定剂和增长方法
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
RU2635630C2 (ru) * 2012-07-30 2017-11-14 Акцо Нобель Коатингс Интернэшнл Б.В. Композиция, обладающая высокой теплостойкостью
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
CN105802187A (zh) * 2016-04-18 2016-07-27 和县隆盛精密机械有限公司 一种自重轻节能的打磨用机械臂元件及其制备方法
CN115340737A (zh) 2016-07-25 2022-11-15 伊索拉美国有限公司 改进的sma树脂制剂

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5262491A (en) * 1991-03-29 1993-11-16 General Electric Company High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent
EP0611798B1 (en) * 1992-08-06 1998-10-21 Asahi Kasei Kogyo Kabushiki Kaisha Resin composition
DE19525951A1 (de) 1995-07-17 1997-01-23 Hoechst Ag Flammwidrige polymere Massen
US6576700B2 (en) * 2000-04-12 2003-06-10 General Electric Company High flow polyphenylene ether formulations
TW521548B (en) 2000-10-13 2003-02-21 Zeon Corp Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
JP2004091748A (ja) 2002-09-04 2004-03-25 Asahi Kasei Chemicals Corp 難燃性硬化性樹脂組成物
US6875387B2 (en) * 2002-12-10 2005-04-05 General Electric Polyphenylene ether compositions with improved die lip buildup performance
DE10309805B4 (de) * 2003-03-05 2005-07-21 Clariant Gmbh Flammschutzmittel-Dispersion
JP4442174B2 (ja) 2003-09-30 2010-03-31 日立化成工業株式会社 難燃性樹脂組成物、並びにこれを用いたプリプレグ、金属張積層板及びプリント配線板

Also Published As

Publication number Publication date
US7687556B2 (en) 2010-03-30
CN1754913A (zh) 2006-04-05
US20100108364A1 (en) 2010-05-06
FI20050969A (fi) 2006-03-29
DE102005046132A1 (de) 2006-05-24
US20060069185A1 (en) 2006-03-30
TW200628549A (en) 2006-08-16
TWI431066B (zh) 2014-03-21

Similar Documents

Publication Publication Date Title
LTPA2017028I1 (lt) Fungicidų kompozicijos
ITMI20041252A1 (it) Composizioni perfluoroelastomeriche
DE602005016978D1 (de) Quecksilberfreisetzende Zusammensetzungen
DE602005025576D1 (de) Brennkammer
DK1811959T4 (da) Oftalmiske sammensætninger
DE602006021273D1 (de) Verbrennungsmotor
BRPI0511900A (pt) composições farmacêuticas
DE602005008661D1 (de) Michael-addierungs Zusammensetzungen
DK1809978T3 (da) Modul-skydebane
DE502005010604D1 (de) Strömungsarbeitsmaschine
NO20055686D0 (no) Sammensetning
FI20050969A (fi) Palamista ehkäisevät koostumukset
ATE372138T1 (de) Dochtanordnung
DE502006006590D1 (de) Biozide zusammensetzungen
DE602005017191D1 (de) Geruchsreduzierte waschstück-zusammensetzung
SE0600737L (sv) Tvåtaktsmotor
DE602005017501D1 (de) Verbrennungsmotor
ATE498308T1 (de) Glyphosate-zusammensetzung
FR2871686B1 (fr) Composition anti-decoloration
ATE465231T1 (de) Stabilisierte propylbromidzusammensetzungen
DE602006015023D1 (de) Vergaser
FR2868774B1 (fr) Composition explosive
FI20050004A0 (fi) Moottorilaitteisto
DE602005008688D1 (de) Brennkammer
AT501297B8 (de) Verbrennungsmotor

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ISOLA USA CORP.

Free format text: ISOLA USA CORP.

FD Application lapsed