ES2555683T3 - Infraestructura de sensor con electrónica integrada - Google Patents

Infraestructura de sensor con electrónica integrada Download PDF

Info

Publication number
ES2555683T3
ES2555683T3 ES05724643.1T ES05724643T ES2555683T3 ES 2555683 T3 ES2555683 T3 ES 2555683T3 ES 05724643 T ES05724643 T ES 05724643T ES 2555683 T3 ES2555683 T3 ES 2555683T3
Authority
ES
Spain
Prior art keywords
sensor
actuator
excitation
package
damage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES05724643.1T
Other languages
English (en)
Inventor
Seth S. Kessler
Kristin A. Jugenheimer
Aaron B. Size
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metis Design Corp
Original Assignee
Metis Design Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metis Design Corp filed Critical Metis Design Corp
Application granted granted Critical
Publication of ES2555683T3 publication Critical patent/ES2555683T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0033—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining damage, crack or wear
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0075—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by means of external apparatus, e.g. test benches or portable test systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2475—Embedded probes, i.e. probes incorporated in objects to be inspected
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2481—Wireless probes, e.g. with transponders or radio links
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02827—Elastic parameters, strength or force
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02845—Humidity, wetness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0422—Shear waves, transverse waves, horizontally polarised waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0427—Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2694—Wings or other aircraft parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

Un dispositivo (5) para su utilización en la detección de un evento en una estructura, comprendiendo el dispositivo: un encapsulado de sensor (10), comprendiendo el encapsulado: un sensor (50); un accionador (51) situado sustancialmente en el mismo plano que el sensor (50) en el interior del encapsulado de sensor (10), estando configurado el accionador (51) para excitar formas de onda en la estructura sensibles a una excitación, y estando configurado el sensor (50) para recibir ondas reflejadas propagadas por la estructura en respuesta a las formas de onda; y una placa de circuito impreso (22) en comunicación, por lo menos, con uno del sensor (50) y el accionador (51), comprendiendo la placa de circuito impreso (22): un microprocesador construido y dispuesto para recoger datos, por lo menos, desde uno del sensor (50) y el accionador (51); un generador de señal construido y dispuesto para proporcionar la excitación, por lo menos, a uno de sensor (50) y el accionador (51); y un amplificador para modificar la excitación.

Description

imagen1
imagen2
imagen3
imagen4
imagen5
imagen6
5
10
15
20
25
30
35
40
45
accionador de cada nodo 5 excita las estructuras que están siendo monitorizadas o probadas, y los sensores de uno
o varios nodos del dispositivo 5 diferentes miden la respuesta transmitida para determinar la situación de la estructura. El dispositivo 5 en el que se produce el accionamiento se denomina el nodo maestro. Cuando se utiliza el método de emisión-recepción, la designación de nodo maestro rota de manera iterativa a través de cada uno de los diversos nodos 5, de tal modo que se pueden recoger combinaciones de funciones de transferencia. El método preferido es utilizar simultáneamente los métodos tanto de impulso-eco como de emisión-recepción. Este caso es similar al método de solamente emisión-recepción descrito anteriormente, si bien en este caso los datos reflejados desde el sensor del nodo maestro son recogidos asimismo para ser fusionados con la totalidad de los otros datos.
Las pruebas de monitorización estructural se facilitan con la electrónica de la PCB 22. El microprocesador inicia la prueba activando el generador de funciones arbitrarias para excitar el accionador en el nodo 5 e iniciando la recogida de datos mediante el registrador de datos en la PCB 22. Las pruebas pueden ser iniciadas remotamente por un usuario, estar preprogramadas para ser ejecutadas a ciertos intervalos, o ser desencadenadas por métodos pasivos. Los datos digitales de la memoria tampón son recogidos por un procesador central mediante un enlace de datos cableado o inalámbrico. Los datos son procesados por el procesador central. El microprocesador en la PCB 22 puede proporcionar procesamiento para evaluar daños localmente.
Una vez que se han recogido datos de tensión mediante uno de los métodos descritos anteriormente, existen varias maneras de descomponer estos datos con el fin de determinar el estado de la estructura. En primer lugar, los datos se pueden filtrar y se puede eliminar el ruido utilizando filtros de paso banda para eliminar ruido eléctrico de alta frecuencia y vibraciones de deriva y mecánicas de baja frecuencia. Se pueden utilizar algoritmos que comparan los niveles de energía integrados, recibidos en los sensores, para determinar si hay daños presentes; la energía reflejada aumentada y la energía transmitida reducida son ambas métricas de daños. Esto sigue con una evaluación del tiempo de vuelo de la reflexión, para determinar la posición del daño multiplicando estos resultados por la velocidad de la onda. Se puede realizar una transformada de Fourier rápida para inspeccionar el ancho de banda de la frecuencia resultante, lo que se utiliza para determinar el tipo de daño presente en la estructura. Utilizando la física de tres sensores independientes para evaluar el daño, por ejemplo, se puede minimizar la incidencia de falsos positivos.
En un sistema de dispositivos de detección de daños incorporado en una estructura, la activación del dispositivo de detección 5 se produce en un nodo maestro. La detección se produce en todos los demás nodos. Con la utilización de un único nodo maestro se puede estimar la distancia al daño, y se puede estimar asimismo el ángulo desde el nodo maestro en el que se ha detectado el daño. El procedimiento de detección de daños se puede ejecutar iterativamente haciendo que cada nodo sea el nodo maestro. Con la utilización de múltiples nodos, se puede triangular el daño.
La invención proporciona una infraestructura para un sensor o accionador que funciona utilizando una fuente de alimentación compatible, tal como un piezoeléctrico, una lámina resistiva, MEMS o corrientes parasitarias, por ejemplo. La infraestructura descrita en esta memoria proporciona una infraestructura de "caja negra" que permite que los datos y la alimentación fluyan entrando y saliendo de una red distribuida de sensores dispuestos en cadena margarita, reduciendo el cableado, el tiempo de instalación y el coste. La infraestructura se puede fabricar en masa a bajo coste, y personalizar para aplicaciones en software. El dispositivo puede ser utilizado para llevar a cabo métodos de detección de daños tales como ondas de Lamb, respuesta de frecuencia, emisión acústica y monitorización de la deformación/tensión para cualquier material o estructura conocidos.
Los expertos en la materia reconocerán, o serán capaces de determinar utilizando tan sólo la experimentación rutinaria, numerosos equivalentes a los procedimientos específicos descritos en la presente memoria. Se considera que dichos equivalentes están dentro del alcance de la invención. Se pueden realizar diversas sustituciones, alteraciones y modificaciones a la invención sin apartarse del espíritu y el alcance de la invención. Otros aspectos, ventajas y modificaciones están dentro del alcance de la invención. Los contenidos de todas las referencias, patentes concedidas y solicitudes de patentes publicadas, citadas a lo largo de esta descripción se incorporan a la misma como referencia. Los componentes, procesos y métodos apropiados de estas patentes, solicitudes y otros documentos pueden ser seleccionados para la invención y sus realizaciones.
8

Claims (1)

  1. imagen1
ES05724643.1T 2004-10-07 2005-03-03 Infraestructura de sensor con electrónica integrada Active ES2555683T3 (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US61670504P 2004-10-07 2004-10-07
US61674804P 2004-10-07 2004-10-07
US616705P 2004-10-07
US616748P 2004-10-07
PCT/US2005/007137 WO2006041513A1 (en) 2004-10-07 2005-03-03 Sensor infrastructure

Publications (1)

Publication Number Publication Date
ES2555683T3 true ES2555683T3 (es) 2016-01-07

Family

ID=36148641

Family Applications (1)

Application Number Title Priority Date Filing Date
ES05724643.1T Active ES2555683T3 (es) 2004-10-07 2005-03-03 Infraestructura de sensor con electrónica integrada

Country Status (4)

Country Link
US (3) US7373260B2 (es)
EP (1) EP1802938B1 (es)
ES (1) ES2555683T3 (es)
WO (1) WO2006041513A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023198355A1 (de) 2022-04-14 2023-10-19 Tdk Electronics Ag Sensorstruktur

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7373260B2 (en) * 2004-03-03 2008-05-13 Metis Design Corporation Sensor infrastructure
US7668667B2 (en) * 2005-03-07 2010-02-23 Microstrain, Inc. Miniature stimulating and sensing system
US7412899B2 (en) * 2005-09-16 2008-08-19 International Electronic Machines Corporation MEMS-based monitoring
US20070095160A1 (en) * 2005-11-03 2007-05-03 The Boeing Company Structural assessment and monitoring system and associated method
CA2634770C (en) * 2005-12-23 2017-06-20 Asf-Keystone, Inc. Railroad train monitoring system
US7380461B2 (en) * 2006-03-09 2008-06-03 Suryakala Majeti Micro-electromechanical capacitive strain sensor
US7698962B2 (en) * 2006-04-28 2010-04-20 Amsted Rail Company, Inc. Flexible sensor interface for a railcar truck
US7571058B2 (en) * 2006-05-09 2009-08-04 Lockheed Martin Corporation System to monitor the health of a structure, program product and related methods
US7333898B2 (en) * 2006-06-05 2008-02-19 The Boeing Company Passive structural assessment and monitoring system and associated method
GB0614852D0 (en) * 2006-07-26 2006-09-06 Sperry Rail International Ltd Applications of ultrasonic probes
JP4952164B2 (ja) * 2006-09-20 2012-06-13 株式会社デンソー 流量計測素子、質量流量計
US7809513B2 (en) * 2007-04-16 2010-10-05 Acellent Technologies, Inc. Environmental change compensation in a structural health monitoring system
US7743659B2 (en) 2007-05-25 2010-06-29 The Boeing Company Structural health monitoring (SHM) transducer assembly and system
DE102008005672B9 (de) * 2008-01-23 2015-02-19 Airbus Defence and Space GmbH Vorrichtung und Verfahren zum Erfassen von Strukturveränderungen eines Bauteils
US8643488B2 (en) * 2008-01-30 2014-02-04 The Boeing Company Physical finite element model
US8700924B2 (en) 2008-05-21 2014-04-15 International Electronic Machines Corp. Modular sensor node and communications system
FI20095340A0 (fi) * 2009-03-30 2009-03-30 Valtion Teknillinen Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi
CA2708020C (en) 2009-06-24 2016-05-10 Research In Motion Limited Piezoelectric assembly
US9107325B1 (en) 2009-08-10 2015-08-11 The Boeing Company Systems and methods of coupling sensors to a structure
EP2306538B1 (en) * 2009-10-01 2013-11-20 BlackBerry Limited Piezoelectric assembly
US8629843B2 (en) 2009-10-01 2014-01-14 Blackberry Limited Piezoelectric assembly
US8286492B2 (en) * 2009-12-09 2012-10-16 The Boeing Company Mode decomposition of sound waves using amplitude matching
US9078610B2 (en) * 2010-02-22 2015-07-14 Covidien Lp Motion energy harvesting with wireless sensors
US8355830B2 (en) * 2010-03-30 2013-01-15 Aurora Flight Sciences Corporation Aircraft health monitoring and design for condition
CN102918354B (zh) * 2010-04-02 2015-12-02 Skf公司 多双头螺栓张紧机及用于自动控制多个双头螺栓伸长的方法
DE102010025474A1 (de) * 2010-06-29 2011-12-29 Airbus Operations Gmbh Messvorrichtung für die Messung von Kräften in Strukturbauteilen
CA2820585C (en) * 2010-11-05 2017-05-30 Brian Moore Wireless sensor device
TWI431445B (zh) * 2010-12-22 2014-03-21 Ind Tech Res Inst 控制系統與其初始化方法
US20120188078A1 (en) 2011-01-21 2012-07-26 Soles Alexander M Damage detection and remediation system and methods thereof
EP2489442A1 (en) 2011-02-18 2012-08-22 Aernnova Engineering Solutions Iberica Integrated phased array transducer, system and methodology for structural health monitoring of aerospace structures
ITRM20110151A1 (it) * 2011-03-28 2012-09-29 Giovanni Gregori Metodo per la caratterizzazione quantitativa dinamica dell invecchiamento di un materiale solido.
US10607424B2 (en) * 2012-02-10 2020-03-31 Appareo Systems, Llc Frequency-adaptable structural health and usage monitoring system (HUMS) and method with smart sensors
US9389138B2 (en) 2012-10-26 2016-07-12 General Electric Company Apparatus and method to detect damage of a component of a system
US9484521B2 (en) * 2013-04-10 2016-11-01 Mplus Co., Ltd. Vibration generating apparatus
EP3100010A4 (en) * 2014-01-28 2017-01-25 Shottrack Pty Ltd A device for monitoring vibrations
WO2017045022A1 (en) * 2015-09-17 2017-03-23 Mindspark Technologies Pty Ltd Sensing device, systems and methods for monitoring movement of ground and other structures
EP3159260B1 (en) 2015-10-23 2019-11-27 Safran Landing Systems UK Limited Aircraft landing gear assembly including a health and usage monitoring system (hums) and method
US10571415B2 (en) 2016-08-02 2020-02-25 Rolls-Royce Corporation Methods and apparatuses for evaluating ceramic matrix composite components
US10866149B1 (en) 2017-03-22 2020-12-15 University Of Maryland, College Park System and method for nondestructive detection of structural irregularities using a directional magnetostrictive phased array sensor with a comb-shaped magnetostrictive patch
US10168235B1 (en) * 2017-06-29 2019-01-01 Southern Taiwan University Of Science And Technology Stretchable piezoelectric sensor applied to logistics for real-time monitoring
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
CA3089133A1 (en) 2018-01-24 2019-08-29 Amsted Rail Company, Inc. Discharge gate sensing method, system and assembly
MX2021000372A (es) 2018-07-12 2021-05-27 Amsted Rail Co Inc Sistema de monitoreo de frenos para vagones.
DE102018221016A1 (de) * 2018-12-05 2020-06-10 Robert Bosch Gmbh Verfahren zur Prüfung eines Faserverbundbauteils, Vorrichtung, Computerprogramm und maschinenlesbares Speichermedium
US10979336B2 (en) 2019-03-25 2021-04-13 Olympus Scientific Solutions Americas Inc. Method and apparatus for communication of data between NDT/NDI instrument and an external network
DE102019204464A1 (de) 2019-03-29 2020-10-01 Airbus Operations Gmbh Rauch- und brandherddetektionssystem, brandschutzsystem für flugzeuge und verfahren zur detektion von rauch und brandherden
US11619353B2 (en) 2021-04-06 2023-04-04 Hexagon Technology As Composite cylinder monitoring system
US20220316967A1 (en) 2021-04-06 2022-10-06 Hexagon Technology As Multi-element sensor for monitoring composite structure

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2247246A (en) * 1938-12-03 1941-06-24 American District Telegraph Co Micro-wave radio alarm system
US3568198A (en) * 1963-05-31 1971-03-02 Us Army Correlation curvature radar
US3555498A (en) * 1963-11-12 1971-01-12 Us Navy Sonar processor and display circuits
US3453626A (en) * 1967-12-21 1969-07-01 Sylvania Electric Prod Acoustic goniometer
US3821740A (en) * 1972-07-03 1974-06-28 Raytheon Co Super directive system
US3986182A (en) * 1974-03-27 1976-10-12 Sontrix, Inc. Multi-zone intrusion detection system
US3963677A (en) 1974-11-21 1976-06-15 Enger Carl C Impermeable silicone composition
US4242743A (en) * 1978-11-09 1980-12-30 General Electric Company Intrusion detection method and apparatus
GB8527277D0 (en) * 1985-11-06 1985-12-11 Formula Systems Ltd Proximity detector
DE3864249D1 (de) 1987-12-19 1991-09-19 Thyssen Industrie Vorrichtung zur ueberwachung eines einem verschleiss unterworfenen bauteils.
US5195046A (en) 1989-01-10 1993-03-16 Gerardi Joseph J Method and apparatus for structural integrity monitoring
US4958100A (en) 1989-02-22 1990-09-18 Massachusetts Institute Of Technology Actuated truss system
US5064165A (en) 1989-04-07 1991-11-12 Ic Sensors, Inc. Semiconductor transducer or actuator utilizing corrugated supports
US5105918A (en) 1989-10-23 1992-04-21 Nippondenso Co., Ltd. Detection of damping force for shock absorber control
JPH0781995B2 (ja) * 1989-10-25 1995-09-06 三菱電機株式会社 超音波探触子および超音波探傷装置
US5111210A (en) * 1990-06-22 1992-05-05 Survival Safety Engineering, Inc. Collision avoidance radar detector system
US5305507A (en) * 1990-10-29 1994-04-26 Trw Inc. Method for encapsulating a ceramic device for embedding in composite structures
US5739626A (en) 1991-04-27 1998-04-14 Ngk Spark Plug Co., Ltd. Piezoelectric sensor
US5184516A (en) * 1991-07-31 1993-02-09 Hughes Aircraft Company Conformal circuit for structural health monitoring and assessment
US5774376A (en) 1995-08-07 1998-06-30 Manning; Raymund A. Structural health monitoring using active members and neural networks
US5528557A (en) * 1995-08-07 1996-06-18 Northrop Grumman Corporation Acoustic emission source location by reverse ray tracing
US6475639B2 (en) 1996-01-18 2002-11-05 Mohsen Shahinpoor Ionic polymer sensors and actuators
US6006163A (en) 1997-09-15 1999-12-21 Mcdonnell Douglas Corporation Active damage interrogation method for structural health monitoring
US6370964B1 (en) * 1998-11-23 2002-04-16 The Board Of Trustees Of The Leland Stanford Junior University Diagnostic layer and methods for detecting structural integrity of composite and metallic materials
US6177903B1 (en) * 1999-06-14 2001-01-23 Time Domain Corporation System and method for intrusion detection using a time domain radar array
US6617764B2 (en) 2000-09-13 2003-09-09 University Of Dayton High temperature piezoelectric sensor
US7277822B2 (en) * 2000-09-28 2007-10-02 Blemel Kenneth G Embedded system for diagnostics and prognostics of conduits
WO2002062206A2 (en) 2001-02-08 2002-08-15 University Of South Carolina In-situ structural health monitoring, diagnostics and prognostics system utilizing thin piezoelectric sensors
US6768312B2 (en) 2001-06-06 2004-07-27 United Technologies Corporation Structural integrity monitoring system including wireless electromechanical impedance measurement
WO2003055063A1 (en) 2001-12-06 2003-07-03 University Of Pittsburgh Tunable piezoelectric micro-mechanical resonator
US6865515B2 (en) * 2002-01-24 2005-03-08 Engius, L.L.C. Method and device for securely storing data
US6850788B2 (en) 2002-03-25 2005-02-01 Masimo Corporation Physiological measurement communications adapter
US6802216B2 (en) * 2002-04-16 2004-10-12 Mide Technology Method and sheet like sensor for measuring stress distribution
US6930596B2 (en) * 2002-07-19 2005-08-16 Ut-Battelle System for detection of hazardous events
TWI261045B (en) * 2002-12-30 2006-09-01 Ind Tech Res Inst Composite nanofibers and their fabrications
US20040151071A1 (en) 2003-02-04 2004-08-05 Kocher Robert William Wrist-mounted electronic computer component (WECC)
US6964201B2 (en) 2003-02-25 2005-11-15 Palo Alto Research Center Incorporated Large dimension, flexible piezoelectric ceramic tapes
US7104139B2 (en) * 2003-06-10 2006-09-12 University Of Massachusetts System and method for load sensing using piezoelectric effect
US6931173B1 (en) * 2003-08-14 2005-08-16 Alliance Fiber Optic Products, Inc. MEMS optical switches with guaranteed switching status
US7325456B2 (en) 2003-09-22 2008-02-05 Hyeung-Yun Kim Interrogation network patches for active monitoring of structural health conditions
KR100623634B1 (ko) * 2003-09-22 2006-09-13 김형윤 구조물의 건전상태 감시방법
WO2005048317A2 (en) 2003-11-12 2005-05-26 University Of South Carolina Self-processing integrated damage assessment sensor for structural health monitoring
US20050190072A1 (en) * 2004-02-26 2005-09-01 Brown Katherine A. Item monitoring system and methods of using an item monitoring system
US7373260B2 (en) * 2004-03-03 2008-05-13 Metis Design Corporation Sensor infrastructure
WO2005084358A2 (en) * 2004-03-03 2005-09-15 Metis Design Corporation Damage detection device
US8984500B2 (en) * 2004-06-14 2015-03-17 Hewlett-Packard Development Company, L.P. Programming a computing node connected to a sensor and an actuator
US7075424B1 (en) * 2004-07-08 2006-07-11 North Carolina A&T State University System for damage location using a single channel continuous acoustic emission sensor
US7458266B2 (en) * 2004-09-27 2008-12-02 Samsung Electronics Co. Ltd. Method and apparatus for detecting a load change upon a structure and analyzing characteristics of resulting damage
US7103507B2 (en) * 2004-09-28 2006-09-05 Dimitry Gorinevsky Structure health monitoring system and method
US20070159338A1 (en) * 2005-12-22 2007-07-12 Axcess International Inc. Hybrid Radio Frequency Identification (RFID) Tag System
US7533578B2 (en) * 2006-04-18 2009-05-19 Metis Design Corporation Triangulation with co-located sensors
US7571058B2 (en) * 2006-05-09 2009-08-04 Lockheed Martin Corporation System to monitor the health of a structure, program product and related methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023198355A1 (de) 2022-04-14 2023-10-19 Tdk Electronics Ag Sensorstruktur

Also Published As

Publication number Publication date
US7725269B2 (en) 2010-05-25
US20080312846A1 (en) 2008-12-18
WO2006041513A1 (en) 2006-04-20
US7373260B2 (en) 2008-05-13
EP1802938B1 (en) 2015-09-09
EP1802938A1 (en) 2007-07-04
US20060080048A1 (en) 2006-04-13
US7627439B1 (en) 2009-12-01
EP1802938A4 (en) 2011-06-15

Similar Documents

Publication Publication Date Title
ES2555683T3 (es) Infraestructura de sensor con electrónica integrada
US7533578B2 (en) Triangulation with co-located sensors
CN104819765B (zh) 用于探测至少一个结构声音信号的设备和方法
JP6567268B2 (ja) 信号処理装置、サーバ装置、検知システム及び信号処理方法
US5528557A (en) Acoustic emission source location by reverse ray tracing
US9750451B2 (en) Active acoustic pressure mapping system
US8306779B2 (en) Detectable defect size and probability-of-detection
ES2773545T3 (es) Control de estructura industrial
US20230132220A1 (en) Dual acoustic pressure and hydrophone sensor array system
JPWO2003002956A1 (ja) 振動計測装置および振動計測方法
HRP20221523T1 (hr) Sustavi i postupci za otkrivanje oštećenja
JP2008535055A5 (es)
KR20110066353A (ko) 크랙 감지 시스템 및 크랙 감지 방법
US10401316B2 (en) Acoustic event monitoring for triggering of health scan of a structure
US8249811B2 (en) Multi-sensor detectors
RU2015149258A (ru) Устройство и способ для обнаружения и анализа отложений
JP2011516897A (ja) 後方散乱波を使用した異常の画像化
Abdullahi et al. Accelerometer Based Structural Health Monitoring System on the Go: Developing Monitoring Systems with NI LabVIEW.
CN111693602B (zh) 声检查装置和操作方法
KR102043158B1 (ko) 배관 모니터링 장치 및 방법
JP2005519268A (ja) 異物の衝撃により宇宙船に生じる損傷の検出方法
CN110789731A (zh) 一种基于Lamb波的直升机尾桁结构健康监测系统及方法
JP7341018B2 (ja) 感震システム
JP7240290B2 (ja) 情報処理システム、情報処理装置、および、プログラム
Keller Jr Comparison of resistance-based strain gauges and fiber bragg gratings in the presence of electromagnetic interference emitted from an electric motor