ES537384A0 - Disposicion para la refrigeracion por ebullicion de un componente semiconductor de forma de pastilla - Google Patents

Disposicion para la refrigeracion por ebullicion de un componente semiconductor de forma de pastilla

Info

Publication number
ES537384A0
ES537384A0 ES537384A ES537384A ES537384A0 ES 537384 A0 ES537384 A0 ES 537384A0 ES 537384 A ES537384 A ES 537384A ES 537384 A ES537384 A ES 537384A ES 537384 A0 ES537384 A0 ES 537384A0
Authority
ES
Spain
Prior art keywords
pill
boiling
cooling
arrangement
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES537384A
Other languages
English (en)
Other versions
ES8507732A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of ES537384A0 publication Critical patent/ES537384A0/es
Publication of ES8507732A1 publication Critical patent/ES8507732A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ES537384A 1983-11-18 1984-11-05 Disposicion para la refrigeracion por ebullicion de un componente semiconductor de forma de pastilla Expired ES8507732A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833342104 DE3342104C2 (de) 1983-11-18 1983-11-18 Anordnung zur Siedekühlung eines zwischen zwei Wärmeableitern eingespannten scheibenförmigen Halbleiterbauelements

Publications (2)

Publication Number Publication Date
ES537384A0 true ES537384A0 (es) 1985-09-16
ES8507732A1 ES8507732A1 (es) 1985-09-16

Family

ID=6214909

Family Applications (1)

Application Number Title Priority Date Filing Date
ES537384A Expired ES8507732A1 (es) 1983-11-18 1984-11-05 Disposicion para la refrigeracion por ebullicion de un componente semiconductor de forma de pastilla

Country Status (4)

Country Link
AT (1) AT391774B (es)
CH (1) CH665731A5 (es)
DE (1) DE3342104C2 (es)
ES (1) ES8507732A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475432B2 (en) * 2000-08-15 2002-11-05 Ion Beam Applications, Inc. Carrier and support for work pieces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7503996U (de) * 1976-10-28 Siemens Ag, 1000 Berlin Und 8000 Muenchen Siedekühler für einen Thyristor
DE2907780A1 (de) * 1979-02-28 1980-09-11 Alsthom Atlantique Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird

Also Published As

Publication number Publication date
DE3342104C2 (de) 1986-10-30
ATA363384A (de) 1990-05-15
AT391774B (de) 1990-11-26
DE3342104A1 (de) 1985-05-30
ES8507732A1 (es) 1985-09-16
CH665731A5 (de) 1988-05-31

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970303