ES506173A0 - Un metodo para la electrodeposicion de un deposito de niquel semibrillante, ductil y exento de tension. - Google Patents

Un metodo para la electrodeposicion de un deposito de niquel semibrillante, ductil y exento de tension.

Info

Publication number
ES506173A0
ES506173A0 ES506173A ES506173A ES506173A0 ES 506173 A0 ES506173 A0 ES 506173A0 ES 506173 A ES506173 A ES 506173A ES 506173 A ES506173 A ES 506173A ES 506173 A0 ES506173 A0 ES 506173A0
Authority
ES
Spain
Prior art keywords
ductile
glossy
semi
voltage
free nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES506173A
Other languages
English (en)
Spanish (es)
Other versions
ES8302802A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Hooker Chemicals and Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals and Plastics Corp filed Critical Hooker Chemicals and Plastics Corp
Publication of ES8302802A1 publication Critical patent/ES8302802A1/es
Publication of ES506173A0 publication Critical patent/ES506173A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cosmetics (AREA)
ES506173A 1980-10-23 1981-10-09 Un metodo para la electrodeposicion de un deposito de niquel semibrillante, ductil y exento de tension. Granted ES506173A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19989480A 1980-10-23 1980-10-23

Publications (2)

Publication Number Publication Date
ES8302802A1 ES8302802A1 (es) 1983-01-16
ES506173A0 true ES506173A0 (es) 1983-01-16

Family

ID=22739453

Family Applications (1)

Application Number Title Priority Date Filing Date
ES506173A Granted ES506173A0 (es) 1980-10-23 1981-10-09 Un metodo para la electrodeposicion de un deposito de niquel semibrillante, ductil y exento de tension.

Country Status (15)

Country Link
JP (1) JPS6020475B2 (enrdf_load_stackoverflow)
AU (1) AU527954B2 (enrdf_load_stackoverflow)
BE (1) BE890836A (enrdf_load_stackoverflow)
BR (1) BR8106819A (enrdf_load_stackoverflow)
CA (1) CA1180677A (enrdf_load_stackoverflow)
CH (1) CH649579A5 (enrdf_load_stackoverflow)
DE (1) DE3139641C2 (enrdf_load_stackoverflow)
DK (1) DK422181A (enrdf_load_stackoverflow)
ES (1) ES506173A0 (enrdf_load_stackoverflow)
FR (1) FR2492849A1 (enrdf_load_stackoverflow)
GB (1) GB2085924B (enrdf_load_stackoverflow)
HK (1) HK66786A (enrdf_load_stackoverflow)
IT (1) IT1171598B (enrdf_load_stackoverflow)
NL (1) NL8104808A (enrdf_load_stackoverflow)
SE (1) SE8106250L (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1162505A (en) * 1980-10-31 1984-02-21 Donald R. Rosegren Process for high speed nickel and gold electroplate system
US4543166A (en) * 1984-10-01 1985-09-24 Omi International Corporation Zinc-alloy electrolyte and process
JP4904933B2 (ja) * 2005-09-27 2012-03-28 日立電線株式会社 ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔
KR102281132B1 (ko) * 2019-10-24 2021-07-26 일진머티리얼즈 주식회사 박막형 커패시터 제조용 전해니켈박 및 그의 제조방법
CN112323096A (zh) * 2020-09-23 2021-02-05 河北东恩企业管理咨询有限公司 一种含硫镍圆饼的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334032A (en) * 1964-05-08 1967-08-01 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3697391A (en) * 1970-07-17 1972-10-10 M & T Chemicals Inc Electroplating processes and compositions
ZA721964B (en) * 1971-04-01 1972-12-27 M & T Chemicals Inc Nickel plating

Also Published As

Publication number Publication date
ES8302802A1 (es) 1983-01-16
GB2085924A (en) 1982-05-06
DE3139641A1 (de) 1982-09-30
NL8104808A (nl) 1982-05-17
IT1171598B (it) 1987-06-10
HK66786A (en) 1986-09-18
IT8149529A0 (it) 1981-10-21
FR2492849A1 (fr) 1982-04-30
BE890836A (fr) 1982-04-22
GB2085924B (en) 1983-06-02
AU7567681A (en) 1982-04-29
JPS5794589A (en) 1982-06-12
DE3139641C2 (de) 1986-07-31
JPS6020475B2 (ja) 1985-05-22
FR2492849B1 (enrdf_load_stackoverflow) 1984-11-23
AU527954B2 (en) 1983-03-31
BR8106819A (pt) 1982-07-06
SE8106250L (sv) 1982-04-24
CH649579A5 (de) 1985-05-31
DK422181A (da) 1982-04-24
CA1180677A (en) 1985-01-08

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