FI20030022A0 - Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi - Google Patents

Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi

Info

Publication number
FI20030022A0
FI20030022A0 FI20030022A FI20030022A FI20030022A0 FI 20030022 A0 FI20030022 A0 FI 20030022A0 FI 20030022 A FI20030022 A FI 20030022A FI 20030022 A FI20030022 A FI 20030022A FI 20030022 A0 FI20030022 A0 FI 20030022A0
Authority
FI
Finland
Prior art keywords
controlling
temperature
semiconductor component
optoelectronic semiconductor
optoelectronic
Prior art date
Application number
FI20030022A
Other languages
English (en)
Swedish (sv)
Other versions
FI115872B (fi
FI20030022A (fi
Inventor
Jussi Pekka Larjo
Original Assignee
Oseir Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oseir Oy filed Critical Oseir Oy
Priority to FI20030022A priority Critical patent/FI115872B/fi
Publication of FI20030022A0 publication Critical patent/FI20030022A0/fi
Priority to AU2003290131A priority patent/AU2003290131A1/en
Priority to PCT/FI2003/000986 priority patent/WO2004061957A1/en
Publication of FI20030022A publication Critical patent/FI20030022A/fi
Application granted granted Critical
Publication of FI115872B publication Critical patent/FI115872B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
FI20030022A 2003-01-07 2003-01-07 Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi FI115872B (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20030022A FI115872B (fi) 2003-01-07 2003-01-07 Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi
AU2003290131A AU2003290131A1 (en) 2003-01-07 2003-12-30 Method and apparatus for temperature control of optoelectronic semiconductor components
PCT/FI2003/000986 WO2004061957A1 (en) 2003-01-07 2003-12-30 Method and apparatus for temperature control of optoelectronic semiconductor components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030022 2003-01-07
FI20030022A FI115872B (fi) 2003-01-07 2003-01-07 Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi

Publications (3)

Publication Number Publication Date
FI20030022A0 true FI20030022A0 (fi) 2003-01-07
FI20030022A FI20030022A (fi) 2004-07-08
FI115872B FI115872B (fi) 2005-07-29

Family

ID=8565271

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030022A FI115872B (fi) 2003-01-07 2003-01-07 Menetelmä ja laitteisto optoelektronisen puolijohdekomponentin lämpötilan säätämiseksi

Country Status (3)

Country Link
AU (1) AU2003290131A1 (fi)
FI (1) FI115872B (fi)
WO (1) WO2004061957A1 (fi)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1794571B1 (de) * 2004-09-14 2009-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum messen mindestens einer gaskomponente
WO2006122548A1 (en) * 2005-05-20 2006-11-23 Instrumatic Holding Aps Chemiluminescent gas analyser with a cooling unit for measuring oxides of nitrogen
US20070263684A1 (en) * 2006-05-09 2007-11-15 Nolan John F Method and system for cooling and pressurizing an imaging head
JP2010522333A (ja) 2007-03-23 2010-07-01 パーティクル・メージャーリング・システムズ・インコーポレーテッド 排出冷却式光源を備えた光学式パーティクルセンサ
DE102008010784B3 (de) * 2008-02-24 2009-05-20 Lorenzen, Dirk, Dr. Wärmeabfuhrtechnisch polyvalente Wärmeübertragungsvorrichtung für wenigstens ein Halbleiterbauelement sowie zugehöriges Test- und Betriebsverfahren
ITBO20080143A1 (it) * 2008-03-04 2009-09-05 Pada Eng Srl Dissipatore di calore, in particolare per componenti elettronici
CN101854027A (zh) * 2010-04-30 2010-10-06 西安炬光科技有限公司 一种用于半导体激光器的液体制冷器
EA201001075A1 (ru) * 2010-07-16 2011-02-28 Александр Николаевич Соколов Устройство охлаждения для электроаппаратуры
CN102623889B (zh) * 2012-04-11 2014-12-24 西安炬光科技有限公司 应用于半导体激光器的液体制冷器的制备方法及其制冷装置
US10215699B2 (en) * 2017-01-03 2019-02-26 Honeywell International Inc. Utilizing updraft flow in a fan-less dust sensor
CN111081659B (zh) * 2019-11-01 2022-04-26 锐捷网络股份有限公司 一种芯片散热装置及方法
CN113067249A (zh) * 2021-06-03 2021-07-02 北京凯普林光电科技股份有限公司 一种半导体激光器封装结构
CN114649725A (zh) * 2022-02-21 2022-06-21 武汉华日精密激光股份有限公司 固体激光器及其内各区域温度控制调节的结构以及方法
CN118507444A (zh) * 2023-02-08 2024-08-16 长鑫存储技术有限公司 半导体封装结构及制作方法
CN116565671A (zh) * 2023-07-12 2023-08-08 中国科学院长春光学精密机械与物理研究所 一种用于激光器的控温装置及控温方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000041998A (ja) * 1998-07-30 2000-02-15 Norisumi Asami 治療装置
US6108206A (en) * 1999-06-21 2000-08-22 General Electric Company Semiconductor thermal protection arrangement
US6370173B1 (en) * 1999-07-26 2002-04-09 Coronado Laser Co., L.L.C. Heat sink for hand-held, high power laser

Also Published As

Publication number Publication date
FI115872B (fi) 2005-07-29
WO2004061957A1 (en) 2004-07-22
AU2003290131A1 (en) 2004-07-29
FI20030022A (fi) 2004-07-08

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