ES325322A1 - Mejoras en la construccion de disipadores de calor para componentes electronicos diversos,especialmente para transistores. - Google Patents

Mejoras en la construccion de disipadores de calor para componentes electronicos diversos,especialmente para transistores.

Info

Publication number
ES325322A1
ES325322A1 ES0325322A ES325322A ES325322A1 ES 325322 A1 ES325322 A1 ES 325322A1 ES 0325322 A ES0325322 A ES 0325322A ES 325322 A ES325322 A ES 325322A ES 325322 A1 ES325322 A1 ES 325322A1
Authority
ES
Spain
Prior art keywords
transistors
translation
construction
machine
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0325322A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chausson Usines SA
Original Assignee
Chausson Usines SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chausson Usines SA filed Critical Chausson Usines SA
Publication of ES325322A1 publication Critical patent/ES325322A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ES0325322A 1965-04-07 1966-04-07 Mejoras en la construccion de disipadores de calor para componentes electronicos diversos,especialmente para transistores. Expired ES325322A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR12342A FR1439195A (fr) 1965-04-07 1965-04-07 Dissipateur de chaleur pour composants électroniques divers, notamment pour transistors

Publications (1)

Publication Number Publication Date
ES325322A1 true ES325322A1 (es) 1967-01-01

Family

ID=8575877

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0325322A Expired ES325322A1 (es) 1965-04-07 1966-04-07 Mejoras en la construccion de disipadores de calor para componentes electronicos diversos,especialmente para transistores.

Country Status (6)

Country Link
BE (1) BE679248A (de)
DE (1) DE1564562C3 (de)
ES (1) ES325322A1 (de)
FR (1) FR1439195A (de)
GB (1) GB1126079A (de)
NL (1) NL6604678A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4915858U (de) * 1972-05-12 1974-02-09
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置

Also Published As

Publication number Publication date
DE1564562A1 (de) 1970-10-15
BE679248A (de) 1966-09-16
GB1126079A (en) 1968-09-05
DE1564562C3 (de) 1974-04-18
FR1439195A (fr) 1966-05-20
NL6604678A (de) 1966-10-10
DE1564562B2 (de) 1973-09-13

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