ES333330A1 - Procedure for the preparation of a film material in a predetermined form. (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for the preparation of a film material in a predetermined form. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES333330A1
ES333330A1 ES0333330A ES333330A ES333330A1 ES 333330 A1 ES333330 A1 ES 333330A1 ES 0333330 A ES0333330 A ES 0333330A ES 333330 A ES333330 A ES 333330A ES 333330 A1 ES333330 A1 ES 333330A1
Authority
ES
Spain
Prior art keywords
translation
preparation
machine
legally binding
google translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0333330A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Camera and Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera and Instrument Corp filed Critical Fairchild Camera and Instrument Corp
Publication of ES333330A1 publication Critical patent/ES333330A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Surface Treatment Of Glass (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

Process for the preparation of a film material in a predetermined form, characterized in that it comprises forming a pattern in a layer of a halide of group II (A), on a surface, leaving exposed a part thereof; forming a film of material on said drawing; and removing said halide layer from said surface, by means of which a predetermined configuration of said material is formed on said surface and on said exposed part. (Machine-translation by Google Translate, not legally binding)
ES0333330A 1965-11-26 1966-11-14 Procedure for the preparation of a film material in a predetermined form. (Machine-translation by Google Translate, not legally binding) Expired ES333330A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50982565A 1965-11-26 1965-11-26

Publications (1)

Publication Number Publication Date
ES333330A1 true ES333330A1 (en) 1967-08-16

Family

ID=24028228

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0333330A Expired ES333330A1 (en) 1965-11-26 1966-11-14 Procedure for the preparation of a film material in a predetermined form. (Machine-translation by Google Translate, not legally binding)

Country Status (10)

Country Link
US (1) USB509825I5 (en)
BE (1) BE687592A (en)
CH (1) CH480448A (en)
DE (1) DE1521255B2 (en)
DK (1) DK121522B (en)
ES (1) ES333330A1 (en)
FR (1) FR1504611A (en)
GB (1) GB1124894A (en)
NL (1) NL6612593A (en)
SE (1) SE319824B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH234069A4 (en) * 1969-02-17 1970-12-31
JPS5846193B2 (en) * 1980-07-15 1983-10-14 株式会社東芝 semiconductor equipment
DE3514094A1 (en) * 1985-04-16 1986-10-23 Schering AG, Berlin und Bergkamen, 1000 Berlin MANUFACTURE OF METALLIC STRUCTURES ON INORGANIC NON-CONDUCTORS

Also Published As

Publication number Publication date
DK121522B (en) 1971-10-25
SE319824B (en) 1970-01-26
USB509825I5 (en)
NL6612593A (en) 1967-05-29
GB1124894A (en) 1968-08-21
DE1521255B2 (en) 1971-03-11
CH480448A (en) 1969-10-31
DE1521255A1 (en) 1970-02-12
FR1504611A (en) 1967-12-08
BE687592A (en) 1967-03-01

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