AU2003290131A1 - Method and apparatus for temperature control of optoelectronic semiconductor components - Google Patents

Method and apparatus for temperature control of optoelectronic semiconductor components

Info

Publication number
AU2003290131A1
AU2003290131A1 AU2003290131A AU2003290131A AU2003290131A1 AU 2003290131 A1 AU2003290131 A1 AU 2003290131A1 AU 2003290131 A AU2003290131 A AU 2003290131A AU 2003290131 A AU2003290131 A AU 2003290131A AU 2003290131 A1 AU2003290131 A1 AU 2003290131A1
Authority
AU
Australia
Prior art keywords
temperature control
semiconductor components
optoelectronic semiconductor
optoelectronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003290131A
Inventor
Jussi Pekka Larjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oseir Oy
Original Assignee
Oseir Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oseir Oy filed Critical Oseir Oy
Publication of AU2003290131A1 publication Critical patent/AU2003290131A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2003290131A 2003-01-07 2003-12-30 Method and apparatus for temperature control of optoelectronic semiconductor components Abandoned AU2003290131A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20030022A FI115872B (en) 2003-01-07 2003-01-07 Method and apparatus for temperature control of an optoelectronic semiconductor component
FI20030022 2003-01-07
PCT/FI2003/000986 WO2004061957A1 (en) 2003-01-07 2003-12-30 Method and apparatus for temperature control of optoelectronic semiconductor components

Publications (1)

Publication Number Publication Date
AU2003290131A1 true AU2003290131A1 (en) 2004-07-29

Family

ID=8565271

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003290131A Abandoned AU2003290131A1 (en) 2003-01-07 2003-12-30 Method and apparatus for temperature control of optoelectronic semiconductor components

Country Status (3)

Country Link
AU (1) AU2003290131A1 (en)
FI (1) FI115872B (en)
WO (1) WO2004061957A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1794571B1 (en) * 2004-09-14 2009-03-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for measuring at least one gas component
WO2006122548A1 (en) * 2005-05-20 2006-11-23 Instrumatic Holding Aps Chemiluminescent gas analyser with a cooling unit for measuring oxides of nitrogen
US20070263684A1 (en) * 2006-05-09 2007-11-15 Nolan John F Method and system for cooling and pressurizing an imaging head
WO2008118769A1 (en) 2007-03-23 2008-10-02 Particle Measuring Systems, Inc. Optical particle sensor with exhaust-cooled optical source
DE102008010784B3 (en) * 2008-02-24 2009-05-20 Lorenzen, Dirk, Dr. Heat removal technology polyvalent heat transfer device for at least one semiconductor device and associated test and operating method
ITBO20080143A1 (en) * 2008-03-04 2009-09-05 Pada Eng Srl HEAT SINK, IN PARTICULAR FOR ELECTRONIC COMPONENTS
CN101854027A (en) * 2010-04-30 2010-10-06 西安炬光科技有限公司 Liquid refrigerator for semiconductor laser
EA201001075A1 (en) * 2010-07-16 2011-02-28 Александр Николаевич Соколов COOLING DEVICE FOR ELECTRICAL EQUIPMENT
CN102623889B (en) * 2012-04-11 2014-12-24 西安炬光科技有限公司 Method for preparing liquid refrigerator applied to semiconductor laser and refrigerating device thereof
US10215699B2 (en) * 2017-01-03 2019-02-26 Honeywell International Inc. Utilizing updraft flow in a fan-less dust sensor
CN111081659B (en) * 2019-11-01 2022-04-26 锐捷网络股份有限公司 Chip heat dissipation device and method
CN113067249A (en) * 2021-06-03 2021-07-02 北京凯普林光电科技股份有限公司 Semiconductor laser packaging structure
CN114649725A (en) * 2022-02-21 2022-06-21 武汉华日精密激光股份有限公司 Solid laser and structure and method for controlling and regulating temperature of each region in solid laser
CN116565671A (en) * 2023-07-12 2023-08-08 中国科学院长春光学精密机械与物理研究所 Temperature control device and temperature control method for laser

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000041998A (en) * 1998-07-30 2000-02-15 Norisumi Asami Therapy instrument
US6108206A (en) * 1999-06-21 2000-08-22 General Electric Company Semiconductor thermal protection arrangement
US6370173B1 (en) * 1999-07-26 2002-04-09 Coronado Laser Co., L.L.C. Heat sink for hand-held, high power laser

Also Published As

Publication number Publication date
FI20030022A (en) 2004-07-08
WO2004061957A1 (en) 2004-07-22
FI20030022A0 (en) 2003-01-07
FI115872B (en) 2005-07-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase