FI20045412A - Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite - Google Patents

Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite Download PDF

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Publication number
FI20045412A
FI20045412A FI20045412A FI20045412A FI20045412A FI 20045412 A FI20045412 A FI 20045412A FI 20045412 A FI20045412 A FI 20045412A FI 20045412 A FI20045412 A FI 20045412A FI 20045412 A FI20045412 A FI 20045412A
Authority
FI
Finland
Prior art keywords
manufacture
electronic device
circuit board
printed circuit
printed
Prior art date
Application number
FI20045412A
Other languages
English (en)
Swedish (sv)
Other versions
FI20045412A0 (fi
Inventor
Tero Peltola
Juulia Loisa
Original Assignee
Aspocomp Technology Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aspocomp Technology Oy filed Critical Aspocomp Technology Oy
Priority to FI20045412A priority Critical patent/FI20045412A/fi
Publication of FI20045412A0 publication Critical patent/FI20045412A0/fi
Priority to PCT/FI2005/050384 priority patent/WO2006048507A1/en
Publication of FI20045412A publication Critical patent/FI20045412A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FI20045412A 2004-11-01 2004-11-01 Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite FI20045412A (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20045412A FI20045412A (fi) 2004-11-01 2004-11-01 Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite
PCT/FI2005/050384 WO2006048507A1 (en) 2004-11-01 2005-10-31 Printed circuit board, method of manufacturing the same, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20045412A FI20045412A (fi) 2004-11-01 2004-11-01 Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite

Publications (2)

Publication Number Publication Date
FI20045412A0 FI20045412A0 (fi) 2004-11-01
FI20045412A true FI20045412A (fi) 2006-05-02

Family

ID=33515295

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045412A FI20045412A (fi) 2004-11-01 2004-11-01 Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite

Country Status (2)

Country Link
FI (1) FI20045412A (fi)
WO (1) WO2006048507A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102802367A (zh) * 2012-08-06 2012-11-28 深圳崇达多层线路板有限公司 一种改善pth槽孔孔壁结合力的多层板制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03222396A (ja) * 1990-01-26 1991-10-01 Fujitsu Ltd 多層プリント配線板
JPH0582082U (ja) * 1992-04-08 1993-11-05 沖電気工業株式会社 多層プリント配線板
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
JPH07273455A (ja) * 1994-03-30 1995-10-20 Oki Electric Ind Co Ltd 多層セラミック基板及びその製造方法
JPH08186382A (ja) * 1994-12-28 1996-07-16 Murata Mfg Co Ltd 積層電子部品
DE60232383D1 (de) * 2001-03-14 2009-06-25 Ibiden Co Ltd Mehrschichtige Leiterplatte

Also Published As

Publication number Publication date
FI20045412A0 (fi) 2004-11-01
WO2006048507A1 (en) 2006-05-11

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ASPOCOMP TECHNOLOGY OY

Free format text: ASPOCOMP TECHNOLOGY OY

FD Application lapsed