ES262457A1 - Una disposiciën de montaje para un dispositivo de semiconductor - Google Patents

Una disposiciën de montaje para un dispositivo de semiconductor

Info

Publication number
ES262457A1
ES262457A1 ES0262457A ES262457A ES262457A1 ES 262457 A1 ES262457 A1 ES 262457A1 ES 0262457 A ES0262457 A ES 0262457A ES 262457 A ES262457 A ES 262457A ES 262457 A1 ES262457 A1 ES 262457A1
Authority
ES
Spain
Prior art keywords
semiconductor device
mounting arrangement
insured
rectifier
capsule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0262457A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stone J and Co Ltd
Original Assignee
Stone J and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stone J and Co Ltd filed Critical Stone J and Co Ltd
Publication of ES262457A1 publication Critical patent/ES262457A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031Packaged discrete devices, e.g. to-3 housings, diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)
ES0262457A 1959-12-16 1960-11-14 Una disposiciën de montaje para un dispositivo de semiconductor Expired ES262457A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB42779/59A GB904554A (en) 1959-12-16 1959-12-16 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
ES262457A1 true ES262457A1 (es) 1961-01-16

Family

ID=10425939

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0262457A Expired ES262457A1 (es) 1959-12-16 1960-11-14 Una disposiciën de montaje para un dispositivo de semiconductor

Country Status (5)

Country Link
BE (1) BE598058A (cs)
ES (1) ES262457A1 (cs)
FR (1) FR1280821A (cs)
GB (1) GB904554A (cs)
NL (1) NL258629A (cs)

Also Published As

Publication number Publication date
BE598058A (fr) 1961-03-31
NL258629A (cs)
GB904554A (en) 1962-08-29
FR1280821A (fr) 1962-01-08

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