ES2640050T3 - Article comprising a film on a carrier or release substrate - Google Patents

Abstract

Article, comprising a curable film on a release substrate and / or a carrier substrate, wherein the curable film comprises: (a) at least one cyanoacrylate monomer selected from compounds of formula (I), ** (See formula) ** in which R1 is a divalent linking group comprising 1 to 10 carbon atoms and A represents a C5-C50 aryl residue or a C2-C50 heteroaryl residue and (b) at least one (co) polymer film maker.

Description

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DESCRIPTION

Article comprising a film on a carrier or release substrate Field of the invention

The present invention relates to an article comprising a curable film on a carrier substrate and / or release substrate, in which the film comprises at least one specific cyanoacrylate monomer and at least one film forming (co) polymer.

Background of the invention

Adhesive tapes and labels are attractive products from the point of view of consumer compliance in that they are easy to handle and store and find utility in a wide range of bonding and masking applications, including electrical, electronic, union components, Aerospace and audioMdeo.

Pressure sensitive adhesives are common components of adhesive tapes. Pressure sensitive adhesives are viscoelastic materials and can be provided without a carrier in the form of transfer tapes or with a carrier base in the form of single-sided or double-sided tapes. They remain permanently tacky for a prolonged period of time and only require minimal pressure to adhere to a surface, even surfaces that are difficult to bond to, such as polyethylene or polypropylene. Normally, they can be removed without leaving any adhesive residue and without destroying the bonded parts.

The applications of prior art contact adhesives are generally limited to operations in which the requirements related to bond strength and / or heat resistance are not demanding. In this way, there is a need for a heat resistant adhesive tape that combines a high initial tack and a high structural adhesion strength and that shows good adhesion to a wide variety of different substrates.

For example, US Patent Publication No. 2012/0082818 from Nitto Denko Corporation discloses pressure sensitive adhesive tapes. In particular, pressure sensitive adhesive tapes disclosed in U.S. 2012/0082818 comprise a silicone based release layer on which a pressure sensitive adhesive layer dispersed in water is applied. The pressure sensitive adhesive layer dispersed in water contains an acrylic polymer and a fixing resin dispersed in the water. The pressure sensitive adhesive tapes disclosed in U.S. 2012/0082818 are free of any solvent based on aromatic hydrocarbon, such as toluene. Consequently, volatile organic carbon (VOC) emissions from tapes are minimized.

The prior art pressure sensitive adhesive tapes can be single-sided or double-sided. Double-sided pressure sensitive adhesive tapes are reported in, for example, US Patent Publication No. US2012 / 0115405, of Nitto Denko Corporation. In said patent application, the double-sided tape consists of a substrate coated on a first face with a rubber-based pressure sensitive adhesive and a second layer with an acrylic-based pressure sensitive adhesive.

International Patent Publication No. W02010 / 069800 of Tesa Se et al. describes a pressure sensitive adhesive consisting of a homogeneous mixture of at least one component of natural rubber and at least one polyacrylate component in order to achieve improved properties of cohesion, aging and also resistance to atmospheric agents. The pressure sensitive adhesive can be used on a tape.

European Patent No. EP2283100 B1 from Tesa A mass of pressure-sensitive adhesive is disclosed comprising, among others, a combination of a mixture of thermoplastic and / or non-thermoplastic elastomer polymers with vinyl aromatic block copolymer and adhesive resin The pressure sensitive adhesive can be used on a tape.

International Patent Publication No. WO2010 / 023229, of Loctite (R&D) Limited and Henkel AG & Co. KGaA discloses curable cyanoacrylate-based films that can be dispensed from a release substrate. A particular film disclosed consists of a combination of a neopentyl cyanoacrylate and a rubber component. The production process associated with said particular film is expensive due to the vapor pressure of the neopentyl cyanoacrylate.

Guseva et al. (Russian Chemical Bulletin volume 43, number 4, pages 595 to 598) describe the conditions for the synthesis of functionalized 2-cyanoacrylates. Khrustalev et al. (Russian Chemical Bulletin volume 45, number, pages 2172 to 2176) disclosed the synthesis and carried out a structural x-ray study of 1-adamantylmethyl 2-cyanoacrylate and 1,10-decanediol bis-2-cyanoacrylate.

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Notwithstanding the state of the art, there is still a need for alternative adhesive tape formulations that show improved coating properties on carrier and release substrates, show high initial tack and show improved adhesive power. In accordance with the foregoing, it would be desirable to provide a carrier, such as a (transfer) tape that exhibits good storage stability, shows good adhesion to a wide variety of substrates, resulting from simple and economical fabrication, and showing combination of high initial tack and bond strength.

Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates with high flexibility and high bond strength would be particularly advantageous for certain applications, such as in the electronics industry for adhesive components or in the textile industry for example as alternative to sewing. In particular, it is desirable to provide robust textile assemblies with sturdy seams, providing flexibility in design and aesthetics.

Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates, which can be easily applied and cut and stamped, are highly desirable, for example, in utilization in automated production processes. Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates that are effective in adhesive substrates, such as textiles, and which are capable of withstanding very wet media, such as during washing, and elevated temperatures and physical stresses, such as those experienced in the washing and drying cycles, are highly desirable, for example, in the manufacture of clothing.

Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates, find utility in a wide range of applications, including adhesive and masking applications, particularly in the construction industry. However, exposure to moisture, such as that occurring under conditions of high humidity and / or exposure to harsh environmental conditions often reduces its applicability.

Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates, which are resilient under high humidity, for example, in damp media, would be highly advantageous, because often in such media, including bathrooms , the article may form a union in which the force of cohesion is compromised, or the force of said union may deteriorate to an unsatisfactory degree over time.

Adhesive cartridges, such as adhesive tapes, transfer tapes, labels and laminates, which are effective in bonding ceramics, steel, wood, glass, rubber and plastics, etc., are highly desirable since at least some of these are often Substrates are difficult to bond with a strong and / or durable bond. The above is especially the case where the medium can also compromise the initial or aged cohesive force, such as, for example, in media where arduous conditions and / or exposure to moisture, etc., occur.

Summary description of the invention

The present invention provides adhesive cartridges, such as adhesive tapes, transfer tapes, labels, laminates and the like.

In a first aspect, the present invention provides a film comprising a curable film on a release substrate and / or carrier substrate, in which the film comprises:

(a) at least one cyanoacrylate monomer selected from among compounds of formula (I),

CN

image 1

wherein R is a divalent bonding group comprising 1 to 10 carbon atoms and A represents a C5-C50 aryl residue or a C2-C50 heteroaryl residue, and

(b) at least one (co) number of peKcula forming.

As used herein, the term "aryl residue" refers to an aromatic carbodicylic structure that is monodyl or polycyclic (not fused or fused). Similarly, the term "heteroaryl" refers to a

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aromatic heterodical structure that presents as ring elements, atoms of at least two different elements. The heteroaryl residue can be monodyl or polydyl (not fused or fused). The carbon atoms of the aryl or heteroaryl residue may optionally be substituted one or more times, for example, with at least one of a cyano group, a nitro group, a halogen, a C1-C10 alkyl, a C1-C10 ether, a C1-C10 thioether, a C1-C10 ester, a C1-C10 ketone, a C1-C10 ketimine, a C1-C10 sulfone, a C1-C10 sulfoxide, a C1-C10 primary amide or a C1-C20 secondary amide.

As used herein, the term "release substrate" refers to a material that acts as a protective cover for the curable film and prevents unwanted adhesion and contamination of the adhesive surface during transport and handling. The release substrate can be coated on one or two sides with a release agent and can be removed to remove sticky materials, such as pressure sensitive adhesives, without adversely affecting the integrity of the curable film.

Referring to the article of the present invention, the release substrate may be paper or plastic-based materials (eg, PET, PE, HDPE or PP), which are optionally coated with a release agent.

The release agents allow the adhesive films of the article of the present invention to be easily transferred from the release substrate to the article of interest. The release agent can be selected from the group consisting of polyvinyl alcohol, clays, siloxanes and combinations thereof. Suitable release agents, in particular siloxane-based agents, are available under the trade name SILCOLEASE®.

As used herein, the term "carrier substrate" refers to a material on which the curable film can be applied to stabilize the adhesive. The carrier substrate can add thickness to the article so as to improve its handling. The carrier substrate differs from the release substrate in that it cannot be removed from the curable film without adversely affecting the integrity of the curable film.

The carrier substrate can be flexible, for example, a flexible sheet. The carrier substrate can be selected from polymeric films, metal sheets, foams, fabrics and combinations thereof. For example, the carrier substrate can be selected from the group consisting of polyester, polypropylene, polyethylene, foam and paper.

Within the context of the present specification, the term (co) polymer refers to a polymer derived from a single polymeric species or to a polymer derived from two (or more) monomeric species.

The expression (co) film-forming polymer refers to a (co) polymer material which, formulated with the cyanoacrylate monomer of formula (I) provides a curable film.

The film-forming component can help assist in the solidification of any liquid component of the composition. The above increases the overall viscosity of the combined materials, allowing them to be retained on the transfer substrate. The film forming component may comprise a film forming agent that can be at least one elastomeric additive component. In the case that solid cyanoacrylates are used, there is usually less need to add film-forming agent since the curable component will settle on the substrate after application. In the case where compositions comprising mixtures of solid and liquid cyanoacrylates are used, a suitable amount of a film-forming component can be added to the composition as compensation for the level of the liquid curable component present. In particular, for solid monomeric materials that can form non-coherent films, for example, due to the crystalline nature when applied, the film-forming components provide a structure or scaffolding suitable to provide a coherent film. The coherent film can be achieved by a combination of film-forming components and co-curing agents.

Advantageously, the curable films of the articles of the present invention show adhesion properties sensitive to pressure at 23 ° C. The subsequent curing of the films can be started as appropriate. For example, an external stimulus, such as heat or radiation (for example, UV curing) can be applied to induce curing of curable films if desired.

As used herein, the term "pressure sensitive adhesion properties" refers to materials and formulations that are permanently tacky and adhere under finger pressure. More particularly, said expression is used for materials or formulations that have a glass transition temperature (Tg) of less than 25 ° C and a G 'storage module of 3.3 x 105 Pa at less than 23 ° C, in which the glass transition temperature (Tg) is determined by differential scanning calorimetry (CBD) and the storage module G 'is determined by dynamic mechanical analysis (AMD) at 1 Hz and at 23 ° C.

Many materials with high bond strength used in packaging and encapsulation technology (eg, epoxy and silicon-based materials) are rigid. The lack of flexibility often prevents these materials from being applied to flexible optical devices. The application of liquid adhesives involves the formation of

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small drops, hindering the precise thin distribution on a substrate. The articles of the invention are typically highly flexible and the amount of adhesive applied to a substrate with high precision can be determined from the amount used of the article of the invention. The foregoing implies that the articles of the invention are particularly useful in applications where flexibility is required throughout the adhesion line.

Thin layer adhesives of high flexibility, high bond strength and a high refractive index are desired for flexible encapsulation, packaging and fixing of optical devices (sensors, diodes, fibers, lenses, etc.), flexible (tactile) screens ( LCD, plasma screens, etc.), in the photovoltaic industry and in the adhesion of chips, etc., and this can be achieved with the articles of the present invention, for example, with tapes of the present invention.

The term "divalent binding group" refers to a fraction that binds the unsaturated oxygen of the ester functional group with the aryl residue.

Referring to the cyanoacrylate monomer of the article of the present invention, the variable A may be a C5-C50 aryl residue.

For example, the cyanoacrylate monomer can be selected from among the compounds of formula (II),

formula (II)

where n is 0 to 5, R2 is a C1-5 alkylene group and each R3, if present, is independently selected from C1-C10 alkyl, C1-C10 alkoxy, fluorine, chlorine, bromine, cyano and nitro

As used herein, the term "Cx-Cy alkyl" comprises unbranched Cx-Cy alkyl, branched Cx-Cy alkyl and combinations thereof. The expression "Cx-Cy alkylene group" should be construed as "Cx-Cy alkyl".

The cyanoacrylate monomer may have a melting point at 1,013.25 mbar greater than 25 ° C.

With reference to the compounds of formula (II), n may be 0 to 2, R2 may be a C1-3 alkylene group and each R3, if present, is independently selected from C1-C10 alkyl, C1- alkoxy C10, fluorine, chlorine, bromine, cyano and nitro. For example, n can be 0 to 2, R2 can be a C1-3 alkylene group and each R3, if present, can be independently selected from fluorine, chlorine, bromine, cyano and nitro. In another embodiment, n can be 0 and R2 can be a C1-5 alkylene group. For example, n can be 0 and R2 can be a C1-3 alkylene group.

The cyanoacrylate monomer can be 2-phenylethyl 2-cyanoacrylate, that is, in formula (II), R2 is C2H4 and n is 0.

The cyanoacrylate monomer of general formula (I) can be present in an amount of at least 15% by weight with respect to the total weight of the film. For example, the cyanoacrylate monomer may be present in an amount of between 20% by weight and 80% by weight with respect to the total weight of the curable film.

The cyanoacrylate monomer of general formula (I) can also be present in an amount of at least 10% by weight with respect to the total weight of the film. For example, the cyanoacrylate monomer may be present in an amount between 10% by weight and 90% by weight with respect to the total weight of the curable film.

The (co) film-forming polymer may be present in an amount of between 20% by weight and 85% by weight with respect to the total weight of the film.

The (co) film-forming polymer may be present in an amount of between 10% by weight and 90% by weight with respect to the total weight of the film.

The film-forming (co) polymer can be selected from the group consisting of poly (meth) acrylates, polyvinyl ethers, natural rubbers, polyisoprenes, polybutadienes, polyisobutylenes, polychloroprenes, butadiene acrylonitrile polymers, thermoplastic elastomers, styrene-isoprenes , styrene-isoprene-styrene block copolymers, ethylene-propylene-diene polymers, styrene-butadiene polymers, poly-alpha-olefins, silicones, ethylene-containing copolymers, ethylene-vinyl acetate acetate and combinations thereof . Preferably, the (co) film-forming polymer may comprise poly (meth) acrylates and / or ethylene-vinyl acetate.

image2

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The film forming co-polymer can be a co-polymer with pressure sensitive adhesion properties at 23 ° C.

The film forming co-polymer can be a (co) polymer of (meth) acrylic acid, esters of (meth) acrylic acid and optionally other comonomers.

The (co) poform forming film may have an acid number of between about 0 and about 30. Preferably, the (co) polymer forming film has an acid number less than 15. The acid number is the weight in milligrams of KOH necessary to neutralize the pendant carboxylate groups in one gram of the (co) poftimer. The method of determining the acidity index of the (co) polymer is described in the experimental section, see below.

The film forming co-polymer can be a copolymer of ethylene and vinyl acetate. The ethylene and vinyl acetate copolymer may have a vinyl acetate content of between 50% by weight and 98% by weight with respect to the total weight of the copolymer of ethylene and vinyl acetate.

The curable films of the articles of the present invention show pressure sensitive adhesion properties at 23 ° C. The curable film of the article of the present invention may have a storage module G ', measured by dynamic mechanical analysis (AMD) at 1 Hz and at 23 ° C of approximately 3.3 x 105 Pa or less.

The curable film of the article of the present invention can return to a tack value of at least 3 N in the standard tack test of a loop measured in accordance with DIN EN 1719.

The curable film of the article of the present invention may have a glass transition temperature (Tg) below 10 ° C as determined by differential scanning calorimetry (CBD). For example, the curable film may have a glass transition temperature determined by CBD between -60 ° C and + 10 ° C.

The curable film of the article of the present invention may have a 180 ° peel strength between 3 N / 25 mm and 50 N / 25 mm after 10 min. according to DIN EN 1939 (Afera 5001) measurement on steel substrate at 23 ° C.

The curable film used in the present invention may, in its uncured state, have a G 'module at room temperature of approximately 3.3 x 105 Pa or less, measured by AMD at 1 Hz and may return to a tack value of at least 3 N, preferably at least 5 N, in the standard test for stickiness of a loop measured according to DIN EN 1719.

The curable film used in the present invention may, in its uncured state, have a G 'module at room temperature of approximately 3.3 x 105 Pa or less, measured by AMD at 1 Hz and may have a glass transition temperature ( Tg) below 10 ° C, for example, between -60 ° C and + 10 ° C determined by differential scanning calorimetna (CBD).

The curable film used in the present invention may, in its uncured state, have a glass transition temperature (Tg) of less than 10 ° C, for example, between -60 ° C and + 10 ° C determined by differential scanning calorimetna (CBD) and can return to a tack value of at least 3 N, preferably at least 5 N in the standard test of tack of a loop measured according to DIN EN 1719.

The curable film used in the present invention may have, in its uncured state, a module G 'at room temperature of approximately 3.3 x 10 5 Pa or less, measured by CBD at 1 Hz, a glass transition temperature (Tg ) below 10 ° C, for example between -60 ° C and + 10 ° C determined by differential scanning calorimetna (CBD) and can return to a tack value of at least 3 N, preferably at least 5 N in the standard test of stickiness of a loop measured according to DIN EN 1719.

The curable film used in the article of the present invention may comprise, in addition to the solid cyanoacrylate of formula (I), a matrix-forming (co) polymeric substance selected from the group consisting of poly (meth) acrylates, polyvinyl ethers, natural rubbers, polyisoprenes, polybutadienes, polyisobutylenes, polychloroprenes, butadiene-acrylonitrile poftmeros, thermoplastic elastomers, styrene-isoprenes, styrene-isoprene-styrene block copolymers, ethylene-propylene-styrene-pyrylene butadiene, poly-alpha-olefins, silicones, co-polymers containing ethylene, ethylene-vinyl acetate and combinations thereof. Preferably, the peftula-forming (co) polymeric matrix substance may comprise poly (meth) acrylates and / or ethylene-vinyl acetates.

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(a) between 15% and 80% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 20% and 85% by weight of one or more (co) peffcula-forming poffmeros, and

(c) between 0% and 65% by weight of one or more additives.

For example, the film may comprise, with respect to the total weight of the film:

(a) between 40% and 60% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 40% and 60% by weight of one or more (co) peffcula-forming poffmeros, and

(c) between 0% and 20% by weight of one or more additives.

With reference to the article of the present invention, the film may comprise, with respect to the total weight of the film:

(a) between 10% and 90% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 10% and 90% by weight of one or more (co) peffcula-forming poffmeros, and

(c) between 0% and 65% by weight of one or more additives.

The film of the present invention may further comprise one or more additives selected from cyanoacrylate poffmeros, tackifiers, plasticizers, hardening agents, antioxidants, stabilizers, pigments, water absorbing agents and / or combinations thereof.

Suitable pigments include, but are not limited to, naphthol green, coumarin, carotene, m-cresol violet, Cu (II) phthalocyanine, phenol, anthraquinone, benzodifuranone, polymetin, styryl, carbonium, triphenylmethane, diphenylmethane, triphenoxazine, Phthalocinin quinoftalone, naphthol, stilbene, formazan, xanthene, triarylmethane, carotenoid, flavonol, flavone, chromane, poly caramel co-polymers (hydroxyethyl methacrylate), riboflavin and derivatives and mixtures thereof.

Examples of filler components include, but are not limited to, for example, slices, quartz, alumina, calcium, clays, talcs and other inorganic fillers, such as polycarbonates and other poffimer powders, along with certain components. acrylate

Examples of stabilizing components that can be conveniently used in the adhesive film of the present invention include hydroquinone, pyrocatechol, resorcinol or derivatives thereof, phenols, sulfur dioxide, sulfuric acid, alkyl sulfonic acids, aromatic sulfonic acids, borane and combinations. thereof. For example, the stabilizer can be selected from methanesulfonic acid (AMS), BF3, SO2 and combinations thereof. Conveniently, the stabilizer may be selected from camphorsulfonic acid (ACS) or hydroquinone and combinations thereof.

Preferred examples of pigments that can be conveniently used in the adhesive film of the present invention include naphthol green carotene, coumarin, m-cresol violet and Cu (II) phthalocyanine.

Cyanoacrylate compositions are typically relatively sensitive to certain materials, for example, nucleophiles, since they tend to react with the cyanoacrylate component. However, the curable film of the present invention is quite robust and not as sensitive to nucleophiles as expected.

This unexpected result can be used in many ways. One of the many ways is the optical components industry. Many components that confer color (often referred to as dyes, dyes, and pigments) used in, for example, electronic or optical components or devices, such as LEDs, portable devices and LCDs containing nucleophilic groups such as -OH, -NH, etc. The curable leveling film may thus unexpectedly include components comprising nucleophilic groups, such as components that confer color without adversely affecting the initial or aging adhesive behavior. The above implies that the invention can be used in applications in which a component that confers color that has one or more nucleophilic groups is part of the curable film and, thus, the articles of the invention are easily used in a range of applications. , including in optical devices.

In one embodiment of the invention, the article of the invention is at least translucent and desirably transparent. Transparent materials, such as transparent tapes used in optoelectronics and in optical packaging (lenses, encapsulants, etc.), should provide a maximum refractive index. The articles of the invention may function better than existing high refractive index tapes (for example, some commercially available products present have a refractive index value of 1.47). Desirable refractive index values for the curable form of the curable film are in the range of about 1.45 to about 1.6. Preferred values of

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Refractive index for the cured form of the curable film is in the range of about 1.47 to about 1.55. The refractive index can be further increased by mixing other polymers or exchanging the film-forming polymer.

Liquid adhesives as such form drops. The size of these drops may vary and with it, the size of the adhesive applied. The application of exactly the required quantities of an adhesive that is in liquid form can be difficult and an additional challenge is the uniform distribution on the applied adhesive surface, which may be impossible. The adhesive layer is often thick, not flexible enough, even fragile and this results in lower bonding forces. The advantage of a liquid adhesive lies in its adhesive strength.

The articles of the present invention, comprising a curable film, can be manufactured to be thin and flexible, have a regular shape and, for example, can have a uniform surface, can be repositioned and cut in any required form (for example, by die cutting ). For these reasons, the adhesive articles of the present invention, such as tapes, are preferred for some applications.

The development of articles, such as tapes, that provide optical clarity, flexibility and high adhesion strength simultaneously remains a challenge. Consequently, liquid adhesives, which provide high adhesive strength, are frequently used, for example, in electronic devices, such as mobile phones that are exposed to mechanical stress, impact or heat. Desirably, the article of the present invention, for example, in the form of a tape, is thin. An article of the invention can demonstrate high adhesive strength, flexibility, optical clarity and refractive index, and can be punched out.

Indeed, not only can the articles of the invention be used in the aforementioned applications, but they have also been found to be suitable for a whole range of substrates, such as glass and other substrates, including anodized aluminum, PC / ABS and others. which are frequently used in devices, such as optical components. The joint provided by the present invention is typically superior than that of pre-existing tapes.

The article of the invention, for example, a tape, is not only thin but also simultaneously provides a strong bond, while also maintaining its flexibility.

This combination of features makes it highly applicable in applications where flexibility is required, for example, in the union of flexible substrates, such as laminates and in the fabric manufacturing industry. Sometimes it is desirable to avoid the use of sewing points and seams for aesthetic reasons or other reasons (for example, seams without stitches in sportswear and footwear, such as running and hiking shoes).

A tape distributes the mechanical stress on a larger surface, no weak points are observed due to the perforation with thread. Examples in which the function is the main criterion are high performance fabrics / laminates that are used for applications such as parachutes, military clothing, body armor, sportswear and sports equipment, automotive fabrics and agricultural fabrics.

Many hot melt adhesives used in laminating processes suffer from several disadvantages. They must be applied hot (> 100 ° C); after application, repositioning is not possible and some polyurethane-based adhesives tend to have an unpleasant smell. Hot melt adhesives are liquid, and as indicated above, provision of alternative adhesive articles, such as tapes, is desirable.

In contrast to said disadvantages, the articles of the present invention, such as tapes, have a regular thickness, prior to rolling and further processing at a later point is possible without loss of performance. In addition, high temperatures are not required during the application process and an unpleasant smell is avoided during the manufacturing process.

Laborious manufacturing processes can be avoided by activating the article of the invention, such as a tape, after a relatively short exposure to temperature and pressure (hot press). Tests have shown that under the right conditions, impulse times of the order of seconds provide extremely close strong junctions.

Still the most common way to fix items, such as devices on a mounting surface, for example, in bathrooms and kitchens, is to drill holes in a mounting surface, such as walls, ceilings and tiles, for fasteners , such as screws.

In contrast to many commercially available adhesives, very wet media accelerates the curing process of the adhesive articles of the present invention on many different substrates (metal, glass, ceramic, aluminum, etc.). The above is ideal for the bathroom, kitchen, pool, outdoor applications, etc.

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On ceramic and metal surfaces at different temperatures and relative humidity, a tape according to the present invention behaved better than commercially available adhesive products in tensile strength tests. Desirably, it has been found that many articles of the present invention increase the adhesive strength under conditions of high temperature and humidity.

Other disadvantages of liquid formulations may include the requirement of additional dispensing aid, such as a dispensing container, nozzle or adapter. The amount of adhesive used when applying liquid formulations greatly exceeds the amount needed using a tape of the invention. Finally, the curing time of liquid adhesives is quite long.

Advantageously, the adhesive articles of the present invention prevent the production of waste, only a minimum of reactive material is used and the precut, such as die cutting, allows the required shape to be cut from a section of tape. Tape residues can be easily removed from walls and tiles by cleaning them with ethyl acetate. These features allow the products of the invention to be very versatile and desirable.

Referring to the article of the present invention, the weight ratio of cyanoacrylate monomers of formula (I) to (co) film-forming polymers within the film may be between 1: 8 and 8: 1. Conveniently, the weight ratio of cyanoacrylate monomers of formula (I) to (co) film-forming polymers within the film may be between 1: 4 and 4: 1.

With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the film:

(a) between 10% and 90% by weight, for example, between 15% and 80% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) film-forming polymers, wherein said film-forming copolymer has pressure sensitive adhesion properties at 23 ° C, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90%, for example, between 15% and 80% by weight of 2-phenylethyl 2-cyanoacrylate,

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) film-forming polymers, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90%, for example, between 15% and 80% by weight of 2-phenylethyl 2-cyanoacrylate,

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) film-forming polymers, wherein said film-forming copolymer has pressure sensitive adhesion properties at 23 ° C, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the film may comprise, with respect to the total weight of the film:

(a) between 10% and 90% by weight, for example, between 15% and 80% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) polymers forming (meth) acrylic acid, esters of (meth) acrylic acid and optionally others (co) monomers, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the film may comprise, with respect to the total weight of the film:

(a) between 10% and 90% by weight, for example, between 15% and 80% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) polymers of (meth) acrylic acid, esters of (meth) acrylic acid and optionally other (co) monomers, wherein said (co) polymer exhibits pressure sensitive adhesion properties at 23 ° C, and

(c) between 0% and 65% by weight of one or more additives.

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With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90% by weight, for example, between 15% and 80% by weight of one or more cyanoacrylate monomers selected from among the compounds of formula (I),

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) ethylene-vinyl acetate film forming polymers, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90%, for example, between 15% and 80% by weight of 2-phenylethyl 2-cyanoacrylate,

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) ethylene-vinyl acetate film forming polymers, and

(c) between 0% and 65% by weight of one or more additives.

With reference to the article of the present invention, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90%, for example, between 15% and 80% by weight of 2-phenylethyl 2-cyanoacrylate,

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) polymers forming (meth) acrylic acid, esters of (meth) acrylic acid and optionally others (co) monomers, and

(c) between 0% and 65% by weight of one or more additives.

Alternatively, the curable film may comprise, with respect to the total weight of the curable film:

(a) between 10% and 90%, for example, between 15% and 80% by weight of 2-phenylethyl 2-cyanoacrylate,

(b) between 10% and 90%, for example, between 20% and 85% by weight, of one or more (co) polymers of (meth) acrylic acid, esters of (meth) acrylic acid and optionally other (co) monomers, wherein said (co) polymer exhibits pressure sensitive adhesion properties at 23 ° C, and

(c) between 0% and 65% by weight of one or more additives.

Suitable poly (meth) acrylate (co) polymers include DuroTAK® 2123. Ethylene-vinyl acetate copolymers include Levamelt® 900.

Suitable additives may be selected from cyanoacrylate polymers, tackifiers, plasticizers, hardening agents, antioxidants, stabilizers, water absorbing agents and / or combinations thereof.

Suitable tackifiers are known to those skilled in the art. Sources of sticking agents can be found in standard publications on pressure-sensitive adhesives, for example, the work "Handbook of Pressure Sensitive Adhesive Technology", by Donata Satas (van Notstrand, New York, 1989).

The article of the present invention may take the form of an adhesive transfer tape comprising:

a curable film according to the present invention located on a release substrate, the curable film defining two adhesive surfaces, and optionally

a second release substrate on the top of the curable film (the cover substrate), the release substrate or substrates presenting a release function with respect to the film.

The first and second release substrates may be a paper, tissue or plastic-based material or a combination thereof, which are optionally coated with a release agent. The release agents allow the adhesive films of the article of the present invention to be easily transferred from the release substrate to the article of interest. The releasing agent can be selected from the group consisting of polyvinyl alcohol, clays, siloxanes and combinations thereof. Suitable release agents, in particular siloxane-based agents, are available under the trade name SILCOLEASE®.

Advantageously, an adhesive transfer film with first and second release substrates allows easy handling of the film and safe protection of the film between the two release layers.

When using the first and second release substrates, it is desirable that they have different release properties with respect to the film, so that it is clear that the release layer must be removed first.

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When using only a first release substrate and no second release or cover substrate, the first release substrate should preferably have release properties on both sides.

Preferably, the release properties are different on both sides. When rolling the product (substrate and film) into a coil, there will be a clear difference between the effects of release of the two faces. Consequently, the film will preferably adhere to one face during unwinding of the reel.

The article of the present invention can also take the form of a single-sided adhesive tape comprising:

a curable film according to the present invention located on a carrier substrate, and optionally a release substrate on the curable film, the release substrate having a release function with respect to the film.

The carrier substrate, which stabilizes the film, can be selected from paper, polymeric film, metal foil, foam, fabric and combinations thereof. It may comprise several layers, for example, a first layer facing the film in order to bond the film to the carrier substrate or a release layer on the opposite side of the film.

The article of the present invention may take the form of a double-sided adhesive tape comprising:

a first curable film according to the present invention located on a first face of a carrier substrate, a second curable film according to the present invention located on a second face of the carrier substrate, so that the carrier substrate is disposed between the first film and the second film, and optionally

a first release substrate on the first curable film, and / or a second release substrate on the second curable film,

presenting the substrate or release substrates a function of release with respect to the film or films.

The first and second curable films may be the same or different, that is, they may comprise the same combination or different combinations of one or more cyanoacrylates of formula (I) and (co) film-forming polymers. The first and second release substrates may have different release properties with respect to the first and second curable films. The first and second curable films may be the same or different, that is, they may comprise the same combination or different combinations of one or more cyanoacrylates of formula (I) and (co) film-forming polymers and the first and second release substrates may present different release properties with respect to the first and second curable films.

The carrier substrate interposed between the two layers of film can be selected from paper, polymeric film, metal foil, foam, fabric, viscoelastic materials and combinations thereof. Examples of viscoelastic materials include poly (meth) acrylates, polyvinyl ethers, natural rubbers, polyisoprenes, polybutadienes, polyisobutylenes, polychloroprenes, butadiene acrylonitrile polymers, thermoplastic elastomers, styrene-isoprenes, isoprene-styrene-block copolymers styrene, ethylene-propylene-diene polymers, styrene-butadiene polymers, poly-alpha-olefins, silicones, copolymers containing ethylene, ethylene-vinyl acetates and combinations thereof. The carrier substrate may comprise tackifiers, plasticizers, hardeners, antioxidants, stabilizers, water absorbing agents and / or combinations thereof. The carrier substrate may be a foamy form of said materials.

The first and second release substrates can be a paper, cloth or plastic-based material or a combination thereof, which are optionally coated with a release agent. The release agents allow the adhesive films of the article of the present invention to be easily transferred from the release substrate and roll up the article in the form of a coil. The releasing agent can be selected from the group consisting of polyvinyl alcohol, clays, siloxanes and combinations thereof. Suitable release agents, in particular siloxane-based agents, are available under the trade name SILCOLEASE®.

The articles of the present invention, such as transfer films, single-sided tapes and double-sided tapes or labels, can be protected from environmental conditions, such as light, heat or moisture, so as to prolong The durability of them.

The articles according to the present invention can be produced by coating the curable film on a carrier substrate or release substrate and subsequently laminating it on release substrates or additional carrier substrates. The coating process may be a hot melt adhesive process, a solid based procedure (i.e., solvent free), a solvent based process or a dispersion process.

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In a process with hot melt adhesive, the components of the film of the present invention are intermingled with a suitable mixing device, for example, an extruder, the mixture is melted through the suitable device, for example, an extruder, and the mixture is It forms on a film and is used to coat substrates using the appropriate device, for example, an extruder, and a matrix to form the film with a suitable thickness. Such methods of mixing hot melt adhesive and coating are well known in the adhesives and tapes industry.

In a solid-based process (i.e., without solvents), the curable film contains only solids, that is, the film is 100% solid. In a dispersion process, the components of the curable film are mixed in a liquid phase, for example, in an aqueous liquid phase. The aqueous liquid phase may be water.

In a solvent process, the components of the films of the present invention are mixed in one or more solvents, for example, benzene, toluene, acetone, ethyl acetate and other organic solvents or combinations thereof. After dissolving / dispersing and mixing the components with each other, the mixture is used to coat a release substrate or carrier substrate, the solvent is removed by drying and the film is wound in a reel. Such mixing, coating and drying processes are well known in the adhesives and tapes industry.

Desirably, the film of the present invention is produced in a solvent process. Preferably, the solvent is ethyl acetate.

The articles of the present invention can show pressure sensitive adhesion properties at 23 ° C, so that they can initially stick or bond to a target surface. Desirably, other stimuli are used to stimulate the curing of the adhesive film, for example, heat and / or radiation (for example, UV radiation). In the case where radiation is used to initiate or stimulate further cure, masking can be used to selectively induce cure.

In a further aspect, the present invention provides a method of attaching a curable film to a surface, comprising the steps of:

(a) provide an article according to the present invention,

(b) bond the curable film of the article to at least one surface to form an assembly,

(c) expose the assembly to sufficient conditions to cure the curable film of the article,

in which the substrate or substrates of release of the article, if present, are removed before and / or after step (b).

The article of the present invention may be a transfer tape, a single-sided adhesive tape or a double-sided adhesive tape. The articles of the present invention can show pressure sensitive adhesion properties at 23 ° C, in this way the union of the curable film of the article to at least one surface can be carried out by applying pressure to the curable film Over the surface.

The articles of the present invention, such as transfer films, single-sided tapes, double-sided tapes or labels, may find utility in joining a plurality of substrates and / or surfaces, including, but not limited to, metals, metal alloys, glass, enamels, wood, natural and synthetic fibers and fabrics, leather, stone, ceramics, plastics, paper or cardboard, plastics, composite materials and living tissues and organs.

Sufficient conditions for curing the curable film of the article of the present invention may include heat and / or radiation (for example, UV radiation).

In a further aspect, the present invention provides a method of adhesion of components to each other, said method comprising:

(i) provide an article according to the present invention,

(ii) join the curable film of the article to at least one of the components,

(iii) couple the components, and

(iv) cure the adhesive film between the components that must adhere to each other,

in which the article release substrate, if present, is removed before and / or after the stage

(ii).

The articles of the present invention may show pressure sensitive adhesion properties at 23 ° C; in this way, the union of the curable film of the article to at least one component can be carried out by applying pressure to the curable film on the component.

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Sufficient conditions for curing the curable film of the article of the present invention may include heat and / or radiation (eg, UV radiation).

For example, the method of the present invention may comprise adhering components to each other using a transfer belt according to the present invention, said method comprising:

(i) provide a transfer belt according to the present invention,

(ii) bond the curable film of the transfer belt to at least one of the components,

(iii) couple the components, and

(iv) cure the adhesive film between the components that must adhere to each other,

wherein the substrate or substrates of the transfer belt, if present, are removed before and / or after step (ii).

The substrates that bind the article of the present invention may include at least one flexible substrate, for example, at least one substrate may be a flexible textile or laminate.

Sufficient conditions for curing the curable film of the article of the present invention may include heat, moisture and / or radiation (for example, UV radiation).

Sufficient conditions for curing the curable film of the article of the present invention when joining fabrics conveniently include the application of a short heat exposure, for example, a short heat pulse, such as a heat shock.

The transfer tapes may comprise one or two release substrates, as illustrated in Figures 3 and 4, see below. As used herein, the term "transfer tape" refers to an article in which a release substrate can be used to transfer the curable film to a substrate or target surface.

Advantageously, the method of using an article of the present invention, such as a transfer belt as indicated above, can be used as an alternative to sewing. Said method can be described as seams without sewing.

Desirably, the method of using an article of the present invention, such as a transfer belt for joining fabrics, provides joints that are fully flexible but simultaneously very strong.

In comparison with liquid adhesives, the method of using an article of the present invention, such as a transfer tape, does not lead to the penetration of adhesive liquids into the fabric and leaves no stains or marks when applied.

Advantageously, the method of using an article of the present invention, such as a transfer belt, results in the formation of textile assemblies that exhibit excellent solvent resistance and can withstand hot washing and hot drying procedures. The method of using an article of the present invention, such as a transfer belt, is especially suitable for use in the manufacture of high performance technical fabrics, in which function is the main criterion, for example in clothing protective, in agricultural fabrics, in automotive fabrics, etc.

Advantageously, the above-mentioned method for adhesion of components in very humid media to each other using an article of the present invention, such as a transfer belt, provides an alternative to drilling holes in tiles, thus eliminating the possibility of damaging pipes. Hidden or integrity of ornamental tiles.

Another aspect of the present invention comprises a method of adhesion of at least one electronic component to a substrate, for example, the union of two electronic components with each other as follows:

(i) provide an article according to the present invention,

(ii) join the curable film of the article to at least one of the components,

(iii) couple the components, and

(iv) curing the adhesive film between the components that must adhere to each other, removing the release substrate from the article, if present, before and / or after step (ii).

Other components that can be joined using articles according to the present invention include components in optical devices and optoelectronics.

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In a further aspect of the present invention, adhesive articles, such as transfer tapes, described in the present invention, can be used for encapsulation and / or packaging of components, for example, in the union of electronic chips, in carcasses of sensors or in the manufacture thereof, diodes, fibers, lenses, LCD, plasma screens, etc.

The adhesives of each fine of high flexibility, high bond strength and with a high refractive index are suitable for flexible encapsulation, packaging and fixing of optical devices, such as sensors, diodes, fibers, lenses, photodiodes, phototransistors, photomultipliers, integrated optical circuit elements, photoresist cells, photoconductive camera tubes, charge coupling imaging devices, laser diodes, quantum cascade lasers, light emitting diodes, etc.), flexible (touch) screens (LCD, screens) of plasma, etc.), in the photovoltaic industry in the chip union, etc.

In a further embodiment, the method of the present invention may comprise adhesion of components to each other using a single-sided adhesive tape according to the present invention, in which the single-sided adhesive comprises one of the components, said method comprising :

(i) provide a single-sided adhesive tape according to the present invention,

(ii) bond the curable film of the single-sided adhesive tape to the component, and

(iii) cure the adhesive film,

wherein the single-sided adhesive tape release substrate, if present, is removed before step (ii).

Normally, single-sided adhesive tapes either do not have a release substrate or have a single release substrate, as illustrated in Figures 1 and 2, see below.

In a still further embodiment, the method of the present invention may comprise adhering components to each other using a double-sided adhesive tape according to the present invention, said method comprising:

(i) provide a double-sided adhesive tape according to the present invention,

(ii) bond a first curable film of the double-sided adhesive tape to at least one of the components,

(iii) bond a second curable film of the double-sided adhesive tape to the other component, and

(iv) cure curable films between the components so that the components adhere to each other,

wherein the substrate or substrates for releasing the double-sided adhesive tape, if present, are removed before and / or after step (ii).

Double-sided adhesive tapes may comprise one or two release substrates, as illustrated in Figures 5 and 6, see below.

The articles of the present invention can specifically find industrial applicability in a wide range of applications, such as, but not limited to, lamination, binding, shoe assembly, assembly of motor vehicle parts, air conditioning systems , of components of an electrical or electronic device or other durable consumer goods, of components used in the construction industry [for example, in insulation (thermal and acoustic)], of packaging, in application of matrix bonding, in closing of wounds, in surgical closures, in medical device applications and in all types of labels. The components may be the ends of longitudinal materials that adhere to each other, for example, the splice of two coils of material.

The article of the present invention can be used to laminate or mask a substrate, to cover part or all of the substrate, to join two sides of a gap between them, to pack the substrate or package pieces together and / or combinations thereof.

In industrial processes, the articles of the present invention, such as transfer films, single-sided tapes, double-sided tapes or labels, can be used in a continuous delivery procedure. For example, the carrier or release substrate can be continuously fed to a device that transfers the adhesive film to the carrier or release substrate, where the article formed in this way can contact parts (components) for joining them. .

All numerical ranges and proportions disclosed herein include the ends thereof.

If deemed necessary, it will be appreciated that all optional and / or preferred features of one embodiment of the invention may be combined with optional and / or preferred features of another or other embodiments of the invention.

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Brief description of the drawings

Additional features and advantages of the present invention are described in, and will be apparent from, the detailed description of the invention and the drawings, in which:

Figure 1 illustrates a single tape without release substrate according to the present invention.

Figure 2 illustrates an embodiment of the article of the present invention that may correspond to a single-sided tape or a label with a release substrate,

Figure 3 illustrates a transfer belt with a release substrate according to the present invention.

Figure 4 illustrates a transfer belt with two release substrates according to the present invention.

Figure 5 illustrates a double-sided tape with a release substrate according to the present invention, and Figure 6 illustrates a double-sided tape with two release substrates according to the present invention.

Figure 7 illustrates the refractive index values of different curable films.

Detailed description of the invention

It should be readily apparent to the ordinary person skilled in the art that the examples disclosed herein represent merely generalized examples and that other arrangements and methods capable of reproducing the invention are possible and are included in the present invention.

In Figure 1, a single-sided tape 101 is shown. The single-sided tape 101 consists of a carrier substrate 102 and a curable film 103, the curable film 103 comprising one or more cyanoacrylates of formula (I) and a (co) film forming polymer (supra). The surface of the carrier substrate versus the curable film can be a surface treated with special release substrate.

The embodiment of the invention illustrated in Figure 2 could be a single-sided tape or a tag 201. The single-sided tape or tag 201 consists of a carrier substrate 102 and a curable film 103, the curable film 103 comprising one or more cyanoacrylates of formula (I) and a (co) film-forming polymer. The curable film 103 is covered with a release substrate 104 to protect the curable film and prevent unwanted adhesion of the curable film 103.

Figures 3 and 4 illustrate transfer tapes according to the present invention. Transfer tapes are particularly useful for transferring the curable film of a release substrate to a target surface. In Fig. 3, the transfer belt 301 consists of a release substrate 104 coated with a curable film 103. The curable film 103 comprises one or more cyanoacrylates of formula (I) and a (co) film-forming polymer. The release substrate 104 should preferably have release properties on both sides. Preferably, the release properties are different on both sides. Thus, by winding or unwinding the transfer belt 301 in a coil, there will be a difference between the release effects of the two faces of the release substrate 104.

In Figure 4, the transfer belt 401 consists of a curable film 103 comprising one or more cyanoacrylates of formula (I) and a film forming polymer (co) interposed between the first and second release substrates, 104 and 105 The first and second release substrates, 104 and 105, may have different release properties with respect to the curable film. The foregoing allows the first and second release substrates, 104 and 105, to be removed independently of each other.

A double-sided adhesive tape 501 is shown in Figure 5. The tape 501 consists of a carrier substrate 102 with a first curable film 103 on a first face of the carrier substrate 102 and a second curable film 106 on a second face of the carrier substrate 102. The first and second curable films, 103 and 106, may be the same or different, that is, they may comprise the same combination or different combinations of one or more cyanoacrylates of formula (I) and (co) film-forming polymers. A release substrate 104 covers and protects the second curable film 106. The release substrate 104 should preferably have release properties on both sides. Preferably, the release properties are different on both sides. Thus, by winding or unwinding the double-sided tape 501 in a coil, there will be a difference between the release effects of the two faces of the release substrate 104.

A second embodiment of a double-sided adhesive tape 601 is provided in Figure 6. The tape 601 consists of a carrier substrate 102 with a first curable film 103 on a first face of the carrier substrate 102 and a second curable film 106 on a second face of the carrier substrate 102. The first and second curable films, 103 and 106, may be the same or different, that is, they may comprise the same combination or different combinations of one or more cyanoacrylates of formula (I) and (co) forming polymers of film. A first release substrate 104 covers and protects the first curable film 103. A second release substrate 105 covers and protects the second curable film 106. The first and second release substrates, 104 and 105, may exhibit different release properties with respect to curable films 103 and 106.

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Figure 7 shows several refractive indices of some tapes resulting from different formulations. Levamelt (column 1 of the column chart) refers to the curable film obtained from tape 1; columns 2 to 4 represent a tape obtained by mixing a styrene-PheCA copolymer; columns 5 to 7 represent a tape obtained by replacing Levamelt with polymers of Vinnol type, and finally the last column represents ribbons obtained by adding dyes / dyes or pigments, such as naphthol green, coumarin, carotene, violet m- cresol, Cu (II) phthalocyanine and others to the adhesive mass.

Examples

materials

Levamelt® 900 is a film-forming ethylene-vinyl acetate copolymer with a vinyl acetate content of approximately 90% by weight, commercially available from Lanxess AG, Leverkusen, Germany.

Durotak® 2123 is a solution of a copolymer of ethyl (meth) acrylic film forming ester in ethyl acetate, commercially available from Henkel AG & Co. KGaA, Dusseldorf, Germany.

Neopentyl 2-cyanoacrylate (NCA) is a solid cyanoacrylate (melting point: 41 ° C) and can be synthesized following document No. WO2010 / 023229.

2-Phenylethyl 2-cyanoacrylate (PheCA) is a solid cyanoacrylate (melting point: 30 ° C to 32 ° C) and can be synthesized according to the Knoevenagel method using 2-phenylcyanacetate, formaldefudo and a catalyst in a solvent, followed of a cracking procedure. Suitable syntheses can be found in Sato, Mitsuyoshi, Okuyama and Toshio, Japan. Kokai Tokkyo Koho (1994) and document No. JP 06192202A.

The release substrate 1 (SR 1) is a 50 pm thick polyester film, covered on both sides with a silicone coating.

The release substrate 2 (SR 2) is a 50 pm thick polyethylene film, covered on both sides with a silicone coating.

The super glue is a representative of general cyanoacrylate adhesives. It is commercially available as Loctite 4062 from Henkel AG & Co. KGaA, Dusseldorf, Germany.

Tape preparation

The different curable film formulations were prepared in HDPE bottles following the following procedure: the (co) film-forming polymer was dissolved in ethyl acetate, providing a 50% solution by weight. Cyanoacrylate monomer and additional ethyl acetate were added, providing 50% solution by weight (cyanoacrylate monomer + (co) film-forming polymer) in ethyl acetate. All formulations were stable in the presence of sulfonic acids. BF3 or SO2 as stabilizers.

To produce a tape, the curable film formulation was used to coat a release substrate using a bar-coated bar. The wet curable film was left at 22 ° C for 10 min. The backing paper and the curable film are further dried in an oven with air flow for 5 min. at 90 ° C or otherwise as indicated to remove ethyl acetate to a level less than 1% by weight of residual solvent. The following tapes were prepared:

Tape 1 (PheCA + Levamelt® 900)

Film formulation 25% by weight of PheCA, 25% by weight of Levamelt® 900, 49.957% by weight of

curable: ethyl acetate, 0.04% by weight of hydroquinone and 0.003% of camphor-10- acid

sulfonic;

Substrates: SR 1 and SR 2;

Weight of curable film: 40 g / m2

Tape 2 (PheCA + Durotak® 2123)

Film formulation 35% by weight of PheCA, 15% by weight of Durotak® 2123 (polymer), 49.957%

Curable: by weight of ethyl acetate, 0.04% by weight of hydroquinone and 0.003% of acid

camphor-10-sulfonic;

Substrates: SR 1 and SR 2;

Weight of curable film: 40 g / m2

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Comparison tape 1 (NCA + Levamelt® 900)

Film formulation 25% by weight of NCA, 25% by weight of Levamelt® 900, 49.957% by weight of

curable: ethyl acetate, 0.04% by weight of hydroquinone and 0.003% of camphor-10- acid

sulfonic

Substrates: SR 1 and SR 2

Weight of curable film: 40 g / m2

Comparison tape 2 (Durotak® 2123)

Durotak® 2123 film formulation (68.7% by weight of Durotak 2123 polymer in 31.3% in

curable: weight of ethyl acetate);

Substrates: SR 1 and SR 2;

Weight of curable film: 40 g / m2

The properties of the different tapes were evaluated by using the following test methods. Test methods Loop stickiness

The loop tack was determined according to DIN EN 1719. The curable film was laminated on aluminum and cut into strips with a thickness of approximately 25 mm and a length of approximately 300 mm. The strips were immediately measured in a "Zwick" Z010 tensile test apparatus at a speed of 100 mm / min.

To determine the loop tack after curing, a specimen was prepared as indicated above. Before placing the specimen in the "Zwick" Z010 tensile test apparatus, the curable film was cured under the indicated conditions, in which the loop tack was determined as indicated above.

Shear strength

The film was laminated on a polyester film and cut into strips with a thickness of approximately 25 mm and a length of approximately 50 mm. The strip was placed on a steel plate covering an area of approximately 25 mm x 25 mm at the edge of the steel plate. Immediately after preparation, the steel plate was placed vertically in a suitable device and tensioned with loads between 1 N and 160 N. The shear value is the maximum tension (in Newtons) to which the strip still adheres to the plate after 4 hours.

To determine the shear strength after curing, a specimen was prepared as indicated above. Before measuring the shear strength as indicated above, the curable film was cured under the indicated conditions.

Shear stress tests

Shot Blasting Soft Steel Panels (GBMS) GBMS panels consist of shot blasting mild steel. Shot blasting should be done <24 h before the test. Shot blasting medium: corundum, diameter: 0.21 to 0.3 mm, shot blasting pressure: 3 bar. The curable film was transferred to GBMS steel panels (width: 25 mm) to cover a surface of 25 mm x 12.5 mm (312.5 mm2) to the edge of the first steel panel. A second steel panel was placed on the first panel so that the overlapping of the covered area was complete. Two jaws (each load: 45 to 90 N) were used to press the steel panels against each other. Next, the resulting specimen was stored under defined conditions of temperature and time.

The shear strength was measured using a «Zwick» Z010 tensile test apparatus. Speed: 2 mm / min .; Initial load: 5 N. The resulting value is the maximum force before the specimen is broken.

To determine the shear strength after curing, a specimen was prepared as indicated above. Before measuring the shear strength as indicated above, the curable film was cured under the indicated conditions.

Differential scanning calorimetry (CBD)

For CBD measurements, a NETZSCH DSC204F1 instrument was used, in which the measurement conditions were as follows: Scanning temperature range: -80 ° C to 200 ° C with 10 ° K / min .; Sample weight: 5 mg.

Dynamic Mechanical Analysis (AMD)

For AMD measurements, a METTLER TOLEDO DMA / SDTA861e instrument was used, in which the measurement conditions were as follows: harmonic shear load with 1 Hz, force max. 1.5 N, max. 5 10 pm, scanning temperature range between -150 ° C and 200 ° C. The storage module G 'was determined to

from the results of the AMD.

Example 1

10 The curable film of Tape 1 had a high initial tack and showed good pressure sensitive adhesion properties at 23 ° C. The curable film can be completely cured by exposing said film at a temperature of 65 ° C for 1 hour followed by a temperature of 23 ° C for 24 hours. The glass transition temperature (Tg) of the curable film was -40 ° C, while the glass transition temperature (Tg) of the cured film was 15 ° C. For the curable film, a storage module G '15 of 3103 Pa was observed.

Several properties of the materials of Tape 1 are provided in Table 1.

Table 1

 Substrate Uncured state Cured state

 Loop stickiness

 7 N steel none

 Shear strength

 Steel <10 N> 160N

 Shear stress tests

 GBMS <15 N / 312.5 mm2 1966 N / 312.5 mm2

twenty

The importance of the curing procedure is further shown in Table 2, in which different curing conditions were used. Only high shear strengths were observed for cases in which the samples had been exposed to conditions that could cause curing of the curable film.

25 Table 2

 Curing conditions

 F-max [N / 312.5mm2l MPa

 23 ° C / 30min

 <30 <0.1

 23 ° C / 1 hour

 150 0.48

 23 ° C / 3 hours

 590 1.89

 23 ° C / 10 hours

 930 2.98

 23 ° C / 24 hours

 1550 4.96

 23 ° C / 72 hours

 1510 4.83

 65 ° C / 5 minutes

 <30 <0.1

 65 ° C / 30 minutes

 438 1

 65 ° C / 1 hour

 935 3

 65 ° C / 1 hour + 24 h TA post-cure

 2281 7.3

Example 2

The curable film of Tape 2 had a very high initial tack and showed very good 30 properties of pressure sensitive adhesion at 23 ° C. The curable film can be completely cured by exposing said film at a temperature of 65 ° C for 1 hour followed by a temperature of 23 ° C for 24 hours.

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Several properties of the materials of Tape 2 are provided in Table 3.

Table 3

 Substrate Uncured state Cured state

 Loop stickiness

 9 N steel none

 Shear stress tests

 GBMS <15 N / 312.5 mm2 525 N / 312.5 mm2

 <0.05 MPas

 1.68 MPas

Example 3 (comparative example)

The curing of the curable film at a temperature of 65 ° C for 1 hour followed by a temperature of 23 ° C for 24 hours does not sufficiently increase the resistance to shear stress on GBMS, which implies that said tape may not be suitable for a diversity of structural union applications.

Table 4 provides several properties of the materials of Comparative Tape 1.

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Table 4

 Substrate Uncured state Cured state

 Loop stickiness

 Steel 7 N 8 N

 shear strength

 Steel <10 N <20

 Shear stress tests

 GBMS <15 N / 312.5 mm2 80 N / 312.5 mm2

 <0.05 MPa

 0.25 MPa

Example 4 (comparative example)

The film of Comparative Tape 2 shows a high initial tack and pressure sensitive adhesion properties at 23 ° C. However, the exposure of the film to different conditions (see Table 5) did not lead to a significant increase in the adhesive strength on GBMS, which implies that this tape is not suitable for all structural adhesive applications.

Table 5

 Temperature / Time

 F-max [N / 312.5mm2l MPa

 23 ° C / 30min

 <15 <0.05

 23 ° C / 1 hour

 30 0.1

 23 ° C / 3 hours

 50 0.16

 23 ° C / 10 hours

 50 0.16

 23 ° C / 24 hours

 48 0.15

Procedure to determine the acid number of the (co) polymer

Check if the sample is at room temperature by replacing the lid of the sample container with a thermometer lid. Determine the temperature. If the temperature is between 20 ° C and 30 ° C, the analyzes can be started in the specified sequence. If the temperature is not within the range indicated above, introduce the sample in a water bath at 25 ° C and check the temperature periodically until it reaches a value between 20 ° C and 30 ° C. Some (co) polymers will contain volatile compounds, so it is recommended to start the analysis of the most critical parameters.

Method:

1. Weigh in a bottle for samples of 250 cm3 X g of the (co) polymer.

2. Add acetone. Before use, neutralize acetone with 0.05 N KOH using phenolphthalema.

3. Shake the sample bottle until the (co) polymer dissolves.

4. Cool the sample bottle (0 ° C to 5 ° C) and holder with 0.05 N KOH from clear to light pink. The color change must be maintained for 30 seconds.

5. In the event that the (co) polymer has a low acid number (1.0 mg of KOH / g of dry resin max.), A small 10 ml burette should be used.

The acidity index of the (co) polymer is determined according to the following equation:

acid number (in mg KOH / g dry resin) =

(ml of KOH) x (N of KOH) x 56 x 100 (g sample) x (Total solids in sample)

Total solids in sample refers to the% dry polymer in the (co) polymer. Normally, (co) polymers are solvent based. The typical value of total solids in the sample is 30% to 60%.

Textile Mounting Method

Structural transfer adhesive tapes such as those indicated in the present invention are particularly useful in textile assembly.

Textile substrates

Tissue specimens were prepared for shear stress experiments or for peeling experiments from nylon, cotton and cotton-polyester (33% / 66%) commercially available by cutting 2.5 cm x 12 pieces , 5 cm

Comparative experiments were carried out using Henkel Technomelt PUR 7549, a hot melt reactive liquid polyurethane adhesive. Samples of Technomelt PUR 7549 prelaminated tissue on nylon from China were used in washing experiments and for peeling measurements with the unmodified tissue.

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Plastic specimen for shear stress resistance

Overlapping plastic spurs were assembled according to STM 700 using Wilton jaws, model 365, and subjected to curing. Overlapping tissue splinters between overlapping mild steel plates conforming to the STM 700 standard were fixed with jaws, using Wilton jaws, and subjected to curing.

Thermal shock press

A Fermant 400T thermal shock press was used for sealing experiments in seamless applications. A pulse level of 5 (8 s) was used to create a cured surface of 2.5 cm x 0.2 cm. Next, the bound materials were directly subjected to the wash experiment or tensile strength tests, respectively.

Thermal press

For thermal press experiments in tape applications, 320 cm x 320 cm pieces of tissue were cut; the tape was transferred onto a piece of tissue and the open tape layer was covered with another piece of 320 cm x 320 cm fabric.

For thermal press experiments using the hot melt adhesive of the competition, 320 cm x 320 cm pieces of tissue were cut, a piece was placed on a thermal plate (100 ° C), the hot melt adhesive was transferred to the piece of tissue at 100 ° C with a 40 pm coating blade and the piece of tissue was finally covered with a second layer of tissue of the same size.

A Fontune TP-400 thermal press was used to apply pressure and heat on a curing surface of 320 cm x 320 cm for the adhesive article in question for 2 min. on a fully covered surface, with a force of 20 kN. Temperature during compression: 100 ° C.

Washing experiments

Thicknesses of dimensions 2.5 cm x 12.5 cm were cut from laminated fabrics after applying the thermal press, transferred to a round bottom flask of 1 l glass equipped with a mechanical stir bar, and then added 700 to 800 ml of running water and half of a commercially available Somat tablet. The mixture was stirred at 100-250 rpm and heated to 100 ° C, 60 ° C, 40 ° C or at room temperature. After 2 hours (or 24 hours for the experiments carried out at room temperature), the tissue specimen was removed, rinsed three times with clear running water and transferred to an oven at 60 ° C or 70 ° C. Drying was carried out for 2 hours. The pieces of tissue were allowed to cool to room temperature and left at room temperature for 1 to 2 days before determining resistance to peeling or tensile.

Tensile strength determination

The shear stress strength was determined in accordance with STM 700 in an Instron 5567 with 30 kN, 1 kN and 100 N load cells, respectively, in a Zwick tensile strength test apparatus with 100 load cells kN and 1 kN, with a Zwick tensile strength test apparatus type 144501 and with a KAF-Z tensile strength test apparatus with a 1 kN load cell. The tests were repeated twice.

Peeling experiment

Peeling was determined according to a modified standard DIN EN 1939 in a Zwick KAF-Z tensile strength test apparatus with a 1 kN load cell:

• The specimen was cut to 2.5 cm x 12.5 cm.

• The sample was blown with an opening of 5 to 6 cm, verifying that the open ends could be fixed with a jaw in the tension test apparatus.

• The tension test apparatus was configured:

• Separation between fixings

• Preload

• Peak definition

• Measurement path

• Pre-measurement path

60 mm 2 cN 0.1 N 100 mm 2 mm

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• Extension max.

• Measuring speed

• Repositioning force

• Sample fixation (no tension) and start

• Return of the fixation upon completion

• Graphic printing

• Calculation of the average of all peaks greater than 0.1 N

• Repeat for all samples (2 to 3 times)

Example 5

The transfer tape, Tape 1, was applied to one of the two pieces of tissue; A second piece of tissue was applied to the tape and a clean joint was generated by applying a short thermal shock. A thermal shock of 8 seconds results in a sewn without sewing with a total joined surface of 50 mm2.

The substrate failure (FS) indicates that the total resistance of the fabric is much lower than the bond strength of the joint. This type of failure indicates a successful treatment and a good adhesive option.

As is evident from Table 6, then, after hot washing and drying, the bond strength is maintained.

100 mm 100 mm / min.

Table 6

 Initial bond strength

 40 ° C 2h wash + 2h 60 ° C drying TA 60h wash + TA drying

 4.4 MPa

 4.95 MPa Substrate failure

 22.4 kg

 25.2 kg -

 Substrate failure

 Substrate failure

 Substrate failure

Experiments of resistance to shear stress with tissues

Tables 7 and 8, see below, show the results of shear stress experiments for various tissues. Different curing conditions are shown in addition to the effects of various washing and drying cycles.

Table 7 - Experiments of shear resistance with Tape 1

 Tape 1

 Shear strength

 24 h at RT, jaws, 322.6 mm2 Fermant 400T thermal press. Impulse level: 5.50 mm2

 Load (N)

 N / mm2 Load (N) N / mm2

 33% cotton, 66% PES shear stress

 sub-ruling - 219.72 4.39

 sub-fault

 - 237.56 4.75

 294.81

 0.91 204.34 4.09

 Half

 0.91 Average 4.41

 dev. its T.

 - dev. its T. 0.33

Table 8 - Experiments of shear resistance with Tape 1

 Tape 1

 Shear strength

 Cured

 Thermal press Fermant 400T. Impulse level: 5.50 mm2 Fermant 400T thermal press. Impulse level: 5.50 mm2 Fermant 400T thermal press. Impulse level: 5.50 mm2

 Wash / Substrate

 2 h at 100 ° C + 2 h drying at 60 ° C 2 h at 40 ° C + 2 h drying at 60 ° C 24 h at RT + 2 h drying at 60 ° C

 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 33% cotton, 66%

   sub-fault - 202.37 4.05 sub-failure -

 sub-fault - 278.87 5.58 sub-fault -

 PES shear stress

   201.20 4.02 260.59 5.21 sub-fault -

 Half

 201.20 4.02 Average 247.28 4.95 Average - -

 dev. its T.

 - - dev. its T. 39.95 0.80 dev. its T. - -

Tables 9 and 10 show the results of shear stress resistance for Tape 1 and Technomelt PUR 7549 comparative hot melt under different curing conditions.

5 _______________ Table 9 - Experiments of shear resistance with Tape 1_______________

 Tape 1

 Shear strength

 Cured / Substrate

 24h at RT 1h 70 ° C + 24h TA

 Load (N)

 N / mm2 Load (N) N / mm2

 Overlap plates with solid nylon 6.6

 68.20 0.21 56.20 0.17

 77.40

 0.24 55.00 0.17

 69.23

 0.21 68.00 0.21

 Half

 0.22 Average 0.19

 dev. its T.

 0.02 dev. its T. 0.02

 Overlapping plates with cotton fabric

 400.00 1.24 400.00 1.24 Sub-fault

 365.00

 1.13 330.00 1.02 Sub-fault

 445.00

 1.38 618.00 1.92 Sub-fault

 Half

 1.25 Average 1.39

 dev. its T.

 0.12 dev. its T. 0.47

 Overlapped plate with 33% cotton, 66% PES

 197.00 0.61 334.00 1.04

 256.00

 0.79 365.00 1.13

 197.00

 0.61 454.00 1.41

 Half

 0.67 Average 1.19

 dev. its T.

 0.11 dev. its T. 0.19

Table 10 - comparison

 Technomelt PUR 7549

 Overlapping plate

 Cured / Substrate

 Sample of laminated nylon with Technomelt PUR 7549

 Load (N)

 N / mm2

 Overlapping plates with nylon fabric

 120.20 0.37 Sub-fault

 118.00

 0.37 Sub-fault

 -

 -

 Half

 0.37

 dev. its T.

 0.00

Peeling experiments

10

Tables 11 and 12 illustrate the results of stripping experiments for a structural transfer adhesive tape as described in the present invention, Tape 1, and Commercially available Technomelt PUR 7549.

15 _________________________________ Table 11 - Peeling experiments

 Tape 1

 Bare

 Cured / Substrate

 24h at TA 1h 70 ° C + 24h TA Fontune 2 min. at 100 ° C / 20 kN

 F (m) / N F (max) / N F (m) / N F (max) / N F (m) / N F (max) / N

 Nylon fabric

   3.77 4.77 3.50 5.60 3.35 5.68

 4.59 5.83 4.43 6.13 3.09 5.53

 4.62 6.46 3.05 4.74 1.79 4.55

 Half

 4.33 5.69 Average 3.66 5.49 Average 2.74 5.25

 dev. its T.

 0.48 0.85 dev. its T. 0.70 0.70 dev. its T. 0.84 0.61

 Cotton fabric

   9.82 14.27 16.48 21.76 15.98 23.39

 10.22 13.99 16.87 22.33 13.90 19.62

 10.23 14.85 17.20 23.22 12.11 17.15

 Half

 10.09 14.37 Average 16.85 22.44 Average 14.00 20.05

 dev. its T. 0.23 0.44 dev. its T. 0.36 0.74 dev. its T. 1.94 3.14

 33% cotton, 66% PES fabric

   5.35 8.59 11.08 15.15 10.35 15.57

 4.75 7.36 12.12 15.00 13.64 17.33

 4.78 7.24 11.70 14.40 12.93 15.76

 Half

 4.96 7.73 Average 11.63 14.85 Average 12.31 16.22

 dev. its T.

 0.34 0.75 dev. its T. 0.52 0.40 dev. its T. 1.73 0.97

Table 12 - Comparative data

 Technomelt PUR 7549

 Bare

 Cured / Substrate

 Sample of laminated nylon with Technomelt PUR 7549 Fontune 2 min. at 100 ° C / 20 kN

 F (m) / N F (max) / N F (m) / N F (max) / N

 Nylon fabric

   18.50 24.57 12.18 15.90

 16.92 25.92 11.72 16.79

 19.40 25.62 10.71 14.03

 Half

 18.27 25.37 11.54 15.57

 dev. its T.

 1.26 0.71 0.75 1.41

 Cotton fabric

       11.93 16.82

 11.04 15.10

 10.21 12.99

 Half

     11.06 14.97

 dev. its T.

     0.86 1.92

 33% cotton, 66% PES fabric

       5.77 10.23

 5.70 9.60

 2.47 5.76

 Half

     4.65 8.53

 dev. its T.

     1.89 2.42

Tape 1 showed a better performance than the comparative sample on cotton and cotton-5-polyester substrates.

10

Table 13 shows in general the results of stripping experiments for Tape 1 on nylon, cotton and cotton-polyester materials after a 2-hour wash cycle at 60 ° C, followed by a 2-hour drying cycle and after a 2 hour wash cycle at 40 ° C followed by a 2 hour drying cycle.

Table 13 - Peeling experiments

 Tape 1

 Bare

 Cured

 Fontune 2 min. at 100 ° C / 20 kN Fontune 2 min. at 100 ° C / 20 kN

 Wash / Substrate

 2 h at 60 ° C, 2 h dried at 70 ° C 2 h at 40 ° C, 2 h dried at 70 ° C

 F (m) / N F (max) / N F (m) / N F (max) / N

 Nylon fabric

   1.55 2.50 3.71 6.28

 0.86 1.48 1.46 2.81

 2.42 3.50 2.06 3.41

 Half

 1.61 2.49 Average 2.41 4.17

 dev. its T.

 0.78 1.01 dev. its T. 1.17 1.85

 Cotton fabric

   18.56 27.87 17.69 27.42

 13.75 19.34 22.91 35.83

 16.14 27.45 17.96 27.30

 Half

 16.15 24.89 Average 19.52 30.18

 dev. its T.

 2.41 4.81 dev. its T. 2.94 4.89

 33% cotton, 66% PES fabric

   12.12 15.33 13.89 20.53

 11.34 16.67 8.96 13.39

 9.93 13.49 14.49 18.71

 Half

 11.13 15.16 Average 12.45 17.54

 dev. its T.

 1.11 1.60 dev. its T. 3.03 3.71

Tables 14 and 15 show the results for Technomelt PUR 7549 in peeling experiments for the same washing and drying cycles.

Table 14 - comparison

 Technomelt PUR 7549

 Bare

 Cured

 Fontune 2 min. at 100 ° C / 20 kN Sample of laminated nylon with Technomelt PUR 7549

 Wash / Substrate

 2 h at 60 ° C, 2 h dried at 70 ° C 2 h at 60 ° C, 2 h dried at 70 ° C

 F (m) / N F (max) / N F (m) / N F (max) / N

 Nylon fabric

   18.16 23.90 18.03 25.44

 15.67 20.54 15.52 21.61

 17.87 22.55 16.31 19.67

 Half

 17.23 22.33 Average 16.62 22.24

 dev. its T.

 1.36 1.69 dev. its T. 1.28 2.94

 Cotton fabric

   13.05 20.66

 14.37 19.73

 14.77 22.29

 Half

 14.06 20.89

 dev. its T.

 0.90 1.30

 33% cotton, 66% PES fabric

   delamin. delamin.

 delamin. delamin.

 delamin. delamin.

 Half

 - -

 dev. its T.

 - -

Table 15 - comparison

 Technomelt PUR 7549

 Bare

 Cured

 Fontune 2 min. at 100 ° C / 20 kN Sample of laminated nylon with Technomelt PUR 7549

 Washed/

 2 h at 40 ° C, 2 h dried at 70 ° C 2 h at 40 ° C, 2 h dried at 70 ° C

 substratum

   F (m) / N F (max) / N - F (m) / N F (max) / N

 Nylon fabric

   16.13 21.55 - 14.01 18.98

 20.35 15.66 - 15.00 23.20

 17.74 24.58 - 12.34 19.94

 Half

 18.07 20.60 Average 13.78 20.71

 dev. its T.

 2.13 4.54 dev. its T. 1.34 2.21

 Cotton fabric

   15.35 22.27

 15.70 26.47

 14.99 29.67

 Half

 15.35 26.14

 dev. its T.

 0.36 3.71

 33% cotton, 66% PES fabric

   1.58 3.61

 delamin. delamin.

 delamin. delamin.

 Half

 1.58 3.61

 dev. its T.

 - -

5 Example 6

Structural transfer adhesive tapes such as those indicated in the present invention are particularly useful in high humidity media.

10 Materials

Substrates

Wood spills were cut for overlapping plate experiments from red beech wood in the 15 dimensions of the ordinary overlapping test shear panels. A ceramic tile specimen was cut from commercially available tiles obtained from a DIY store with the dimensions of ordinary overlapping shear test panels. The smooth surface of the ceramic tile was used to assemble the joints. The overlapping mild steel plates were shot blasting before use, using 4 bar plaster silicon carbide in accordance with the STM 700 standard in a 1ULA 1400 shot blasting machine. 20 All traction resistance studies with plate spindles Overlaps were carried out in accordance with STM 700.

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Competition samples

"Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML)", "Unibond No More Nails (original)", "Tesa Powerstrips» and "467MP of 3M" were used for comparative tests. All competition samples were applied according to recommendations of suppliers The preparation of overlapping plate smears, product application and tensile strength tests were carried out in accordance with STM 700.

"Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML)" is a 1K silane modified polyether adhesive (one part) in the form of a white paste. It is suitable for application on smooth and rough surfaces. It is not an instant adhesive and requires air and time (12 hours) to cure. A special dispensing adapter is also required, which is sold separately. The smallest dispenser adapter available has a diameter of 35 mm and supports 5 kg of weight permanently (0.5 MPa).

"Unibond No More Nails (original)" is a styrene-acrylate copolymer available from Henkel.

Large double-sided adhesive strips «Tesa Powerstrips" large Available from Tesa AG.

3M 467MP is a 200MP adhesive, a double-sided transfer tape with acrylic adhesive

Tensile strength determination

The tensile strength of the overlapping shear resistance test plates was determined according to the STM 700 standard in an Instron 5567 with load cells of 30 kN, 1 kN and 100 N, respectively, in an apparatus

of tensile strength test Zwick with load cells of 100 kN and 1 kN, with a test apparatus of

Tensile strength Zwick type 144501 and with a tensile strength test apparatus KAF-Z with 1 kN load cell.

An adhesive transfer tape was used as described in the present invention to bond: ceramic to steel, ceramic to ceramic and rubber to steel.

The assembled assemblies were exposed for 24 hours to the following conditions:

• 20% RH, 20 ° C - dry room conditions

• 85% RH, 30 ° C - bathroom conditions

• 98% RH, 40 ° C - bathroom conditions

• 98% RH, 65 ° C - bathroom conditions

The joint area was 0.5 inches2 (322.6 mm2)

The results are shown in general in Table 16, below. Curing conditions: performed according to STM 700 fixed with jaws for 24 hours under the indicated conditions. The binding force to the TA was measured.

Table 16

 ceramic-ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 32.1 29.5 42.6

 MPa media

 0.977 0.897 1.295

 type of fault

 FC FA Ceramica FC

 85% RH, 30 ° C

 Kg average

 85.3 151.0 153.1

 Average MPa

 2,594 4,592 4,655

 type of fault

 FC FA Ceramica FC

 98% RH, 40 ° C

 Kg average

 137.7 90.5 181.0

 Average MPa

 4,187 2,752 5,503

 type of fault

 FA Ceramica FC substrate failure

 98% RH, 65 ° C

 Kg average

 64.7 114.4 270.1

 Average MPa

 1,966 3,505 8,212

 type of fault

 FC FA Ceramica FC

 Note: FC = cohesive failure; FA = adhesive failure; FS = Substrate failure

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This type of failure indicates a successful treatment and a good adhesive option.

In very humid environments (relative humidity (RH) greater than 85% and greater than 30 ° C), Tape 1, which has a joined area of 0.5 inches2 (12.7 mm2), supports a weight between approximately 65 and 270 kg, according to the substrate.

The failure of the substrate under a humidity of 98% and at 40 ° C indicates an extreme resistance of the joint.

Adhesive strength is superior in very humid media compared to standard ambient conditions.

The results for the union of Tape 1 at different humidity levels for different substrates:

Cured with 85% RH, 30 ° C:

Ceramic and GBMS - force applied until the joint is broken: 4.6 MPa (151 kg) short term Ceramic and ceramic - force applied until the joint is broken: 2.6 MPa (85 kg)

GBMS-GBMS - 4.6 MPa (153 Kg)

Cured with 98% RH, 40 ° C:

Ceramics and GBMS - force applied until the joint is broken: 2.8 MPa (92 kg) short term

Ceramic and ceramic - applied force: 4.2 MPa (138 Kg) - substrate failure: the adhesion is stronger than the

substratum

GBMS-GBMS - force applied until the joint is broken: 5.5 MPa (181 kg)

Cured with 98% RH, 65 ° C:

Ceramics and GBMS - force applied until the joint is broken: 3.5 MPa (114 kg) short term Ceramic and ceramic - force applied until the joint is broken: 1.9 MPa (65 kg)

GBMS-GBMS - force applied until the joint is broken: 8.2 MPa (270 kg)

Desirably, the structural transfer adhesive tape is transparent, only a few micrometers thick and adheres to the surface mayonnaise.

Tables 17 to 21 compare the suitability of Tape 1 with different products. Comparative experimental results with overlapping panels are shown in Table 17 to 21. Curing conditions according to STM 700 with jaws for the indicated curing conditions. Direct exposure to a medium of high temperature and humidity achieved cure. Union forces were measured at TA

Table 17

 Tape 1

 Results with overlapping test plates

 ceramic- ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 32.1 29.5 42.6

 Average MPa

 0.977 0.897 1.295

 type of fault

 FC FA Ceramica FC

 85% RH, 30 ° C

 Kg average

 85.3 151.0 153.1

 Average MPa

 2,594 4,592 4,655

 type of fault

 FC FA Ceramica FC

 98% RH, 40 ° C

 Kg average

 137.7 90.5 181.0

 Average MPa

 4,187 2,752 5,503

 type of fault

 FS FA Ceramic FC

 98% RH, 65 ° C

 Kg average

 64.7 100.3 270.1

 Average MPa

 1,966 3,050 8,212

 type of fault

 FC FA Ceramica FC

 Note: FC = cohesive failure; FA = adhesive failure; FS = Substrate failure

Table 18 - comparison

 Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML)

 Results with overlapping test plates

 ceramic-ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 33.4 48.1 40.8

 MPa media

 1,525 1,463 1,860

 type of fault

 CF CF CF

 85% RH, 30 ° C

 Kg average

 36.8 45.8 56.5

 MPa media

 1,680 2,090 2,575

 type of fault

 FC FC FC

 98% RH, 40 ° C

 Kg average

 35.4 41.0 66.9

 Average MPa

 1,615 1,870 3,050

 type of fault

 FC FC FC

 98% RH, 65 ° C

 Kg average

 42.3 58.3 69.5

 Average MPa

 1,930 2,660 3,170

 type of fault

 FC / FS FC / FS FC

 Note: FC = cohesive failure; FA = adhesive failure; FS = Substrate failure

Table 19 - Comparative data

 Unibond No More Nails (original)

 Results with overlapping test plates

 ceramic-ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 0.9 1.9 4.7

 Average MPa

 0.040 0.085 0.215

 type of fault

 FC FC FC

 85% RH, 30 ° C

 Kg average

 0.8 3.3 66.4

 Average MPa

 0,035 0,150 2,019

 type of fault

 FC FC FC

 98% RH, 40 ° C

 Kg average

 2.0 4.9 19.0

 Average MPa

 0.090 0.225 0.865

 type of fault

 FC FC FC

 98% RH, 65 ° C

 Kg average

 2.0 8.7 14.9

 Average MPa

 0.090 0.395 0.680

 type of fault

 FC FC FC

 Note: FC = cohesive failure; FA = adhesive failure; FS = Substrate failure

5 _______________________________ Table 20 - Comparative data

 467MP of 3M

 Results with overlapping test plates

 ceramic-ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 0.2 1.1 16.0

 Average MPa

 0.020 0.100 0.487

 type of fault

 _________ af) ________ FC FC

 85% RH, 30 ° C

 Kg average

 4.5 11.2 11.9

 Average MPa

 0.205 0.510 0.545

 type of fault

 _________ af) ________ FC FC

 98% RH, 40 ° C

 Kg average

 5.0 6.7 11.5

 Average MPa

 0.230 0.305 0.525

 type of fault

 af) FC FC

 98% RH, 65 ° C

 Kg average

 11.3 10.3 11.7

 Average MPa

 0.515 0.470 0.535

type of fault | _________ FA _________ | __________ FC __________ | __________ FC

_______ Note: FC = cohesive failure; FA = adhesive failure; FS = Substrate failure_____

Table 21 - Comparative data

 Tesa Powerstrips

 Results with overlapping test plates

 ceramic-ceramic ceramic-GBMS GBMS-GBMS

 20% RH, 20 ° C

 Kg average

 2.0 2.4 3.0

 Average MPa

 0.18 0.22 0.27

 type of fault

 FA FA FA

 85% RH, 30 ° C

 Kg average

 6.1 6.2 9.5

 Average MPa

 0.280 0.285 0.435

 type of fault

 FA FA FA

 98% RH, 40 ° C

 Kg average

 5.0 6.6 14.0

 Average MPa

 0.230 0.300 0.640

 type of fault

 FA FA FA

 98% RH, 65 ° C

 Kg average

 9.3 13.4 17.6

 Average MPa

 0.425 0.610 0.805

 type of fault

 FA FA FA

 Note: FC = cohesive failure; FA

 = adhesive failure; FS = Substrate failure

The structural transfer adhesive tapes as described in the present invention will withstand 30 to 5 270 kg, depending on the material, humidity and temperature before breaking.

_____________________Table 22 - Experiments with overlapping plates on GBMS_____________________

Results of tests with overlapping plates after curing ^ on GBMS

 Tape 1 Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML) “No More Nails” by Unibond (original) 467MP of 3M

 Cured

 Load N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 24 h

 1025.87 3.18 500.03 1.55 51.62 0.16 235.50 0.73

 983.93

 3.05 571.00 1.77 87.10 0.27 209.69 0.65

 741.98

 2.3 700.04 2.17 - - 200.01 0.62

 Half

 2.84 Average 1.83 Average 0.22 Average 0.67

 dev. its T.

 0.48 dev. its T. 0.31 dev. its T. 0.08 dev. its T. 0.06

 1 week at TA

 1935.60 6.00 1080.71 3.35 883.92 2.74 206.46 0.64

 1342.02

 4.16 1112.97 3.45 600.04 1.86 148.40 0.46

 2035.61

 6.31 1248.46 3.87 541.97 1.68 - -

 Half

 5.49 Average 3.56 Average 2.09 Average 0.55

 dev. its T.

 1.16 dev. its T. 0.28 dev. its T. 0.57 dev. its T. 0.13

 1 h at 70 ° C + 24 h at RT

 1332.34 4.13 1035.55 3.21 274.21 0.85 190.33 0.59

 2529.18

 7.84 832.31 2.58 145.17 0.45 209.69 0.65

 2216.26

 6.87 1306.53 4.05 148.40 0.46 183.88 0.57

 Half

 6.28 Average 3.28 Average 0.59 Average 0.60

 dev. its T.

 1.92 dev. its T. 0.74 dev. its T. 0.23 dev. its T. 0.04

 1 h at 120 ° C + 24 h at RT

 4255.09 13.19 1435.57 4.45 1067.81 3.31 329.05 1.02

 4,306.71

 13.35 664.56 2.06 971.03 3.01 193.56 0.60

 4538.98

 14.07 980.70 3.04 925.86 2.87 306.47 0.95

 Half

 13.54 Average 3.18 Average 3.06 Average 0.86

 dev. its T.

 0.47 dev. its T. 1.20 dev. its T. 0.22 dev. its T. 0.23

Tape 1 exhibited better performance than comparative samples in the results with overlapping test plates 10 after curing on GBMS for all curing conditions shown in Table 22.

Table 23 - Experiments with overlapping plates on wood

Results of tests with overlapping plates after curing on wood

 Tape 1 Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML) “No More Nails” by Unibond (original) 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 24 h

 74.20 0.23 1058.13 3.28 1361.37 4.22 306.47 0.95

 783.92

 2.43 893.60 2.77 1493.64 4.63 358.09 1.11

 903.28

 2.80 1238.78 3.84 1274.27 3.95 - -

 Half

 1.82 Average 3.30 Average 4.27 Average 1.03

 dev. its T.

 1.39 dev. its T. 0.54 dev. its T. 0.34 dev. its T. 0.11

 1 week at TA

 1074.26 3.33 1277.50 3.96 1593.64 4.94 425.83 1.32

 861.34

 2.67 1148.46 3.56 1467.83 4.55 416.15 1.29

 1003.29

 3.11 - - - - - -

 Half

 3.04 Average 3.76 Average 4.75 Average 1.31

 dev. its T.

 0.34 dev. its T. 0.28 dev. its T. 0.28 dev. its T. 0.02

 1 h at 70 ° C + 24h TA

 1471.06 4.56 1125.87 3.49 1293.63 4.01 322.60 1.00

 787.14

 2.44 1067.81 3.31 1145.23 3.55 419.38 1.30

 977.48

 3.03 1222.65 3.79 - - - -

 Half

 3.34 Average 3.53 Average 3.78 Average 1.15

 dev. its T.

 1.09 dev. its T. 0.24 dev. its T. 0.33 dev. its T. 0.21

Table 24 - Experiments with overlapping plates on glass

Results of tests with overlapping plates after curing on glass

 Tape 1 Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML) Unibond No More Nails (original) 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 24 h

 293.57 0.91 954.90 2.96 - ruling 151.62 0.47

 48.39

 0.15 1771.07 5.49 - ruling 187.11 0.58

 661.33

 2.05 919.41 2.85 - failure - -

 Half

 1.04 Average 3.77 Average - Average 0.53

 dev. its T.

 0.96 dev. its T. 1.49 dev. its T. - dev. its T. 0.08

 1 week at TA

 651.65 2.02 1012.96 3.14 64.52 0.20 283.89 0.88

 293.57

 0.91 1351.69 4.19 74.20 0.23 222.59 0.69

 693.59

 2.15 - - - - 0.00 -

 Half

 1.69 Average 3.67 Average 0.22 Average 0.79

 dev. its T.

 0.68 dev. its T. 0.74 dev. its T. 0.02 dev. its T. 0.13

 1 h at 70 ° C + 24 h at RT

 912.96 2.83 400.02 1.24 32.26 0.10 429.06 1.33

 1412.99

 4.38 358.09 1.11 32.26 0.10 361.31 1.12

 551.65

 1.71 1377.50 4.27 32.26 0.10 - -

 Half

 2.97 Average 2.21 Average 0.10 Average 1.23

 dev. its T.

 1.34 dev. its T. 1.79 dev. its T. 0.00 dev. its T. 0.15

Failure = union failure without applying force

5 Tables 25 to 27 show the results of tests with overlapping plates for the adhesion of Ceramic-Ceramic, Ceramic-GBMS and GBMS-GBMS Tape 1. Curing conditions: the joints were achieved without fixation with jaws and were exposed directly to the medium of high temperature and humidity and were tested according to the STM 700 standard. The bonding forces were measured at RT

10 ____________________________________________ Table 25___________________________________________

Tape 1

Test results with overlapping plates over time at 30 ° C and with 35% relative humidity

 Aging

 24h, 48h 100h, 500h 1000h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramics-Ceramics

 854.89 2.65 293.57 0.91 45.16 0.14 490.35 1.52 138.72 0.43

 6.13

 0.02 309.70 0.96 332.28 1.03 283.89 0.88 FAIL

 558.10

 1.73 FAIL FAIL 393.57 1.22 FAIL

 Half

 1.47 Average 0.94 Average 0.59 Average 1.21 Average 0.43

 dev. its T.

 1.34 dev. its T. 0.04 dev. its T. 0.63 dev. its T. 0.32 dev. its T. # DIV / 0!

 Ceramics-

 603.26 1.87 393.57 1.22 1235.56 3.83 296.79 0.92 151.62 0.47

 GBMS

 880.70 2.73 41.94 0.13 406.48 1.26 248.40 0.77 283.89 0.88

 680.69

 2.11 748.43 2.32 625.84 1.94 358.09 1.11 70.97 0.22

 Half

 2.24 Average 1.22 Average 2.34 Average 0.93 Average 0.52

 dev. its T.

 0.44 dev. its T. 1.10 dev. its T. 1.33 dev. its T. 0.17 dev. its T. 0.33

 GBMS-GBMS

 974.25 3.02 119.36 0.37 1132.33 3.51 1000.06 3.10 3064.70 9.50

 681.98

 2.11 67.75 0.21 1290.40 4.00 129.04 0.40 1451.70 4.50

 893.60

 2.77 106.46 0.33 1561.38 4.84 1258.14 3.90 2838.88 8.80

 Half

 2.63 Average 0.30 Average 4.12 Average 2.47 Average 7.60

 dev. its T.

 0.47 dev. its T. 0.08 dev. its T. 0.67 dev. its T. 1.83 dev. its T. 2.71

Failure = union failure without applying force

___________________________________________ Table 26

Tape 1

Test results with overlapping plates over time at 40 ° C and with 98% relative humidity

 Aging

 24h, 48h 100h, 500h 1000h

 Load ___ (N)

 N / mm2 Load (N) N / mm2 Load ___ (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramics-Ceramics

 Bug 389.06 1.21 Bug 77.42 0.24 116.14 0.36

 96.78

 0.30 145.17 0.45 16.13 0.05 103.23 0.32 222.59 0.69

 345.18

 1.07 356.15 1.10 183.88 0.57 174.20 0.54 83.88 0.26

 Half

 0.69 Average 0.92 Average 0.31 Average 0.37 Average 0.44

 dev. its T.

 0.54 dev. its T. 0.41 dev. its T. 0.37 dev. its T. 0.16 dev. its T. 0.23

 GBMS ceramic

 1422.67 4.41 3.23 0.01 212.92 0.66 67.75 0.21 35.49 0.11

 216.14

 0.67 461.32 1.43 22.58 0.07 148.40 0.46 103.23 0.32

 467.77

 1.45 Fault Fault 132.27 0.41 Failure

 Half

 2.18 Average 0.72 Average 0.37 Average 0.36 Average 0.22

 dev. its T.

 1.97 dev. its T. 1.00 dev. its T. 0.42 dev. its T. 0.13 dev. its T. 0.15

 GBMS-GBMS

 554.87 1.72 112.91 0.35 1332.34 4.13 1419.44 4.40 2129.16 6.60

 1264.59

 3.92 109.68 0.34 1661.39 5.15 2161.42 6.70 1387.18 4.30

 1390.41

 4.31 116.14 0.36 2077.54 6.44 1096.84 3.40 1903.34 5.90

 Half

 3.32 Average 0.35 Average 5.24 Average 4.83 Average 5.60

 dev. its T.

 1.40 dev. its T. 0.01 dev. its T. 1.16 dev. its T. 1.69 dev. its T. 1.18

Failure = union failure without applying force

Tables 27 to 31 compare the suitability of Tape 1 with alternative commercially available products. The 5 comparative experimental results with overlapping panels are shown in Tables 25 to 31. Curing conditions: the joints were achieved without fixation with jaws and were exposed directly to the medium of high temperature and humidity and were tested according to STM 700 The union forces were measured at the TA

10 ____________________________________________ Table 27

Tape 1

Test results with overlapping plates during time at room temperature and with 30% to 35% relative humidity

 Aging

 24h, 48h 100h, 500h 1000h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramics-Ceramics

 264.53 0.82 70.97 0.22 696.82 2.16 948.44 2.94 874.25 2.71

 441.96

 1.37 361.31 1.12 419.38 1.30 696.82 2.16 877.47 2.72

 232.27

 0.72 80.65 0.25 396.80 1.23 751.66 2.33 1035.55 3.21

 Half

 0.97 Average 0.53 Average 1.56 Average 2.48 Average 2.88

 dev. its T.

 0.35 dev. its T. 0.51 dev. its T. 0.52 dev. its T. 0.41 dev. its T. 0.29

 Ceramics- GBMS

 248.40 0.77 667.78 2.07 1000.06 3.10 1490.41 4.62 1235.56 3.83

 258.08

 0.80 693.59 2.15 641.97 1.99 887.15 2.75 519.39 1.61

 245.18

 0.76 432.28 1.34 280.66 0.87 1393.63 4.32 651.65 2.02

 Half

 0.78 Average 1.85 Average 1.99 Average 3.90 Average 2.49

 dev. its T.

 0.02 dev. its T. 0.45 dev. its T. 1.12 dev. its T. 1.00 dev. its T. 1.18

 Ceramic- Aluminum

 64.52 0.20 41.94 0.13 319.37 0.99 1087.16 3.37 1183.94 3.67

 67.75

 0.21 232.27 0.72 264.53 0.82 780.69 2.42 1164.59 3.61

 70.97

 0.22 138.72 0.43 290.34 0.90 974.25 3.02 1187.17 3.68

 Half

 0.21 Average 0.43 Average 0.90 Average 2.94 Average 3.65

 dev. its T.

 0.01 dev. its T. 0.30 dev. its T. 0.09 dev. its T. 0.48 dev. its T. 0.04

 GBMS-GBMS

 345.18 1.07 964.57 2.99 1003.29 3.11 1290.40 4.00 1129.10 3.50

 251.63

 0.78 196.79 0.61 1380.73 4.28 1000.06 3.10 1129.10 3.50

 200.01

 0.62 358.09 1.11 706.49 2.19 1322.66 4.10 2645.32 8.20

 Half

 0.82 Average 1.57 Average 3.19 Average 3.73 Average 5.07

 dev. its T.

 0.23 dev. its T. 1.25 dev. its T. 1.05 dev. its T. 0.55 dev. its T. 2.71

Table 28

Nie wieder bohren (TEROSTAT MS 9380 WEISS DK310ML) ____________________________________________

Test results with overlapping plates during time at room temperature and with 30% to 35% relative humidity

 Aging

 24h, 48h 100h, 500h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramic-ceramic

 574.23 1.78 664.56 2.06 893.60 2.77 1090.39 3.38

 409.70

 1.27 716.17 2.22 745.21 2.31 732.30 2.27

 464.54

 1.44 709.72 2.20 822.63 2.55 548.42 1.70

 Half

 1.50 Average 2.16 Average 2.54 Average 2.45

 dev. its T.

 0.26 dev. its T. 0.09 dev. its T. 0.23 dev. its T. 0.85

 Ceramic-GBMS

 161.30 0.50 403.25 1.25 687.14 2.13 819.40 2.54

 558.10

 1.73 612.94 1.90 1058.13 3.28 1109.74 3.44

 696.82

 2.16 745.21 2.31 877.47 2.72 932.31 2.89

 Half

 1.46 Average 1.82 Average 2.71 Average 2.96

 dev. its T.

 0.86 dev. its T. 0.53 dev. its T. 0.58 dev. its T. 0.45

 Ceramic-Aluminum

 200.01 0.62 300.02 0.93 400.02 1.24 541.97 1.68

 174.20

 0.54 261.31 0.81 393.57 1.22 435.51 1.35

 193.56

 0.60 258.08 0.80 393.57 1.22 464.54 1.44

 Half

 0.59 Average 0.85 Average 1.23 Average 1.49

 dev. its T.

 0.04 dev. its T. 0.07 dev. its T. 0.01 dev. its T. 0.17

 GBMS-GBMS

 500.03 1.55 803.27 2.49 980.70 3.04 941.99 2.92

 571.00

 1.77 841.99 2.61 458.09 1.42 1019.42 3.16

 700.04

 2.17 806.50 2.50 722.62 2.24 967.80 3.00

 Half

 1.83 Average 2.53 Average 2.23 Average 3.03

 dev. its T.

 0.31 dev. its T. 0.07 dev. its T. 0.81 dev. its T. 0.12

 Table 29

 “No More Nails” by Unibond (original)

 Test results with overlapping plates during time at room temperature and with 30% to 35% relative humidity

 Aging

 24h, 48 h 100 h 500 h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramic-ceramic

 16.13 0.05 19.36 0.06 51.62 0.16 58.07 0.18

 9.68

 0.03 19.36 0.06 54.84 0.17 96.78 0.30

 Half

 0.04 Average 0.06 Average 0.17 Average 0.24

 dev. its T.

 0.01 dev. its T. 0.00 dev. its T. 0.01 dev. its T. 0.08

 Ceramic-GBMS

 41.94 0.13 22.58 0.07 135.49 0.42 406.48 1.26

 12.90

 0.04 25.81 0.08 116.14 0.36 429.06 1.33

 Half

 0.09 Average 0.08 Average 0.39 Average 1.30

 dev. its T.

 0.06 dev. its T. 0.01 dev. its T. 0.04 dev. its T. 0.05

 Ceramic-Aluminum

 22.58 0.07 19.36 0.06 61.29 0.19 106.46 0.33

 19.36

 0.06 22.58 0.07 51.62 0.16 187.11 0.58

 Half

 0.07 Average 0.07 Average 0.18 Average 0.46

 dev. its T.

 0.01 dev. its T. 0.01 dev. its T. 0.02 dev. its T. 0.18

 GBMS-GBMS

 51.62 0.16 100.01 0.31 80.65 0.25 554.87 1.72

 87.10

 0.27 80.65 0.25 212.92 0.66 509.71 1.58

 Half

 0.22 Average 0.28 Average 0.46 Average 1.65

 dev. its T.

 0.08 dev. its T. 0.04 dev. its T. 0.29 dev. its T. 0.10

__________________________________________ Table 30

467MP of 3M

Test results with overlapping plates during time at room temperature and with 30% to 35% relative humidity

 Aging

 24h, 48h 100h, 500h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramic-ceramic

 6.45 0.02 6.45 0.02 32.26 0.10 16.13 0.05

 Half

 0.02 Average 0.02 Average 0.10 Average 0.05

 Ceramic-GBMS

 32.26 0.10 19.36 0.06 51.62 0.16 251.63 0.78

 Half

 0.10 Average 0.06 Average 0.16 Average 0.78

 Ceramic-Aluminum

 48.39 0.15 22.58 0.07 16.13 0.05 29.03 0.09

 Half

 0.15 Average 0.07 Average 0.05 Average 0.09

 GBMS-GBMS

 235.50 0.73 129.04 0.40 12.90 0.04 19.36 0.06

 209.69

 0.65 - - - - - -

 200.01

 0.62 - - - - - -

 Half

 0.67 Average 0.40 Average 0.04 Average 0.06

 dev. its T.

 0.06 dev. its T. dev. its T. dev. its T.

 Table 31

 Tesa Powerstrips

 Test results with overlapping plates during time at room temperature and with 30% to 35% relative humidity

 Aging

 24 h 48 h 100 h 500 h

 Load (N)

 N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 Ceramic-ceramic

 87.10 0.27 83.88 0.26 209.69 0.65 87.10 0.27

 Half

 0.27 Average 0.26 Average 0.65 Average 0.27

 Ceramic-GBMS

 70.97 0.22 45.16 0.14 77.42 0.24 58.07 0.18

 Half

 0.22 Average 0.14 Average 0.24 Average 0.18

 Ceramic-Aluminum

 96.78 0.30 45.16 0.14 103.23 0.32 106.46 0.33

 Half

 0.30 Average 0.14 Average 0.32 Average 0.33

 GBMS-GBMS

 58.07 0.18 58.07 0.18 61.29 0.19 77.42 0.24

 Half

 0.18 Average 0.18 Average 0.19 Average 0.24

5 Tables 32 and 33 show the suitability of 3M Tape 1 and 467MP in shear resistance experiments after curing and aging at room temperature. Curing conditions: performed in accordance with STM 700 on GBMS with jaws for the indicated curing conditions. The jaws were removed after the curing time and the specimen was stored at room temperature for the indicated time. The binding force to the TA was measured.

10

Table 32

 Tape 1

 Test results with overlapping plates after curing and aging at room temperature

 Aging

 24 h 48 h 100 h 500 h 1,000 h

 Cured

 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 1,561.38 4.84 1,867.85 5.79 1,754.94 5.44 2,158.19 6.69 2,451.76 7.60

 1,777.53 5.51 1,983.99 6.15 2,125.93 6.59 2,116.26 6.56 1,361.37 4.22

 1,548.18 6.07 1,477.51 4.58 2,071.09 6.42 2,835.65 8.79 1,967.86 6.10

 Average 5.47 Average 5.51 Average 6.15 Average 7.35 Average 5.97

 dev. its T. 0.62 dev. its T. 0.82 dev. its T. 0.62 dev. its T. 1.25 dev. its T. 1.69

 1 week at TA

 3,080.83 9.55 1,871.08 5.80 1,438.80 4.46 996.83 3.09 3,332.46 10.33

Table 33

 Tape 1

 Test results with overlapping plates after curing and aging at room temperature

 Aging

 24 h 48 h 100 h 500 h

 Cured

 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 190.33 0.59 238.72 0.74 222.59 0.69 183.88 0.57

 141.94 0.44 335.50 1.04 87.10 0.27 319.37 0.99

 Average 0.52 Average 0.89 Average 0.48 Average 0.78

 dev. its T. 0.11 dev. its T. 0.21 dev. its T. 0.30 dev. its T. 0.30

 1 h at 120 ° C + 24 h at RT

 216.14 0.67 322.60 1.00 287.11 0.89 148.40 0.46

 183.88 0.57 280.66 0.87 193.56 0.60 367.76 1.14

 Average 0.62 Average 0.94 Average 0.75 Average 0.80

 dev. its T. 0.07 dev. its T. 0.09 dev. its T. 0.21 dev. its T. 0.48

Tables 34 and 35 show the suitability of Tape 1 and 467MP of 3M in experimental shear resistance during time at different temperatures. Curing conditions: performed in accordance with 5 STM 700 with jaws for the curing conditions indicated on GBMS. The jaws were removed after the curing time and the specimen was stored at different temperatures for the indicated time. The binding force to tA was measured.

Table 34

 Tape 1

 Results of shear resistance over time at different temperatures.

 Cured

 24 h at TA | | | | |

 Aging temperature

 Initial values N / mm2 24 h N / mm2 48 h N / mm2 100 h N / mm2 500 h N / mm2 1000 h N / mm2

 35 ° C

 2.84 7.13 6.33 6.59 7.74 7.01

 60 ° C

   13.49 12.49 8.98 13.53 13.22

 80 ° C

   12.9 13.01 12.12 13.11 11.92

 100 ° C

   13.62 13.84 13.23 12.77 Perf.

 Cured

 1 week at TA

 Aging temperature

 Initial values N / mm2 24 h N / mm2 48 h N / mm2 100 h N / mm2 500 h N / mm2 1000 h N / mm2

 35 ° C

 5.49 7.62 7.12 7.22 9.54 10.76

 60 ° C

   10.77 10.64 7.03 8.49 13.82

 80 ° C

   9.86 11.67 11.55 13.24 13.56

 100 ° C

   10.36 11.92 11.82 14.48 11.7

10

 Cured

 1 h at 120 ° C + 24 h at RT | | | | |

 Aging temperature

 Initial values N / mm2 24 h N / mm2 48 h N / mm2 100 h N / mm2 500 h N / mm2 1000 h N / mm2

 35 ° C

 8.48 10.1 9.47 9.95 8.97 11.4

 60 ° C

   11.11 11.3 11.39 8.32 3.8

 80 ° C

   10.86 13.55 15.41 11.13 12.3

 100 ° C

   14.1 7.92 5.42 0.2 12.6

Table 35 - Comparative data

 467MP of 3M

 Results of shear resistance over time at different temperatures.

 Cured

 24 h at TA | | | |

 Aging temperature

 Initial values N / mm2 24 h N / mm2 48 h N / mm2 100 h N / mm2 500 h N / mm2

 60 ° C

 0.67 0.67 0.90 0.59 0.74

 100 ° C

   0.41 0.41 0.47 1.45

 Cured

 1 h at 120 ° C + 24h TA

 Aging temperature

 Initial values N / mm2 24 h N / mm2 48 h N / mm2 100 h N / mm2 500 h N / mm2

 60 ° C

 0.86 0.80 0.86 0.76 0.48

 100 ° C

   0.41 0.70 0.56 1.68

Table 36 shows the results of Tape 1 and 467MP of 3M in experimental shear strength after high temperature cure. Curing conditions: performed in accordance with STM 700 with jaws for the indicated curing conditions.

5 Table 36

Results of resistance tests to shear stress after curing

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 1 h at 150 ° C + 24 h at RT

 4159.41 12.89 412.93 1.28

 4366.95

 13.54 461.32 1.43

 4266.02

 13.22 77.42 0.24

 Half

 13.22 Average 0.98

 dev. its T. 0.33 dev. its T. 0.65

 1 h at 175 ° C + 24 h at RT

 4384.77 13.59 280.66 0.87

 4625.14

 14.34 529.06 1.64

 4566.57

 14.16 438.74 1.36

 Half

 14.03 Average 1.29

 dev. its T.

 0.39 dev. its T. 0.39

 1 h at 200 ° C + 24 h at RT

 1777.48 5.51 835.53 2.59

 2335.62

 7.24 1106.52 3.43

 2016.07

 6.25 729.08 2.26

 Half

 6.33 Average 2.76

 dev. its T.

 0.87 dev. its T. 0.60

It is evident from the results in Table 36 that: Tape 1 exhibited a better performance than the comparative sample under all conditions of high cure temperature tested.

10 Solvent Resistance

The GBMS test specimen was cured and fixed in accordance with the STM 700 standard. The jaws were removed (then the initial tensile strength was determined) and the attached overlapping plate specimen was immersed in the indicated solvent or I leave under the indicated environmental conditions. After 24 h, 48 h, 100 h and 500 15 h, the overlapping plates of the solvent / environmental conditions were removed, allowed to dry to room temperature and subjected to the determination of tensile strength at room temperature.

Table 37 - Results of resistance tests to shear stress after curing for 24 h at RT

 Tape 1

 Solvent Resistance Test

 Initial resistance to shear stress: 0.93 MPa

 solvent:

 temp. % of initial shear strength preserved in

 24 h

 100 h 500 h

 engine oil

 40 789 608 726

 Unleaded petrol

 22 354 694 589

 ethanol

 22 308 506 61

 iso-propanol

 22 281 503 404

 Water

 22 471 725 444

 98% humidity

 40 946 1044 708

 Air

 22 377 665 641

20 Table 38 - Test results with overlapping plates after curing for 1 h at 120 ° C + 24 h at RT

 Tape 1

 Solvent Resistance Test

 initial shear resistance: 12.2 MPa

 solvent:

 temp. % of initial shear strength preserved in

 24 h

 100 h 500 h

 engine oil

 40 105 89 92

 Unleaded petrol

 22 99 93 86

 ethanol

 22 69 28 failure

 iso-propanol

 22 67 65 25

 Water

 22 71 89 60

 98% humidity

 40 72 49 32

 Air

 22 114 123 61

5

10

fifteen

twenty

25

30

35

40

 467MP of 3M

 Solvent Resistance Test

 initial shear resistance: 0.67 MPa

 solvent

 temp. % of initial shear strength preserved in

 24 h

 100 h 500 h

 Unleaded petrol

 22 40 13 failure

 ethanol

 22 16 fault fault

 iso-propanol

 22 18 fault fault

 Water

 22 90 107 72

 Air

 22 78 72 116

Table 40 - Test results with overlapping plates after curing for 1 h at 120 ° C + 24 h at RT

 467MP of 3M

 Solvent Resistance Test

 initial shear resistance: 0.86 MPa

 solvent:

 temp. % of initial shear strength preserved in

 24 h

 100 h 500 h

 Unleaded petrol

 22 34 26 failure

 ethanol

 22 27 fault fault

 iso-propanol

 22 40 fault fault

 Water

 22 55 55 50

 Air

 22 72 87 93

Example 7

Adhesive articles, such as those indicated in the present invention, such as Tape 1, bear a maximum weight of 15 kg after 9 hours of curing on a surface of 322.6 mm2, thus presenting a superior behavior to the sample comparative in a factor of three.

High humidity and temperature accelerate curing and develop bond strength. Therefore, when applied in wet areas, the union becomes stronger over time.

Optoelectronics

Structural transfer adhesive tapes such as those indicated in the present invention are particularly useful in the manufacture of optoelectronic and optical devices.

The following examples illustrate the suitability of the adhesive articles indicated in the present invention for applicability in the optical and electronic industries.

materials

Substrates

Wood pellets were cut for shear stress experiments from commercially available red beech wood in the dimensions of ordinary panels for shear stress tests. A specimen of nitrile-butadiene rubber was cut for shear stress tests from large blankets in the ordinary dimensions of the panels for shear strength tests in terms of width but half the length. The overlapping plates of mild steel and aluminum (as indicated) were shot blasting before use, using gypsum silicon carbide at a pressure of 4 bar according to the STM 700 standard in a 1ULA 1400 shot blasting machine. All other speckles for shear stress resistance test they were used without modification. All traction resistance studies with overlapping plate smears were carried out in accordance with STM 700.

Competition samples

3M 467MP double-sided transfer tape was used as a comparative sample. All samples of the competition were applied according to the recommendations of the suppliers. The preparation of overlapping plate smears, product application and tensile strength tests were carried out in accordance with STM 700.

5

10

fifteen

twenty

25

30

35

40

Four. Five

Additives

All additives were obtained from Sigma Aldrich and were used without modification, without further purification. Storage

The tapes were stored at 5 ° C or at room temperature in sealed aluminum bags.

Tensile strength determination

The strength of the union of the overlapping plates according to the STM 700 standard in an Instron 5567 with load cells of 30 kN, 1 kN and 100 N, respectively (Dublin), was determined in a Zwick Z100 tensile test apparatus with 100 kN and 1 kN load cells (Dublin) and with a traction test apparatus Zwick type 144501 (Dusseldorf).

refractive index

Refractive indices were measured on a Bellingham + Stanley 44-501 Abbe refractometer at 22 ° C-23 ° C.

Example 8 - Tape 3

The tape used herein is based on a coating mixture of a solid cyanoacrylate (50%, for example, neopentyl CA, 2-phenyl ethyl CA), hardening agents, such as Levamelt (50%) and additives such as dyes, dyes and pigments (% by weight) in an appropriate solvent (chloroform, ethyl acetate). The mixture must be adequately liquid for the coating and must show adequate stability.

A high refractive index (IR) and transparency is desired. The coating was carried out from solution on a carrier non-stick protector to form a transferable film after drying.

The IR can be determined directly from the tape using an Abbey refractometer.

The tape is covered with a non-stick protector with higher release properties than indicated above. The tape is stored in a sealed bag for later use or transferred from the non-stick protector to a part for immediate or subsequent attachment (or fixation) of optical devices. It can also be used as an encapsulant and in packaging.

The curable composition in Tape 3 comprised a mixture of Levamelt (4 g, 36.08% total solids, 11.08 g of solution in ethyl acetate), 2-phenyl-ethyl cyanoacrylate (4 g), CSA ( 48 µg, 0.2 g of stock solution in ethyl acetate), hydroquinone (6.4 mg, 0.8 g of stock solution in ethyl acetate) and beta-carotene (0.04 g), and dissolved in ethyl acetate (0.47 g). The coating solution was transferred to a siliconized polyethylene carrier non-stick protector by means of an automatic coating device. The solvent was removed at elevated temperature. A consistent uniform film was left on the nonstick protector. Next, the film was covered with a non-stick protector and stored in a heat-sealed aluminum bag at lower temperatures.

The bond strength was determined according to STM-700.

__________________Table 41 - Experiments with overlapping plates on GBMS__________________

Test results with overlapping plates on GBMS

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 1025.87 3.18 235.50 0.73

 983.93

 3.05 209.69 0.65

 741.98

 2.3 200.01 0.62

 Average

 2.84 Average 0.67

 Dev. its T.

 0.48 Dev. its T. 0.06

 1 week at TA

 1935.60 6.00 206.46 0.64

 1342.02

 4.16 148.40 0.46

 2035.61

 6.31 -

 Average

 5.49 Average 0.55

 Dev. its T.

 1.16 dev. its T. 0.13

 1 h at 70 ° C + 24 h at RT

 1332.34 4.13 190.33 0.59

 2529.18

 7.84 209.69 0.65

 2216.26

 6.87 183.88 0.57

 Average 6.28 Average 0.60

 Dev. its T.

 1.92 Dev. its T. 0.04

 1 h at 120 ° C + 24 h at RT

 4255.09 13.19 329.05 1.02

 4306.71 13.35 193.56 0.60

 4538.98 14.07 306.47 0.95

 Average 13.54 Average 0.86

 Dev. its T. 0.47 Dev. its T. 0.23

5

As can be seen in Table 41, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on GBMS for each of the curing conditions tested.

Table 42 - Experiments with overlapping plates on wood

Test results with overlapping plates on wood

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 74.20 0.23 306.47 0.95

 783.92

 2.43 358.09 1.11

 903.28

 2.80 - -

 Average

 1.82 Average 1.03

 Dev. its T.

 1.39 Dev. its T. 0.11

 1 week at TA

 1074.26 3.33 425.83 1.32

 861.34

 2.67 416.15 1.29

 1003.29

 3.11 - -

 Average

 3.04 Average 1.31

 Dev. its T.

 0.34 Dev. its T. 0.02

 1 h at 70 ° C + 24 h at RT

 1471.06 4.56 322.60 1.00

 787.14

 2.44 419.38 1.30

 977.48

 3.03 - -

 Average

 3.34 Average 1.15

 Dev. its T.

 1.09 Dev. its T. 0.21

As can be seen in Table 42, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on wood for each of the curing conditions.

10

____________________ Table 44 - Experiments with overlapping plates on glass ____________________

Test results with overlapping glass plates

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 293.57 0.91 151.62 0.47

 48.39

 0.15 187.11 0.58

 661.33

 2.05 -

 Average

 1.04 Average 0.53

 Dev. its T.

 0.96 Dev. its T. 0.08

 1 week at TA

 680.69 2.11 283.89 0.88

 383.89

 1.19 222.59 0.69

 822.63

 2.55 -

 Average 1.95 Average 0.79

 Dev. its T.

 0.69 Dev. its T. 0.13

 1 h at 70 ° C + 24 h at RT

 912.96 2.83 429.06 1.33

 1412.99

 4.38 361.31 1.12

 551.65

 1.71 -

 Average

 2.97 Average 1.23

 Dev. its T.

 1.34 Dev. its T. 0.15

As can be seen in Table 44, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on glass for each of the curing conditions.

Table 45 - Experiments with overlapping plates on polycarbonate

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 32.26 0.10 258.08 0.80

 25.81

 0.08 245.18 0.76

 19.36

 0.06 -

 Average

 0.08 Average 0.78

 Dev. its T.

 0.02 dev. its T. 0.03

 1 week at TA

 77.42 0.24 193.56 0.60

 64.52

 0.20 216.14 0.67

 67.75

 0.21 -

 Average

 0.22 Average 0.64

 Dev. its T.

 0.02 dev. its T. 0.05

 1 h at 70 ° C + 24 h at RT

 200.01 0.62 200.01 0.62

 112.91

 0.35 116.14 0.36

 216.14

 0.67 -

 Average

 0.55 Average 0.49

 Dev. its T.

 0.17 dev. its T. 0.18

Table 46 - Experiments with overlapping plates on ABS

Test results with overlapping plates on ABS

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 451.64 1.40 148.40 0.46

 387.12

 1.20 161.30 0.50

 148.40

 0.46 - -

 Average

 1.02 Average 0.48

 Dev. its T.

 0.50 dev. its T. 0.03

 1 week at TA

 1196.85 3.71 132.27 0.41

 1425.89

 4.42 258.08 0.80

 1671.07

 5.18 - -

 Average

 4.44 Average 0.61

 Dev. its T.

 0.74 dev. its T. 0.28

 1 h @ 70 ° C + 24h

 790.37 2.45 225.82 0.70

 RT

 696.82 2.16 254.85 0.79

 735.53

 2.28 - -

 Average

 2.30 Average 0.75

 Dev. its T.

 0.15 dev. its T. 0.06

5

As can be seen in Table 46, Tape 3 exhibited a better performance than the comparative sample in experiments with overlapping plates on ABS for each of the curing conditions.

10 _________________Table 47 - Experiments with overlapping plates on PC / ABS 6600_________________

Test results with overlapping plates on PC / ABS mixture

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 438.74 1.36 90.33 0.28

 574.23

 1.78 87.10 0.27

 258.08

 0.80 87.10 0.27

 -

   70.97 0.22

 Average

 1.31 Average 0.26

 Dev. its T.

 0.49 Dev. its T. 0.03

 480.67 1.49 106.46 0.33

 1 week at TA

 1245.24 3.86 129.04 0.40

 877.47

 2.72 119.36 0.37

 512.93

 1.59 109.68 0.34

 Average

 2.42 Average 0.36

 Dev. its T.

 1.11 dev. its T. 0.03

 248.40 0.77 158.07 0.49

 1 h @ 70 ° C + 24 h at RT

 312.92 0.97 106.46 0.33

 571.00

 1.77 145.17 0.45

 674.23

 2.09 109.68 0.34

 Average

 1.40 Average 0.40

 Dev. its T.

 0.63 Dev. its T. 0.08

5

As can be seen in Table 47, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on PC / ABS (polycarbonate / acrylonitrium-butadiene-styrene) for each of the curing conditions.

Table 48 - Experiments with overlapping plates on IXEF (acrylamide compounds)

 Test results with overlapping plates on IXEF

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 64.52 0.20 61.29 0.19

 24 h at RT

 32.26 0.10 112.91 0.35

 116.14

 0.36 132.27 0.41

 58.07

 0.18 - -

 Average

 0.21 Average 0.32

 Dev. its T.

 0.11 dev. its T. 0.11

 109.68 0.34 125.81 0.39

 1 week at TA

 100.01 0.31 148.40 0.46

 132.27

 0.41 132.27 0.41

 122.59

 0.38 80.65 0.25

 Average

 0.36 Average 0.38

 Dev. its T.

 0.04 dev. its T. 0.09

 1167.81 3.62 103.23 0.32

 1 h at 70 ° C + 24 h at RT

 1222.65 3.79 209.69 0.65

 951.67

 2.95 109.68 0.34

 1132.33

 3.51 - -

 Average

 3.47 Average 0.44

 Dev. its T.

 0.36 Dev. its T. 0.19

Ixef® (arylamide) compounds typically contain 50% to 60% fiberglass reinforcement, providing them with remarkable strength and stiffness. What makes them unique is that even with high loads 10 on glass, the soft resin-rich surface provides a glossy finish that is ideal for painting, metallizing or producing a naturally reflective cover.

As can be seen in Table 48, Tape 3 showed a performance comparable to that of the comparative sample in experiments with overlapping plates when curing at RT. However, when curing 15 for 1 hour at 7 ° C and for 24 hours at RT, Tape 3 exhibited a better performance than the comparative sample by a factor of practically 10.

Table 49 - Experiments with overlapping plates on zinc bichromate

 Test results with zinc bichromate overlapping plates

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 35.49 0.11 58.07 0.18

 58.07

 0.18 141.94 0.44

 58.07

 0.18 - -

 Average

 0.16 Average 0.31

 Dev. its T.

 0.04 dev. its T. 0.18

 1 week at TA

 1145.23 3.55 290.34 0.90

 1632.36

 5.06 264.53 0.82

 1996.89

 6.19 - -

 Average

 4.93 Average 0.86

 Dev. its T.

 1.32 Dev. its T. 0.06

5

10

 1 h at 70 ° C + 24 h at RT

 200.01 0.62 300.02 0.93

 264.53

 0.82 170.98 0.53

 206.46

 0.64 - -

 Average

 0.69 Average 0.73

 Dev. its T.

 0.11 dev. its T. 0.28

As can be seen in Table 49, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on zinc bichromate after cure at RT for 1 week.

_______________Table 50 - Experiments with overlapping plates on anodized aluminum_______________

Test results with overlapping plates on anodized aluminum

 Headband

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 448.41 1.39 600.04 1.86

 716.17 2.22 287.11 0.89

 24 h at RT

 900.05 2.79 493.58 1.53

 183.88

 0.57 319.37 0.99

 535.52

 1.66 - -

 Average

 1.73 Average 1.32

 Dev. its T.

 0.84 Dev. its T. 0.46

 1303.30 4.04 516.16 1.60

 1 week at TA

 2429.18 7.53 680.69 2.11

 2577.57

 7.99 264.53 0.82

 1887.21

 5.85 467.77 1.45

 Average

 6.35 Average 1.50

 Dev. its T.

 1.80 dev. its T. 0.53

 1916.24 5.94 38.71 0.12

 1 h at 70 ° C + 24 h at RT

 2345.30 7.27 554.87 1.72

 1893.66

 5.87 712.95 2.21

 1732.36

 5.37 74.20 0.23

 Average

 6.11 Average 1.07

 Dev. its T.

 0.81 Dev. its T. 1.05

As can be seen in Table 50, Tape 3 exhibited a better performance than the comparative sample in experiments with overlapping plates on anodized aluminum under all curing conditions.

__________Table 51 - Experiments with overlapping plates on magnesium alloy__________

Test results with overlapping plates on magnesium alloy

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 477.45 1.48 203.24 0.63

 458.09 1.42 132.27 0.41

 24 h at RT

 729.08 2.26 132.27 0.41

 403.25

 1.25 238.72 0.74

 716.17

 2.22 - -

 Average

 1.73 Average 0.55

 Dev. its T.

 0.48 Dev. its T. 0.17

 964.57 2.99 180.66 0.56

 1 week at TA

 1506.54 4.67 116.14 0.36

 1216.20

 3.77 212.92 0.66

 1858.18

 5.76 132.27 0.41

 Average

 4.30 Average 0.50

 Dev. its T.

 1.19 dev. its T. 0.14

 1532.35 4.75 306.47 0.95

 1 h at 70 ° C + 24 h at RT

 1377.50 4.27 322.60 1.00

 1338.79

 4.15 122.59 0.38

 1203.30

 3.73 93.55 0.29

 Average 4.23 Average 0.66

 Dev. its T.

 0.42 Dev. its T. 0.37

As can be seen in Table 51, Tape 3 showed a better performance than the comparative sample in experiments with overlapping plates on magnesium alloy under all curing conditions.

Test results with overlapping lacquer plates

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 61.29 0.19 74.20 0.23

 167.75 0.52 58.07 0.18

 24 h at RT

 164.53 0.51 58.07 0.18

 183.88

 0.57 125.81 0.39

 661.33

 2.05 83.88 0.26

 Average

 0.77 Average 0.25

 Dev. its T.

 0.73 dev. its T. 0.09

 422.61 1.31 135.49 0.42

 1 week at TA

 267.76 0.83 106.46 0.33

 235.50

 0.73 158.07 0.49

 377.44

 1.17 106.46 0.33

 Average

 1.01 Average 0.39

 Dev. its T.

 0.27 Def. its T. 0.08

 496.80 1.54 67.75 0.21

 1 h at 70 ° C + 24 h at RT

 319.37 0.99 83.88 0.26

 248.40

 0.77 74.20 0.23

 212.92

 0.66 167.75 0.52

 Average

 0.99 Average 0.31

 Dev. its T.

 0.39 Dev. its T. 0.14

As can be seen in Table 52, Tape 3 exhibited a better performance than the comparative sample 5 in experiments with overlapping plates on 0754 lacquer in each of the curing conditions tested.

Table 53 - Experiments with overlapping plates on aluminum

Test results with overlapping plates on aluminum

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 380.67 1.18 58.07 0.18

 322.60

 1.00 32.26 0.10

 306.47

 0.95 - -

 Average

 1.04 Average 0.14

 Dev. its T.

 0.12 Dev. its T. 0.06

 1 week at TA

 1919.47 5.95 248.40 0.77

 1845.27

 5.72 222.59 0.69

 1583.97

 4.91 - -

 Average

 5.53 Average 0.73

 Dev. its T. 0.55 Def. its T. 0.06

 1 h at 70 ° C + 24 h at RT

 1735.59 5.38 - Fail

 858.12

 2.66 180.66 0.56

 874.25

 2.71 - -

 Average

 3.58 Average 0.56

 Dev. its T.

 1.56 dev. its T. -

10

As can be seen in Table 53, Tape 3 exhibited a better performance than the comparative sample in experiments with overlapping plates on aluminum under each of the curing conditions tested.

15 _____________ Table 54 - Experiments with overlapping plates on shot blasting aluminum

Test results with overlapping plates on shot blasting aluminum

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 274.21 0.85 261.31 0.81

 238.72

 0.74 206.46 0.64

 293.57

 0.91 - -

 Average

 0.83 Average 0.73

 Dev. its T.

 0.09 dev. its T. 0.12

 1 week at TA

 1254.91 3.89 200.01 0.62

 1335.56

 4.14 358.09 1.11

 1464.60

 4.54 - -

 Average

 4.19 Average 0.87

 Dev. its T.

 0.33 Dev. its T. 0.35

 1 h at 70 ° C + 24 h at RT

 1303.30 4.04 345.18 1.07

 867.79 2.69 322.60 1.00

 1961.41 6.08 - -

 Average 4.27 Average 1.04

 Dev. its T. 1.71 dev. its T. 0.05

5

As can be seen in Table 54, Tape 3 exhibited a better performance than the comparative sample in experiments with overlapping plates on shot blasting aluminum under each of the curing conditions tested.

___________Table 55 - Experiments with overlapping plates on butadiene nitrile rubber___________

Test results with overlapping plates on nitrile butadiene rubber

 Tape 3 467MP of 3M

 Cured

 Load (N) N / mm2 Load (N) N / mm2

 24 h at RT

 58.07 0.18 45.16 0.14

 41.94

 0.13 29.03 0.09

 51.62

 0.16 - -

 Average

 0.16 Average 0.12

 Dev. its T.

 0.03 dev. its T. 0.04

 1 week at TA

 70.97 0.22 41.94 0.13

 67.75

 0.21 38.71 0.12

 80.65

 0.25 - -

 Average

 0.23 Average 0.13

 Dev. its T. 0.02 dev. its T. 0.01

 1 h at 70 ° C + 24 h at RT

 48.39 0.15 38.71 0.12

 61.29

 0.19 48.39 0.15

 70.97

 0.22 - -

 Average

 0.19 Average 0.14

 Dev. its T.

 0.04 dev. its T. 0.02

As can be seen in Table 55, Tape 3 exhibited a better performance than the comparative sample in experiments with overlapping plates on nitrile butadiene rubber under each of the 10 curing conditions tested.

Tables 56 to 68 show the results of the binding performance experiments for variations in the formulation of the curable structural adhesive tapes (CAET) film, as indicated in the present invention.

fifteen

Table 56 - Variation in the formulation of the curable film for CAET; tensile strength over GBMS with the _________________________________time, tape stored at 5 ° C ._________________________________

 SATT

 Cured: 1h 60 ° C + 24 h at RT

 Tape stored at 5 ° C

 MPa initial MPa

 formulation / weeks

 0 1 2 3 4 5 6 7 8

 50% Levamelt, 50% PhEtCA

 6.28 7.80 5.91 10.27 9.60

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 7.91 8.52 3.48 9.10 8.22

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 4.68 6.04 5.19 5.93 6.81

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 6.45 6.17 6.52 9.00 7.14

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 7.74 8.46 5.73 10.94 7.29

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 6.77 7.79 6.12 10.95 7.78

 50% Levamelt, 50% PhEtCA + beta

 8.49 7.78 8.80 8.53 8.37

 1% phenyl ethyl CA by weight

 50% Levamelt, 50% PhEtCA + 1% Ferrocene BF4 by weight

 7.13 4.9 3.69 2.08 2.91 4.65 5.26 2.85 5.08

 50% Levamelt, 50% PhEtCA + 1% by weight gallium (III) perchlorate

 4.93 2.84 5.31 3.39 3.19 3.90 7.91 3.84 9.19

 50% Levamelt, 50% PhEtCA + 1 w% quantum dot sol.

 4.22 8.45

 Cured: 24 h at RT

 Tape stored at 5 ° C

 MPa initial MPa

 formulation / weeks

 0 1 2 3 4 5 6 7 8

 50% Levamelt, 50% PhEtCA

 2.20 2.23 2.30 2.91 2.26

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 1.88 2.00 2.01 3.16 2.44

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 1.05 0.99 1.02 1.13 1.63

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 0.98 1.12 1.96 0.76 1.84

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 2.70 2.63 2.88 2.48 3.28

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 3.00 2.63 2.85 1.99 3.56

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 2.02 1.99 2.55 1.63 2.87

 50% Levamelt, 50% PhEtCA + 1% Ferrocene BF4 by weight

 1.09 0.18 0.29 0.11 0.22 0.39 1.39 0.28 0.61

 50% Levamelt, 50% PhEtCA + 1% by weight gallium (III) perchlorate

 0.49 0.23 0.62 0.06 0.36 0.94 1.83 0.67 0.77

 50% Levamelt, 50% PhEtCA + sun. quant points 1% by weight

 2.08 2.79

Table 57 - Variation in the formulation used for CAET, percentage of initial tensile strength with the

time, tape stored at 5 ° C.

 SATT

     | |

 Cured: 1h 60 ° C + 24 h at RT

 Tape stored at 5 ° C

 Initial MPa% of initial tensile strength

 formulation / week

 0 1 2 3 4 5 6 7 8

 50% Levamelt, 50% PhEtCA

 100 124 94 164 153

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 108 44 115 104

 50% Levamelt, 50% PhEtCA + violet m- Cresol 0.5% by weight

 100 129 111 127 146

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 96 101 140 111

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 109 74 141 94

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 115 90 162 115

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 92 104 100 99

 50% Levamelt, 50% PhEtCA + 1% Ferrocene BF4 by weight

 100 69 52 29 41 65 74 40 71

 50% Levamelt, 50% PhEtCA + 1% by weight gallium (III) perchlorate

 100 58 108 69 65 79 160 78 186

 50% Levamelt, 50% PhEtCA + sun. quant points 1% by weight

 100 200

 Cured: 24 h at RT

 Tape stored at 5 ° C

 Initial MPa% of initial tensile strength

 formulation / week

 0 1 2 3 4 5 6 7 8

 50% Levamelt, 50% PhEtCA

 100 101 105 132 103

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 106 107 168 130

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 100 94 97 108 155

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 114 200 78 188

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 97 107 92 121

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 88 95 66 119

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 99 126 81 142

 50% Levamelt, 50% PhEtCA + 1% Ferrocene BF4 by weight

 100 17 27 10 20 36 127 26 56

 50% Levamelt, 50% PhEtCA + 1% by weight gallium (III) perchlorate

 100 47 127 12 73 193 373 137 157

 50% Levamelt, 50% PhEtCA + sun. quant points 1% by weight

 100 134

Table 58 - Variation in CAET formulation; tensile strength over GBMS over time, tape

stored at TA.

 SATT

     |

 Cured: 1 h at 60 ° C + 24 h at RT

 Tape stored at TA

 MPa initial MPa

 formulation / weeks

 0 1 2 3 4

 50% Levamelt, 50% PhEtCA

 5.42 6.71 7.90 7.10 4.46

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 4.03 6.64 5.12 8.77 4.90

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 3.98 4.45 4.23 5.17 4.40

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 3.52 6.59 4.62 5.90 3.07

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 4.73 6.07 4.76 7.67 5.19

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 4.62 7.17 6.18 6.00 4.26

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 4.96 4.14 6.82 7.36 4.25

 Cured: 24 h at RT

 Tape stored at TA

 MPa initial MPa

 formulation / weeks

 0 1 2 3 4

 50% Levamelt, 50% PhEtCA

 1.45 0.66 1.13 2.91 0.62

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 1.96 1.10 1.18 3.16 0.69

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 0.87 0.61 0.82 1.13 0.87

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 1.38 0.63 0.96 0.76 0.97

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 2.00 1.08 1.42 2.48 0.93

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 0.61 1.06 1.31 1.99 0.80

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 0.10 0.53 0.52 1.63 0.40

 SATT

 Cured: 1 h at 60 ° C + 24 h at RT

 Tape stored at TA

 Initial MPa% of initial tensile strength

 formulation / week

 0 1 2 3 4

 50% Levamelt, 50% PhEtCA

 100 124 146 131 82

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 165 127 218 122

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 100 112 106 130 111

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 187 131 168 87

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 128 101 162 110

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 155 134 130 92

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 83 138 148 86

 Cured: 24 h at RT

 Tape stored at TA

 Initial MPa% of initial tensile strength

 formulation / week

 0 1 2 3 4

 50% Levamelt, 50% PhEtCA

 100 46 78 201 43

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 56 60 161 35

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 100 70 94 130 100

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 46 70 55 70

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 54 71 124 46

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 174 215 326 132

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 530 520 1630 403

5 Table 60 - Variation in the formulation used for the tape; Tensile strength over glass over time, tape

stored at 5 ° C.

 SATT

     |

 Cured: 24 h at RT

 Stored tape @ 5 ° C

 MPa initial MPa

 formulation / weeks

 0 1

 50% Levamelt, 50% PhEtCA

 3.18 2.67

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 1.24 1.08

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 2.00 4.09

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 3.65 2.64

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 2.57 2.66

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 3.88 1.68

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 3.11 3.18

 50% Levamelt, 50% PhEtCA + sun. quant points 1% by weight

 0.44

5

10

 SATT

 Cured: 24 h at RT

 Tape stored at 5 ° C

 Initial MPa% of initial tensile strength

 formulation / week

 0 1

 50% Levamelt, 50% PhEtCA

 100 84

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 87

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 100 205

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 72

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 104

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 43

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 102

Table 62 - Variation in the formulation used for the tape; Tensile strength over glass over time, tape

stored at TA.

 SATT

     |

 Cured: 24 h at RT

 Tape stored at TA

 MPa initial MPa

 formulation / weeks

 0 1

 50% Levamelt, 50% PhEtCA

 2.75 1.88

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 3.09 1.11

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 0.96 2.32

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 1.92 2.68

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 2.78 3.75

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 2.31 1.00

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 1.92 1.69

Table 63 - Variation in the formulation used for the belt, percentage of initial tensile strength over __________________________glass over time, tape stored at TA .___________________________

 SATT

     | |

 Cured: 24 h at RT

 Tape stored at TA

 Initial MPa% of initial tensile strength

 formulation / week

 0 1

 50% Levamelt, 50% PhEtCA

 100 68

 50% Levamelt, 50% PhEtCA + 0.5% by weight Cu (II) phthalocyanine

 100 36

 50% Levamelt, 50% PhEtCA + 0.5% m-Cresol violet by weight

 100 242

 50% Levamelt, 50% PhEtCA + 0.5% beta-carotene by weight

 100 140

 50% Levamelt, 50% PhEtCA + 0.5% coumarin by weight

 100 135

 50% Levamelt, 50% PhEtCA + 0.5% Naphthol green by weight

 100 43

 50% Levamelt, 50% PhEtCA + beta phenyl ethyl CA 1% by weight

 100 88

refractive index

Refraction levels were measured at 22 ° C-23 ° C in a Bellingham + Stanley 44-501 Abbe refractometer.

5 Table 64 - Variation in the formulation used for the tape; refractive index of some selected tapes.

 Formula used for the tape

 GO

 50% Levamelt, 50% PhEtCA

 1,498

 17% low Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 1,503

 17% high Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 1,517

 33% high Pm styrene-PhEtCA copolymer 17% Levamelt, 50% PhEtCA

 1,505

 50% Vinnol 40/50, 50% PhEtCA

 1,519

 50% Vinnol 40/55, 50% PhEtCA

 1,521

 50% Vinnol 40/60, 50% PhEtCA

 1,540

Curing conditions: performed in accordance with STM 700 with jaws for the indicated curing conditions.

10 Vinnol® surface coating resins represent a wide range of copolymers and terpolymers derived from vinyl chloride for use in different industrial applications. The main constituents of said polymers are different compositions of vinyl chloride and vinyl acetate. Vinyl chloride copolymers do not contain any other functional groups. The terpolymers of the Vinnol® product line of the present invention additionally contain carboxyl or hydroxyl groups.

fifteen

Table 65 - Variation in the formulation used for the tape; tensile strength over GBMS over time.

 Cured: 1h 60 ° C + 24 h at RT

 Tape stored at 5 ° C

 MPa initial MPa

 formulation / weeks

 0 1 2 3 4 5 6

 50% Levamelt, 50% PhEtCA

 7.32 6.9 7.71 9.49 6.5 10.92 10.11

 17% low Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 5.65 4.58 7.09 9.33 4.87 6.87 10.14

 17% high Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 8.1 4.32 7.9 9.43 6.71 8.15 9.84

 33% high Pm styrene-PhEtCA copolymer 17% Levamelt, 50% PhEtCA

 4.87 2.62 5.25 5.18 4.8 3.39 4.6

 50% Vinnol 40/50, 50% PhEtCA

 12.13 11.79 11.49 12.83

 50% Vinnol 40/55, 50% PhEtCA

 11.6 12.29 9.69 10.25

 50% Vinnol 40/60, 50% PhEtCA

 12.27 11.03 10.29 12.72

Table 66 - Variation in the formulation used for the belt, percentage of the initial tensile strength over _____________________________________GBMS over time. ______________________________

 Cured: 1h 60 ° C + 24 h at RT

 Tape stored at 5 ° C

 Initial MPa% of initial tensile strength

 formulation / weeks

 0 1 2 3 4 5 6

 50% Levamelt, 50% PhEtCA

 100 94 105 130 89 149 138

 17% low Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 100 81 125 165 86 122 179

 17% high Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 100 53 98 116 83 101 121

 33% high Pm styrene-PhEtCA copolymer 17% Levamelt, 50% PhEtCA

 100 54 108 106 99 70 94

 50% Vinnol 40/50, 50% PhEtCA

 100 97 95 106

 50% Vinnol 40/55, 50% PhEtCA

 100 106 84 88

 50% Vinnol 40/60, 50% PhEtCA

 100 90 84 104

 Cured: 24h at RT

 Tape stored at 5 ° C

 MPa initials | MPa

 formulation / weeks

 0 1 2 3 4 5 6

 50% Levamelt, 50% PhEtCA

 1.71 1.28 2.04 1.16 1.63 2.88 4.24

 17% low Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 2.96 1.54 1.62 0.65 2.44 3.09 4.58

 17% high Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 3.82 1.02 1.11 0.68 1.84 3.07 4.95

 33% high Pm styrene-PhEtCA copolymer 17% Levamelt, 50% PhEtCA

 2.17 0.71 0.7 1.15 1.18 0.76 0.86

 50% Vinnol 40/50, 50% PhEtCA

 6.48 3.96 1.11 0.56

 50% Vinnol 40/55, 50% PhEtCA

 6.86 3.61 1.62 0.97

 50% Vinnol 40/60, 50% PhEtCA

 8.16 3.96 2.41 0.4

Table 68 - Variation in the formulation used for the belt, percentage of the initial tensile strength over ____________________________________GBMS over time. ________________________________

 Cured: 24h at RT

 Tape stored at 5 ° C

 Initial MPa% of initial tensile strength

 formulation / weeks

 0 1 2 3 4 5 6

 50% Levamelt, 50% PhEtCA

 100 75 119 68 95 168 248

 17% low Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 100 52 55 22 82 104 155

 17% high Pm styrene-PhEtCA copolymer 33% Levamelt, 50% PhEtCA

 100 27 29 18 48 80 130

 33% high Pm styrene-PhEtCA copolymer 17% Levamelt, 50% PhEtCA

 100 33 32 53 54 35 40

 50% Vinnol 40/50, 50% PhEtCA

 100 61 17 9

 50% Vinnol 40/55, 50% PhEtCA

 100 53 24 14

 50% Vinnol 40/60, 50% PhEtCA

 100 49 30 5

5

The terms "comprising / understanding" and "presenting / including" in their use herein in reference to the present invention are used to specify the presence of the characteristics, integers, stages or components indicated but without excluding the presence or the addition of other or other features, integers, stages, components or groups thereof.

10

It will be appreciated that certain features of the invention, which for the sake of clarity are described in the context of separate embodiments, can also be provided in combination in a single embodiment. Conversely, various features of the invention that are described, for short, in the context of a single embodiment, can also be provided separately or in any suitable sub-combination.

fifteen

Claims (18)

10 2. fifteen twenty 3. Four. 25 5. 30 35 6. 40 7. 45 8. 9. fifty 55 10. Article, comprising a curable film on a release substrate and / or a carrier substrate, wherein the curable film comprises: (a) at least one cyanoacrylate monomer selected from among compounds of formula (I), image 1 wherein R1 is a divalent bonding group comprising 1 to 10 carbon atoms and A represents a C5-C50 aryl residue or a C2-C50 heteroaryl residue and (b) at least one (co) film-forming polymer. Article according to claim 1, wherein the cyanoacrylate monomer is selected from among compounds of formula (II), image2 where n is 0 to 5, R2 is a C1-5 alkylene group and each R3, if present, is independently selected from C1-C10 alkyl, C1-C10 alkoxy, fluorine, chlorine, bromine, cyano and nitro Article according to any of the preceding claims, wherein the cyanoacrylate monomer is 2-phenylethyl 2-cyanoacrylate. Article according to any of the preceding claims, wherein the cyanoacrylate monomer is present in an amount of at least about 15% by weight, based on the total weight of the curable film, preferably the cyanoacrylate monomer is present in an amount of between 20% and 80% by weight with respect to the total weight of the curable film. Article according to any one of the preceding claims, wherein the (co) film-forming polymer is selected from (co) poly (meth) acrylate polymers, polyvinyl ethers, natural rubbers, polyisoprenes, polybutadienes, polyisobutylenes, polychloroprenes, polymers of butadiene-acrylonitrile, thermoplastic elastomers, styrene-isoprene copolymers, styrene-isoprene-styrene block copolymers, ethylene-propylene-diene polymers, styrene-butadiene polymers, poly-alpha-olefins, silicones, ethylene copolymers vinyl acetate and / or combinations thereof. Article according to any one of claims 1 to 5, wherein the (co) film-forming polymer is a copolymer of ethylene and vinyl acetate, preferably the ethylene-vinyl acetate copolymer has a vinyl acetate content of between 50 % by weight and 98% by weight with respect to the total weight of the ethylene-vinyl acetate copolymer. Article according to any of the preceding claims, wherein the (co) film-forming polymer is present in an amount of between 20% by weight and 85% by weight with respect to the total weight of the curable film. Article according to any of the preceding claims, wherein the proportion by weight of the total amount of cyanoacrylate monomers to the total amount of film-forming (co) polymers in the curable film is between 1: 8 and 8: 1. Article according to any of the preceding claims, wherein the curable film further comprises a stabilizer, which is present in an amount of up to 1% by weight with respect to the total weight of the curable film, preferably the stabilizer is optionally one of hydroquinone , sulfonic acids, BF3 or SO2, boric acids, zinc salts, phosphoric acids, carboxylic acids or combinations thereof Article according to any of the preceding claims, wherein the curable film further comprises an acid, such as camphorsulfonic acid. 12. 5 13. 10 14. 15. 15 16. 17. twenty 18. 25 19. 30 20. 35 twenty-one. 40 22 Four. Five fifty 2. 3. Article according to any of the preceding claims, wherein the acid is present in an amount of up to 1% by weight with respect to the total weight of the curable film. Article according to any of the preceding claims, wherein the carrier substrate is selected from polymeric films, foams, metal sheets, fabrics and combinations thereof. Article according to any of the preceding claims, wherein the release substrate is a paper or plastic-based material, which is optionally coated with a release agent. Article according to any of the preceding claims, wherein the article is a label, a single-sided tape, a transfer tape or a double-sided tape. Article according to any of the preceding claims, wherein the curable product of the curable film is translucent, for example transparent. Curing product of the curable film as defined in any of claims 1 to 15. Article according to any one of claims 1 to 15, wherein the curable film is curable by exposure to optionally one of the following conditions: exposure to heat, moisture or irradiation. Article according to any one of claims 1 to 17, wherein the curable film is curable by exposure at temperatures in the range of about 0 ° C to 200 ° C for 2 to 360 seconds. Article according to any one of claims 1 to 17, wherein the curable film is curable by exposure to moisture in the range of about 10% to 100% for 1 to 24 hours. Method of joining a film to a curable surface, comprising the steps of: (a) providing an article according to any one of claims 1 to 15, (b) bond the curable film of the article to at least one surface to form an assembly, (c) expose the assembly to sufficient conditions to cure the curable film of the article, wherein the article release substrate, if present, is removed before and / or after step (b). Use of an article according to any one of claims 1 to 15 in the preparation of optoelectronic devices. Method of adhesion of a first substrate to a second substrate, said method comprising: (i) providing an article according to any one of claims 1 to 15, (ii) bond the curable film of the article to at least one of the substrates, (iii) couple the substrates, and (iv) cure the adhesive film between the components that must adhere to each other, in which the article release substrate, if present, is removed before and / or after step (ii). Method according to claim 22, wherein at least one of the substrates comprises a flexible material, preferably the flexible material is at least one of textiles, fabrics, clothing, laminated materials, plastics and combinations thereof.