ES2548427T3 - Dispositivo electrónico sellado herméticamente que usa escamas de vidrio revestido - Google Patents
Dispositivo electrónico sellado herméticamente que usa escamas de vidrio revestido Download PDFInfo
- Publication number
- ES2548427T3 ES2548427T3 ES11810432.2T ES11810432T ES2548427T3 ES 2548427 T3 ES2548427 T3 ES 2548427T3 ES 11810432 T ES11810432 T ES 11810432T ES 2548427 T3 ES2548427 T3 ES 2548427T3
- Authority
- ES
- Spain
- Prior art keywords
- glass flakes
- electronic device
- hermetically sealed
- coated glass
- sealed electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011521 glass Substances 0.000 title abstract 5
- 239000011368 organic material Substances 0.000 abstract 5
- 230000004888 barrier function Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Sealing Material Composition (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Un método de formación de una barrera, que comprende: a. el suministro de un material orgánico curable cargado de escamas de vidrio que comprende (i) al menos un material orgánico curable, (ii) el 5-95 % en volumen de escamas de vidrio basado en el volumen de material orgánico, b. la aplicación del material orgánico curable cargado con escamas de vidrio a al menos un primer sustrato, y c. el curado del material orgánico curable para formar una barrera, en el que las escamas de vidrio tienen una relación de aspecto de 2-100 y una longitud de 0,1-2000 μm (micras).
Description
Claims (1)
-
imagen1 imagen2
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36656810P | 2010-07-22 | 2010-07-22 | |
US366568P | 2010-07-22 | ||
PCT/US2011/044920 WO2012012675A1 (en) | 2010-07-22 | 2011-07-22 | Hermetically sealed electronic device using coated glass flakes |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2548427T3 true ES2548427T3 (es) | 2015-10-16 |
Family
ID=45497185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES11810432.2T Active ES2548427T3 (es) | 2010-07-22 | 2011-07-22 | Dispositivo electrónico sellado herméticamente que usa escamas de vidrio revestido |
Country Status (6)
Country | Link |
---|---|
US (1) | US9272497B2 (es) |
EP (1) | EP2595802B1 (es) |
CN (1) | CN103025516B (es) |
DK (1) | DK2595802T3 (es) |
ES (1) | ES2548427T3 (es) |
WO (1) | WO2012012675A1 (es) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
WO2009151515A1 (en) | 2008-05-06 | 2009-12-17 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
JP2013508895A (ja) | 2009-10-17 | 2013-03-07 | キユーデイー・ビジヨン・インコーポレーテツド | 光学部品、これを含む製品およびこれを作製する方法 |
WO2012012745A2 (en) | 2010-07-22 | 2012-01-26 | Ferro Corporation | Hermetically sealed electronic device using solder bonding |
CN103842312A (zh) | 2011-09-13 | 2014-06-04 | 费罗公司 | 无机基体的感应密封 |
CN102685423B (zh) * | 2012-05-17 | 2015-03-11 | 叶钧 | 平板电视保护屏 |
GB2509480A (en) * | 2012-07-06 | 2014-07-09 | Qioptiq Ltd | Radiation stable shield |
US9499428B2 (en) | 2012-07-20 | 2016-11-22 | Ferro Corporation | Formation of glass-based seals using focused infrared radiation |
WO2014027955A1 (en) * | 2012-08-16 | 2014-02-20 | Unisteel Technology International Limited | A novel method of making a novel lcp nanocomposite |
US9404015B2 (en) * | 2013-01-15 | 2016-08-02 | Nd Industries, Inc. | Multifunctional coatings for fasteners |
US9637409B2 (en) | 2013-04-18 | 2017-05-02 | Ferro Corporation | Low melting glass compositions |
US20140352575A1 (en) * | 2013-06-03 | 2014-12-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | UV Curing Glue for Glass Substrate and Method for Making the Same |
CN103289594A (zh) * | 2013-06-03 | 2013-09-11 | 深圳市华星光电技术有限公司 | 一种玻璃基板封装用uv胶及其制备方法 |
US9671362B2 (en) | 2013-07-29 | 2017-06-06 | Honeywell International Inc. | ph sensor with bonding agent disposed in a pattern |
US9664641B2 (en) | 2013-07-29 | 2017-05-30 | Honeywell International Inc. | pH sensor with substrate or bonding layer configured to maintain piezoresistance of the ISFET die |
EP3033552B1 (en) | 2013-08-16 | 2023-05-31 | Samsung Electronics Co., Ltd. | Methods for making optical components and products including same |
US9257585B2 (en) | 2013-08-21 | 2016-02-09 | Siva Power, Inc. | Methods of hermetically sealing photovoltaic modules using powder consisting essentially of glass |
DE112014004866B4 (de) * | 2013-10-24 | 2023-09-21 | Panasonic Intellectual Property Management Co., Ltd. | Verfahren zur Herstellung von Solarzellenmodulen |
WO2015077372A1 (en) | 2013-11-19 | 2015-05-28 | Qd Vision, Inc. | Luminescent particle, materials and products including same, and methods |
GB2522626A (en) * | 2014-01-29 | 2015-08-05 | Nokia Technologies Oy | Apparatus and method for providing barrier coating |
US9759679B2 (en) | 2014-02-07 | 2017-09-12 | Honeywell International Inc. | Fluid sensor with backside of sensor die contacting header |
CN103928548B (zh) * | 2014-04-28 | 2017-07-21 | 杭州勇电照明有限公司 | 太阳能电池模块及成型方法 |
US10454062B2 (en) * | 2014-07-29 | 2019-10-22 | Boe Technology Group Co., Ltd. | Functional material, its preparation method, and organic light emitting diode display panel |
CN104760762B (zh) * | 2015-01-29 | 2019-08-16 | 昆山龙腾光电有限公司 | 玻璃片材包装结构和玻璃片材包装方法 |
US9978896B2 (en) * | 2015-09-15 | 2018-05-22 | Sunpower Corporation | Encapsulant bonding methods for photovoltaic module manufacturing |
US10429892B1 (en) * | 2016-01-12 | 2019-10-01 | Apple Inc. | Electronic devices with thin display housings |
JPWO2018159564A1 (ja) * | 2017-02-28 | 2019-12-19 | 味の素株式会社 | 樹脂組成物 |
CN108735913A (zh) * | 2017-04-25 | 2018-11-02 | 群创光电股份有限公司 | 显示设备 |
KR102420438B1 (ko) * | 2018-01-08 | 2022-07-14 | 삼성디스플레이 주식회사 | 표시 장치 및 휴대용 단말기 |
CN108647439B (zh) * | 2018-05-11 | 2023-04-28 | 哈尔滨理工大学 | 一种空心带指数形过渡段的复合型超声变幅杆的设计方法 |
CN108963095B (zh) * | 2018-07-23 | 2021-06-01 | 北京蜃景光电科技有限公司 | 一种oled器件封装方法、oled封装器件以及显示装置 |
US20200119303A1 (en) * | 2018-10-11 | 2020-04-16 | Google Llc | Multilayer display with integrated edge covering |
TWM579382U (zh) * | 2019-02-19 | 2019-06-11 | 位元奈米科技股份有限公司 | Solar cell hermetic structure |
CN114258422A (zh) * | 2019-07-02 | 2022-03-29 | 哥兹有限公司 | 在活性层和导电层之间具有改进的附着力的悬浮粒子装置 |
CN113736346B (zh) * | 2021-11-08 | 2022-02-15 | 山东江山纤维科技有限公司 | 一种环氧树脂基涂层材料及其制备方法与应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4334354A (en) * | 1977-07-12 | 1982-06-15 | Trw Inc. | Method of fabricating a solar array |
US4636578A (en) | 1985-04-11 | 1987-01-13 | Atlantic Richfield Company | Photocell assembly |
GB8709608D0 (en) | 1987-04-23 | 1987-05-28 | Corrocoat Ltd | Forming glass flakes |
JP2985286B2 (ja) * | 1990-11-26 | 1999-11-29 | 日本板硝子株式会社 | 緻密保護被覆層を有するフレーク状ガラス及びその製造方法並びに該フレーク状ガラスを含有する塗料 |
US5958590A (en) * | 1995-03-31 | 1999-09-28 | International Business Machines Corporation | Dendritic powder materials for high conductivity paste applications |
JP2004149782A (ja) * | 2002-10-09 | 2004-05-27 | Mitsubishi Chemicals Corp | 熱可塑性樹脂組成物及びそれを用いてなる成形体 |
KR101001121B1 (ko) * | 2002-10-22 | 2010-12-14 | 유겡가이샤 소피아 프로덕트 | 광소자용 봉착재 조성물, 봉착 구조체 및 광소자 |
US20070051136A1 (en) | 2002-12-19 | 2007-03-08 | Charles Watkinson | Method and apparatus for forming glass flakes and fibres |
US7045007B2 (en) * | 2002-12-31 | 2006-05-16 | Engelhard Corporation | Effect pigment |
EP2660385B1 (en) * | 2006-05-02 | 2018-07-04 | Goodrich Corporation | Lightning strike protection material |
WO2009017035A1 (ja) * | 2007-07-27 | 2009-02-05 | Asahi Glass Co., Ltd. | 透光性基板、その製造方法、有機led素子及びその製造方法 |
US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
-
2011
- 2011-07-22 US US13/808,422 patent/US9272497B2/en not_active Expired - Fee Related
- 2011-07-22 DK DK11810432.2T patent/DK2595802T3/en active
- 2011-07-22 CN CN201180035901.9A patent/CN103025516B/zh not_active Expired - Fee Related
- 2011-07-22 ES ES11810432.2T patent/ES2548427T3/es active Active
- 2011-07-22 WO PCT/US2011/044920 patent/WO2012012675A1/en active Application Filing
- 2011-07-22 EP EP11810432.2A patent/EP2595802B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
WO2012012675A1 (en) | 2012-01-26 |
EP2595802B1 (en) | 2015-09-09 |
US20130164466A1 (en) | 2013-06-27 |
EP2595802A1 (en) | 2013-05-29 |
DK2595802T3 (en) | 2015-11-09 |
CN103025516B (zh) | 2016-04-20 |
US9272497B2 (en) | 2016-03-01 |
EP2595802A4 (en) | 2014-07-09 |
CN103025516A (zh) | 2013-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2548427T3 (es) | Dispositivo electrónico sellado herméticamente que usa escamas de vidrio revestido | |
TW201612262A (en) | Curable resin composition, cured film, wavelength conversion film, light emitting element, and method for forming light emitting layer | |
ES2582402T3 (es) | Madera de imitación | |
JP2015232993A5 (es) | ||
JP2014007156A5 (es) | ||
EP2863447A3 (en) | Organic light emitting device and method of fabricating the same | |
WO2010129887A3 (en) | Light emitting device including semiconductor nanocrystals | |
EP2731156A3 (en) | Organic light emitting diode display | |
CL2012002510A1 (es) | Metodo para la aplicacion de un revestimiento a un recipientes de vidrio, comprende las etapas de: revestir una superficie externa del recipiente de vidrio con un material de revestimiento termicamente curable que contiene nanoparticulas electricamente conductivas y exponer el recipiente a una radiacion de radiofrecuencia de manera tal que la absorcion de tal radiacion de radiofrecuencia por parte de dichas nanoparticulas cure dicho material; recipiente. | |
JP2012156148A5 (es) | ||
JP2015529959A5 (es) | ||
WO2012173371A3 (ko) | 신규한 화합물 및 이를 이용한 유기 전자 소자 | |
EP2822052A3 (en) | Organic light emitting diode display | |
BR112015017244A2 (pt) | artigo de filme de pontos quânticos, método de formação de um artigo de filme de pontos quânticos e material de pontos quânticos | |
EP2629346A3 (en) | Organic Light-Emitting Device Having Improved Efficiency Characteristics and Organic Light-Emitting Display Apparatus Including the Same | |
WO2011133354A3 (en) | Oled light extraction films having internal nanostructures and external microstructures | |
JP2014529169A5 (es) | ||
WO2016003202A3 (ko) | 유기전기 소자용 화합물, 이를 이용한 유기전기소자 및 그 전자 장치 | |
JP2011009205A5 (ja) | 発光素子 | |
AR092497A1 (es) | Composicion para formacion de un recubrimiento solido y una union tubular roscada | |
EP2846373A3 (en) | Organic light emitting diode display | |
CL2014002850A1 (es) | Agente de curado para resina epoxi que comprende: i) el producto de reaccion entre metaxililendiamina o paraxililendiamina y acido acrilico o derivados del acido acrilico y ii) el producto de reaccion entre metaxililendiamina o paraxililendiamina y acidos carboxilicos insaturados, composición de resina epoxi y adhesivo para barrera de gas y laminado con barrera de gas. | |
WO2013002514A3 (ko) | 다이아릴아민 유도체를 이용하는 유기전기소자, 유기전기소자용 신규 화합물 및 조성물 | |
EP2830117A3 (en) | Method of manufacturing organic light-emitting display apparatus | |
EP2475009A3 (en) | Organic light emitting display device and method for manufacturing the same |