FI20012304A0 - Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo - Google Patents

Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo

Info

Publication number
FI20012304A0
FI20012304A0 FI20012304A FI20012304A FI20012304A0 FI 20012304 A0 FI20012304 A0 FI 20012304A0 FI 20012304 A FI20012304 A FI 20012304A FI 20012304 A FI20012304 A FI 20012304A FI 20012304 A0 FI20012304 A0 FI 20012304A0
Authority
FI
Finland
Prior art keywords
thin film
making
making thin
film
thin
Prior art date
Application number
FI20012304A
Other languages
English (en)
Swedish (sv)
Other versions
FI115200B (fi
FI20012304A (fi
Inventor
Ville Voipio
Original Assignee
Janesko Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Janesko Oy filed Critical Janesko Oy
Priority to FI20012304A priority Critical patent/FI115200B/fi
Publication of FI20012304A0 publication Critical patent/FI20012304A0/fi
Priority to US10/301,740 priority patent/US6875642B2/en
Publication of FI20012304A publication Critical patent/FI20012304A/fi
Application granted granted Critical
Publication of FI115200B publication Critical patent/FI115200B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
FI20012304A 2001-11-23 2001-11-23 Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo FI115200B (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20012304A FI115200B (fi) 2001-11-23 2001-11-23 Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo
US10/301,740 US6875642B2 (en) 2001-11-23 2002-11-22 Method for manufacturing thin film, and thin film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20012304 2001-11-23
FI20012304A FI115200B (fi) 2001-11-23 2001-11-23 Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo

Publications (3)

Publication Number Publication Date
FI20012304A0 true FI20012304A0 (fi) 2001-11-23
FI20012304A FI20012304A (fi) 2003-05-24
FI115200B FI115200B (fi) 2005-03-31

Family

ID=8562338

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20012304A FI115200B (fi) 2001-11-23 2001-11-23 Menetelmä ohutkalvon valmistamiseksi ja ohutkalvo

Country Status (2)

Country Link
US (1) US6875642B2 (fi)
FI (1) FI115200B (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070107759A (ko) * 2005-02-11 2007-11-07 스와겔로크 컴패니 유체 농도 감지 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3200961C2 (de) * 1981-01-14 1985-11-21 Ricoh Co., Ltd., Tokio/Tokyo Elektrophotographisches Aufzeichnungsmaterial und dessen Verwendung
JPS6122349A (ja) 1984-07-10 1986-01-30 Toshiba Corp 電子写真感光体
US4775820A (en) * 1984-07-31 1988-10-04 Canon Kabushiki Kaisha Multilayer electroluminescent device
JPH03142403A (ja) 1989-10-30 1991-06-18 Hitachi Ltd 偏光回転子
JPH05334721A (ja) 1992-06-03 1993-12-17 Oki Electric Ind Co Ltd 光記録媒体及びその製造方法
US5405710A (en) * 1993-11-22 1995-04-11 At&T Corp. Article comprising microcavity light sources
JP3246189B2 (ja) * 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
FI109730B (fi) * 1998-06-18 2002-09-30 Janesko Oy Sovitelma pH:n tai muun väriaineindikaattoreilla ilmaistavissa olevan kemiallisen ominaisuuden mittauksen yhteydessä
JP3409714B2 (ja) * 1998-10-20 2003-05-26 株式会社村田製作所 チップ状電子部品の製造方法
JP3486864B2 (ja) * 1999-09-13 2004-01-13 株式会社トッパン エヌイーシー・サーキット ソリューションズ 富山 基板上の銅配線形成方法及び銅配線の形成された基板
JP3611198B2 (ja) * 2000-02-16 2005-01-19 松下電器産業株式会社 アクチュエータとこれを用いた情報記録再生装置
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member

Also Published As

Publication number Publication date
US20030099778A1 (en) 2003-05-29
US6875642B2 (en) 2005-04-05
FI115200B (fi) 2005-03-31
FI20012304A (fi) 2003-05-24

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