CH480448A - Method of forming a thin layer - Google Patents

Method of forming a thin layer

Info

Publication number
CH480448A
CH480448A CH1525366A CH1525366A CH480448A CH 480448 A CH480448 A CH 480448A CH 1525366 A CH1525366 A CH 1525366A CH 1525366 A CH1525366 A CH 1525366A CH 480448 A CH480448 A CH 480448A
Authority
CH
Switzerland
Prior art keywords
forming
thin layer
thin
layer
Prior art date
Application number
CH1525366A
Other languages
German (de)
Inventor
Ivan Lehrer William
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of CH480448A publication Critical patent/CH480448A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
CH1525366A 1965-11-26 1966-10-21 Method of forming a thin layer CH480448A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50982565A 1965-11-26 1965-11-26

Publications (1)

Publication Number Publication Date
CH480448A true CH480448A (en) 1969-10-31

Family

ID=24028228

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1525366A CH480448A (en) 1965-11-26 1966-10-21 Method of forming a thin layer

Country Status (10)

Country Link
US (1) USB509825I5 (en)
BE (1) BE687592A (en)
CH (1) CH480448A (en)
DE (1) DE1521255B2 (en)
DK (1) DK121522B (en)
ES (1) ES333330A1 (en)
FR (1) FR1504611A (en)
GB (1) GB1124894A (en)
NL (1) NL6612593A (en)
SE (1) SE319824B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH234069A4 (en) * 1969-02-17 1970-12-31
JPS5846193B2 (en) * 1980-07-15 1983-10-14 株式会社東芝 semiconductor equipment
DE3514094A1 (en) * 1985-04-16 1986-10-23 Schering AG, Berlin und Bergkamen, 1000 Berlin MANUFACTURE OF METALLIC STRUCTURES ON INORGANIC NON-CONDUCTORS

Also Published As

Publication number Publication date
USB509825I5 (en)
BE687592A (en) 1967-03-01
DK121522B (en) 1971-10-25
GB1124894A (en) 1968-08-21
DE1521255A1 (en) 1970-02-12
SE319824B (en) 1970-01-26
ES333330A1 (en) 1967-08-16
NL6612593A (en) 1967-05-29
FR1504611A (en) 1967-12-08
DE1521255B2 (en) 1971-03-11

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Legal Events

Date Code Title Description
PL Patent ceased