Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
  • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
  • H03H9/02—Details
  • H03H9/05—Holders or supports
  • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
  • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
  • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
  • H01L2224/491—Disposition
  • H01L2224/4912—Layout
  • H01L2224/49175—Parallel arrangements

Landscapes

• Physics & Mathematics (AREA)
• Acoustics & Sound (AREA)
• Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
• Amplifiers (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=9747787

Family Applications (1)

Country Status (9)

Families Citing this family (1)

Family Cites Families (6)

• 1978
  • 1978-01-24 GB GB2882/78A patent/GB1602782A/en not_active Expired
• 1979
  • 1979-01-22 IT IT19510/79A patent/IT1109754B/it active
  • 1979-01-23 US US06/005,681 patent/US4247827A/en not_active Expired - Lifetime
  • 1979-01-23 FR FR7901659A patent/FR2415369A1/fr active Granted
  • 1979-01-23 DE DE19792902502 patent/DE2902502A1/de not_active Ceased
  • 1979-01-23 JP JP652079A patent/JPS54151388A/ja active Pending
  • 1979-01-24 NL NL7900562A patent/NL7900562A/xx not_active Application Discontinuation
  • 1979-01-24 BR BR7900452A patent/BR7900452A/pt unknown
  • 1979-01-24 ES ES477119A patent/ES477119A1/es not_active Expired

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