FI20031653A - Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille - Google Patents

Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille Download PDF

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Publication number
FI20031653A
FI20031653A FI20031653A FI20031653A FI20031653A FI 20031653 A FI20031653 A FI 20031653A FI 20031653 A FI20031653 A FI 20031653A FI 20031653 A FI20031653 A FI 20031653A FI 20031653 A FI20031653 A FI 20031653A
Authority
FI
Finland
Prior art keywords
substrate
pattern
moving
phase mask
semiconductor substrate
Prior art date
Application number
FI20031653A
Other languages
English (en)
Swedish (sv)
Other versions
FI20031653A0 (fi
Inventor
Tomi Ryynaenen
Petri Melanen
Pekka Savolainen
Original Assignee
Modulight Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Modulight Inc filed Critical Modulight Inc
Priority to FI20031653A priority Critical patent/FI20031653A/fi
Publication of FI20031653A0 publication Critical patent/FI20031653A0/fi
Priority to PCT/FI2004/000677 priority patent/WO2005048338A1/en
Publication of FI20031653A publication Critical patent/FI20031653A/fi

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
FI20031653A 2003-11-13 2003-11-13 Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille FI20031653A (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20031653A FI20031653A (fi) 2003-11-13 2003-11-13 Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille
PCT/FI2004/000677 WO2005048338A1 (en) 2003-11-13 2004-11-12 A method and a semiconductor substrate for transferring a pattern from a phase mask to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031653A FI20031653A (fi) 2003-11-13 2003-11-13 Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille

Publications (2)

Publication Number Publication Date
FI20031653A0 FI20031653A0 (fi) 2003-11-13
FI20031653A true FI20031653A (fi) 2005-05-14

Family

ID=29558624

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031653A FI20031653A (fi) 2003-11-13 2003-11-13 Menetelmä ja puolijohdesubstraatti kuvion siirtämiseksi vaihemaskista substraatille

Country Status (2)

Country Link
FI (1) FI20031653A (fi)
WO (1) WO2005048338A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102445158B (zh) * 2011-09-23 2013-11-27 清华大学 一种制作高温散斑的方法
CN103837919B (zh) * 2014-03-06 2016-03-09 成都贝思达光电科技有限公司 一种基于双层胶纳米压印的光栅结构彩色滤光膜加工方法
CN111509073B (zh) * 2019-05-30 2022-09-20 中国科学院长春光学精密机械与物理研究所 一种柔性光电探测器件的制备方法及柔性光电探测器件
CN118249202A (zh) * 2024-03-26 2024-06-25 睿创光子(无锡)技术有限公司 一种带间级联激光器及其制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6380067B1 (en) * 2000-05-31 2002-04-30 Advanced Micro Devices, Inc. Method for creating partially UV transparent anti-reflective coating for semiconductors
US20020139771A1 (en) * 2001-02-22 2002-10-03 Ping Jiang Gas switching during an etch process to modulate the characteristics of the etch

Also Published As

Publication number Publication date
FI20031653A0 (fi) 2003-11-13
WO2005048338A1 (en) 2005-05-26

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MA Patent expired