ES262457A1 - Una disposiciën de montaje para un dispositivo de semiconductor - Google Patents
Una disposiciën de montaje para un dispositivo de semiconductorInfo
- Publication number
- ES262457A1 ES262457A1 ES0262457A ES262457A ES262457A1 ES 262457 A1 ES262457 A1 ES 262457A1 ES 0262457 A ES0262457 A ES 0262457A ES 262457 A ES262457 A ES 262457A ES 262457 A1 ES262457 A1 ES 262457A1
- Authority
- ES
- Spain
- Prior art keywords
- semi
- cooling
- improvements relating
- conductor devices
- insured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000001816 cooling Methods 0.000 title 1
- 239000002775 capsule Substances 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
- Synchronous Machinery (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB42779/59A GB904554A (en) | 1959-12-16 | 1959-12-16 | Improvements relating to the cooling of semi-conductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES262457A1 true ES262457A1 (es) | 1961-01-16 |
Family
ID=10425939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES0262457A Expired ES262457A1 (es) | 1959-12-16 | 1960-11-14 | Una disposiciën de montaje para un dispositivo de semiconductor |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE598058A (en, 2012) |
| ES (1) | ES262457A1 (en, 2012) |
| FR (1) | FR1280821A (en, 2012) |
| GB (1) | GB904554A (en, 2012) |
| NL (1) | NL258629A (en, 2012) |
-
0
- NL NL258629D patent/NL258629A/xx unknown
-
1959
- 1959-12-16 GB GB42779/59A patent/GB904554A/en not_active Expired
-
1960
- 1960-11-14 ES ES0262457A patent/ES262457A1/es not_active Expired
- 1960-12-12 BE BE598058A patent/BE598058A/fr unknown
- 1960-12-12 FR FR846625A patent/FR1280821A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1280821A (fr) | 1962-01-08 |
| BE598058A (fr) | 1961-03-31 |
| NL258629A (en, 2012) | |
| GB904554A (en) | 1962-08-29 |
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