FI20050767A - Multilayer Threading Plate and Method of Making it - Google Patents

Multilayer Threading Plate and Method of Making it Download PDF

Info

Publication number
FI20050767A
FI20050767A FI20050767A FI20050767A FI20050767A FI 20050767 A FI20050767 A FI 20050767A FI 20050767 A FI20050767 A FI 20050767A FI 20050767 A FI20050767 A FI 20050767A FI 20050767 A FI20050767 A FI 20050767A
Authority
FI
Finland
Prior art keywords
multilayer
making
motherboard
base material
threading plate
Prior art date
Application number
FI20050767A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI122414B (en
Inventor
Shoji Ito
Ryoichi Kishihara
Osamu Nakao
Hiroki Hashiba
Masahiro Okamoto
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003011635A external-priority patent/JP4195619B2/en
Priority claimed from JP2003294994A external-priority patent/JP2005064357A/en
Priority claimed from JP2003309254A external-priority patent/JP2005079402A/en
Priority claimed from JP2003342907A external-priority patent/JP2005109299A/en
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of FI20050767A publication Critical patent/FI20050767A/en
Application granted granted Critical
Publication of FI122414B publication Critical patent/FI122414B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
FI20050767A 2003-01-20 2005-07-19 Multilayer pattern cards and process for making them FI122414B (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2003011635A JP4195619B2 (en) 2003-01-20 2003-01-20 Multilayer wiring board and manufacturing method thereof
JP2003011635 2003-01-20
JP2003294994A JP2005064357A (en) 2003-08-19 2003-08-19 Multilayer wiring board and method for manufacturing the same
JP2003294994 2003-08-19
JP2003309254A JP2005079402A (en) 2003-09-01 2003-09-01 Circuit board and its manufacturing method
JP2003309254 2003-09-01
JP2003342907 2003-10-01
JP2003342907A JP2005109299A (en) 2003-10-01 2003-10-01 Multilayer wiring board and its manufacturing method
JP0316377 2003-12-19
PCT/JP2003/016377 WO2004066697A1 (en) 2003-01-20 2003-12-19 Multilayer printed wiring board and process for producing the same

Publications (2)

Publication Number Publication Date
FI20050767A true FI20050767A (en) 2005-09-16
FI122414B FI122414B (en) 2012-01-13

Family

ID=32777145

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050767A FI122414B (en) 2003-01-20 2005-07-19 Multilayer pattern cards and process for making them

Country Status (3)

Country Link
US (2) US20060180344A1 (en)
FI (1) FI122414B (en)
WO (1) WO2004066697A1 (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4536430B2 (en) * 2004-06-10 2010-09-01 イビデン株式会社 Flex rigid wiring board
US7246434B1 (en) * 2004-10-11 2007-07-24 Pericom Semiconductor Corp. Method of making a surface mountable PCB module
TWI277381B (en) * 2005-04-12 2007-03-21 Au Optronics Corp Double-sided flexible printed circuit board
JP2007059184A (en) * 2005-08-24 2007-03-08 Citizen Electronics Co Ltd Key sheet module
JP2007067244A (en) * 2005-08-31 2007-03-15 Sony Corp Circuit board
JP4957552B2 (en) * 2005-09-30 2012-06-20 住友ベークライト株式会社 Manufacturing method of prepreg with carrier for printed wiring board, prepreg with carrier for printed wiring board, manufacturing method of thin double-sided board for printed wiring board, thin double-sided board for printed wiring board, and manufacturing method of multilayer printed wiring board
WO2007077735A1 (en) * 2006-01-06 2007-07-12 Nec Corporation Semiconductor mounting wiring board and method for manufacturing same, and semiconductor package
JP5168838B2 (en) * 2006-07-28 2013-03-27 大日本印刷株式会社 Multilayer printed wiring board and manufacturing method thereof
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
US8178789B2 (en) * 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
TWI358981B (en) * 2007-08-08 2012-02-21 Unimicron Technology Corp Method for fabricating circuit board
DE102007044602A1 (en) * 2007-09-19 2009-04-23 Continental Automotive Gmbh Multilayer printed circuit board and use of a multilayer printed circuit board
JP5145896B2 (en) * 2007-11-21 2013-02-20 富士通株式会社 Electronic device and electronic device manufacturing method
JP5306634B2 (en) * 2007-11-22 2013-10-02 新光電気工業株式会社 WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
WO2009141927A1 (en) * 2008-05-23 2009-11-26 イビデン株式会社 Printed wiring board and method for manufacturing the same
JPWO2010007704A1 (en) * 2008-07-16 2012-01-05 イビデン株式会社 Flex-rigid wiring board and electronic device
JP4730426B2 (en) * 2008-11-19 2011-07-20 ソニー株式会社 Mounting substrate and semiconductor module
DE102009006757B3 (en) * 2009-01-30 2010-08-19 Continental Automotive Gmbh Solder-resist coating for rigid-flex PCBs
WO2010113448A1 (en) * 2009-04-02 2010-10-07 パナソニック株式会社 Manufacturing method for circuit board, and circuit board
KR101051491B1 (en) 2009-10-28 2011-07-22 삼성전기주식회사 Manufacturing method of multilayer flexible printed circuit board and multilayer flexible printed circuit board
JP2011119616A (en) * 2009-12-07 2011-06-16 Fujitsu Ltd Method for manufacturing printed wiring board, printed wiring board, and electronic device
US8493747B2 (en) * 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
JP2012142226A (en) * 2011-01-05 2012-07-26 Fujitsu Component Ltd Relay board for transmission connector
KR101803100B1 (en) * 2011-01-21 2017-11-30 삼성전자주식회사 Multi-layer flexible printed circuit board for electronic equipment
CN103857209A (en) * 2012-11-28 2014-06-11 宏启胜精密电子(秦皇岛)有限公司 Multi-layer circuit board and manufacture method for the same
JP5408754B1 (en) * 2012-12-10 2014-02-05 株式会社フジクラ Multilayer wiring board and manufacturing method thereof
CN205093052U (en) * 2013-07-30 2016-03-16 株式会社村田制作所 Multilayer board
CN205213161U (en) * 2013-09-06 2016-05-04 株式会社村田制作所 Multilayer board
KR20150125424A (en) * 2014-04-30 2015-11-09 삼성전기주식회사 Rigid flexible printed circuit board and method of manufacturing the same
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
KR102425753B1 (en) * 2015-06-01 2022-07-28 삼성전기주식회사 Printed circuit board, method for manufacturing the same and semiconductor package having the thereof
EP3437441A1 (en) 2016-03-30 2019-02-06 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure
JP6536751B2 (en) * 2016-08-18 2019-07-03 株式会社村田製作所 Laminated coil and method of manufacturing the same
KR102565119B1 (en) * 2016-08-25 2023-08-08 삼성전기주식회사 Electronic component embedded substrate and manufacturing method threrof
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
JP6637479B2 (en) * 2017-11-16 2020-01-29 矢崎総業株式会社 Electronic circuit board
CN110278657B (en) 2018-03-16 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 Composite circuit board and method for manufacturing the same
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
JP7066528B2 (en) * 2018-05-31 2022-05-13 日東電工株式会社 Wiring circuit board, its manufacturing method and wiring circuit sheet
KR102173615B1 (en) * 2018-07-19 2020-11-03 스템코 주식회사 Multilayer circuit board and manufacturing method thereof
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN110337177A (en) * 2019-06-21 2019-10-15 广州金鹏源康精密电路股份有限公司 It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust
CN113365412B (en) * 2020-03-05 2022-06-24 宏启胜精密电子(秦皇岛)有限公司 Composite circuit board and manufacturing method thereof
CN113692118B (en) * 2021-08-30 2023-06-06 大连亚太电子有限公司 Multilayer printed circuit board

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1138122A (en) 1978-10-13 1982-12-21 Yoshifumi Okada Flexible printed circuit wiring board
JPS55160452A (en) * 1979-06-01 1980-12-13 Nec Corp Hybrid integrated circuit
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
JPH0435092A (en) * 1990-05-31 1992-02-05 Toshiba Corp Multilayer wiring board and manufacture thereof
JP2857237B2 (en) * 1990-08-10 1999-02-17 古河電気工業株式会社 Method for manufacturing multilayer circuit board
JPH06283836A (en) 1993-03-29 1994-10-07 Canon Inc Connection structure and connection method for printed board
JPH07106728A (en) * 1993-10-04 1995-04-21 Mitsui Toatsu Chem Inc Rigid-flexible printed wiring board and manufacture thereof
JPH07135375A (en) * 1993-11-10 1995-05-23 Mitsui Toatsu Chem Inc Rigid flex wiring board and its production
JP3540396B2 (en) * 1994-11-11 2004-07-07 株式会社東芝 Manufacturing method of printed wiring board
JP3445678B2 (en) 1995-02-27 2003-09-08 シャープ株式会社 Multilayer flexible printed wiring board and method of manufacturing the same
JPH1041635A (en) 1996-07-23 1998-02-13 Ibiden Co Ltd Single-sided circuit board for multilayer printed wiring board, its manufacture, and multilayer printed wiring board
JPH10135595A (en) * 1996-10-31 1998-05-22 Kyocera Corp Circuit substrate and its manufacturing method
US6281446B1 (en) * 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
US6163957A (en) * 1998-11-13 2000-12-26 Fujitsu Limited Multilayer laminated substrates with high density interconnects and methods of making the same
JP2000156564A (en) * 1998-11-20 2000-06-06 Nec Corp Printed wiring board and production thereof
JP2000183526A (en) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd Multilayer wiring board and manufacture of the same
JP2000208667A (en) 1999-01-14 2000-07-28 Toshiba Corp Method and equipment for manufacture of laminated board and manufacture of semiconductor device
JP2001024292A (en) * 1999-07-05 2001-01-26 Nippon Mektron Ltd Support structure of flexible circuit board
US6583364B1 (en) * 1999-08-26 2003-06-24 Sony Chemicals Corp. Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
JP4486196B2 (en) 1999-12-08 2010-06-23 イビデン株式会社 Single-sided circuit board for multilayer printed wiring board and manufacturing method thereof
JP3744383B2 (en) 2000-06-09 2006-02-08 松下電器産業株式会社 Composite wiring board and manufacturing method thereof
JP3653452B2 (en) 2000-07-31 2005-05-25 株式会社ノース WIRING CIRCUIT BOARD, ITS MANUFACTURING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND ITS MANUFACTURING METHOD
JP3951091B2 (en) * 2000-08-04 2007-08-01 セイコーエプソン株式会社 Manufacturing method of semiconductor device
JP2002158445A (en) 2000-11-22 2002-05-31 Cmk Corp Rigid-flexible printed wiring board and its manufacturing method
JP2002171063A (en) 2000-12-01 2002-06-14 Sony Chem Corp Multi-layered flexible wiring board
JP2001298274A (en) 2001-03-13 2001-10-26 Matsushita Electric Ind Co Ltd Electronic circuit arrangement
JP2003092473A (en) 2001-07-10 2003-03-28 Fujikura Ltd Multi-layer wiring board, base material for multi-layer wiring and manufacturing method therefor
JP2003229665A (en) * 2002-01-31 2003-08-15 Sumitomo Bakelite Co Ltd Multilayered flexible wiring board and its manufacturing method
JP2003294994A (en) 2002-04-03 2003-10-15 Hitachi Hybrid Network Co Ltd Two-way communication optical module
JP4195619B2 (en) 2003-01-20 2008-12-10 株式会社フジクラ Multilayer wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
WO2004066697A1 (en) 2004-08-05
US7886438B2 (en) 2011-02-15
US20060180344A1 (en) 2006-08-17
FI122414B (en) 2012-01-13
US20090217522A1 (en) 2009-09-03

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