ES2644261A1 - Procedimiento de control de un sistema matricial de marcaje láser - Google Patents

Procedimiento de control de un sistema matricial de marcaje láser Download PDF

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Publication number
ES2644261A1
ES2644261A1 ES201630699A ES201630699A ES2644261A1 ES 2644261 A1 ES2644261 A1 ES 2644261A1 ES 201630699 A ES201630699 A ES 201630699A ES 201630699 A ES201630699 A ES 201630699A ES 2644261 A1 ES2644261 A1 ES 2644261A1
Authority
ES
Spain
Prior art keywords
matrix
laser marking
variable
image
translation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES201630699A
Other languages
English (en)
Other versions
ES2644261B1 (es
Inventor
Sven Alexander Vogler
Valenti Boira Plans
Joan CAMPS CLARAMUNT
Francesc Bravo Montero
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Macsa ID SA
Original Assignee
Macsa ID SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macsa ID SA filed Critical Macsa ID SA
Priority to ES201630699A priority Critical patent/ES2644261B1/es
Priority to PL17382286.7T priority patent/PL3251783T3/pl
Priority to EP17382286.7A priority patent/EP3251783B9/en
Priority to ES17382286T priority patent/ES2924123T3/es
Priority to US15/604,578 priority patent/US10265967B2/en
Priority to JP2017104269A priority patent/JP6518719B2/ja
Publication of ES2644261A1 publication Critical patent/ES2644261A1/es
Application granted granted Critical
Publication of ES2644261B1 publication Critical patent/ES2644261B1/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T9/00—Image coding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/455—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using laser arrays, the laser array being smaller than the medium to be recorded

Abstract

Procedimiento de control de un sistema matricial de marcaje láser, comprendiendo el sistema matricial una matriz N x M de láseres para realizar la marcación láser, comprendiendo el procedimiento la transformación secuencial de al menos dos imágenes a marcar en una serie de órdenes de marcado según una matriz de puntos N x M, el cual comprende las siguientes fases: - división de una primera imagen en una parte fija y una parte variable, - transformación de la parte fija en una matriz fija y la parte variable en una matriz variable, - unión de las citadas matrices fija y variable, - marcado láser de la primera imagen, - procesamiento de una segunda imagen, obtención de una nueva matriz variable que sumada a la anterior matriz fija, se obtiene una nueva matriz completa, - marcado láser de la segunda imagen.

Description

imagen1
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Claims (1)

  1. imagen1
    imagen2
    imagen3
ES201630699A 2016-05-27 2016-05-27 Procedimiento de control de un sistema matricial de marcaje láser Active ES2644261B1 (es)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES201630699A ES2644261B1 (es) 2016-05-27 2016-05-27 Procedimiento de control de un sistema matricial de marcaje láser
PL17382286.7T PL3251783T3 (pl) 2016-05-27 2017-05-19 Procedura sterowania układem macierzy do znakowania laserowego
EP17382286.7A EP3251783B9 (en) 2016-05-27 2017-05-19 Procedure for controlling a laser marking matrix system and laser marking matrix system
ES17382286T ES2924123T3 (es) 2016-05-27 2017-05-19 Procedimiento de control de un sistema matricial de marcaje láser y sistema matricial de marcaje láser
US15/604,578 US10265967B2 (en) 2016-05-27 2017-05-24 Control procedure for a laser marking matrix system
JP2017104269A JP6518719B2 (ja) 2016-05-27 2017-05-26 レーザーマーキングマトリクスシステムを制御する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201630699A ES2644261B1 (es) 2016-05-27 2016-05-27 Procedimiento de control de un sistema matricial de marcaje láser

Publications (2)

Publication Number Publication Date
ES2644261A1 true ES2644261A1 (es) 2017-11-28
ES2644261B1 ES2644261B1 (es) 2018-03-15

Family

ID=58873758

Family Applications (2)

Application Number Title Priority Date Filing Date
ES201630699A Active ES2644261B1 (es) 2016-05-27 2016-05-27 Procedimiento de control de un sistema matricial de marcaje láser
ES17382286T Active ES2924123T3 (es) 2016-05-27 2017-05-19 Procedimiento de control de un sistema matricial de marcaje láser y sistema matricial de marcaje láser

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES17382286T Active ES2924123T3 (es) 2016-05-27 2017-05-19 Procedimiento de control de un sistema matricial de marcaje láser y sistema matricial de marcaje láser

Country Status (5)

Country Link
US (1) US10265967B2 (es)
EP (1) EP3251783B9 (es)
JP (1) JP6518719B2 (es)
ES (2) ES2644261B1 (es)
PL (1) PL3251783T3 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2572988B (en) 2018-04-18 2022-05-11 Datalase Ltd Improvements in or relating to laser marking
BR112020024318A2 (pt) 2018-07-05 2021-02-23 Tetra Laval Holdings & Finance Sa sistema de marcação por ablação a laser para prover uma imagem a uma folha contínua de material de acondicionamento, dispositivo de marcação, e, método para prover uma imagem a uma folha contínua de material de acondicionamento
CN110064848A (zh) * 2019-05-31 2019-07-30 大族激光科技产业集团股份有限公司 一种打标装置
CN110052720A (zh) * 2019-06-12 2019-07-26 大族激光科技产业集团股份有限公司 一种激光打标检测装置及系统
CN110405355B (zh) * 2019-08-02 2021-01-26 中山镭曼智能科技有限公司 一种基于最短光束重定位时间的最优化标刻次序规划方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823416A (ja) * 1994-07-06 1996-01-23 Ricoh Co Ltd 画像形成装置
EP0950973A2 (en) * 1998-03-17 1999-10-20 Macsa ID, S.A. Laser Marking System
EP1463296A2 (en) * 2003-03-28 2004-09-29 Konica Minolta Holdings, Inc. Image forming method and image forming apparatus
JP2011259189A (ja) * 2010-06-09 2011-12-22 Konica Minolta Business Technologies Inc 画像形成装置、画像処理方法及びプログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264178A (ja) * 1990-03-14 1991-11-25 Hitachi Ltd レーザマーカ用マスク
US5337325A (en) * 1992-05-04 1994-08-09 Photon Imaging Corp Semiconductor, light-emitting devices
JPH05309482A (ja) * 1992-05-08 1993-11-22 Komatsu Ltd レーザ刻印装置
DE4234342C2 (de) * 1992-10-12 1998-05-14 Fraunhofer Ges Forschung Verfahren zur Materialbearbeitung mit Laserstrahlung
ES2106520T3 (es) * 1993-05-19 1997-11-01 Fraunhofer Ges Forschung Procedimiento que permite el trabajo de materiales por radiacion emitida por diodos.
ES2192485B1 (es) * 2002-03-21 2005-03-01 Macsa Id, S.A. "procedimiento de marcaje mediante haz de rayos laser por proyeccion de imagenes".
FI124558B (fi) * 2011-08-03 2014-10-15 Upm Kymmene Corp Menetelmä ja järjestelmä tuotteen merkitsemiseksi

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823416A (ja) * 1994-07-06 1996-01-23 Ricoh Co Ltd 画像形成装置
EP0950973A2 (en) * 1998-03-17 1999-10-20 Macsa ID, S.A. Laser Marking System
EP1463296A2 (en) * 2003-03-28 2004-09-29 Konica Minolta Holdings, Inc. Image forming method and image forming apparatus
JP2011259189A (ja) * 2010-06-09 2011-12-22 Konica Minolta Business Technologies Inc 画像形成装置、画像処理方法及びプログラム

Also Published As

Publication number Publication date
PL3251783T3 (pl) 2022-10-10
JP2017209730A (ja) 2017-11-30
JP6518719B2 (ja) 2019-05-22
US20180001659A1 (en) 2018-01-04
EP3251783A1 (en) 2017-12-06
US10265967B2 (en) 2019-04-23
EP3251783B9 (en) 2022-09-21
ES2924123T3 (es) 2022-10-04
ES2644261B1 (es) 2018-03-15
EP3251783B1 (en) 2022-07-27

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