ES2380852A1 - Improvements introduced in the invention patent p200700804 relating to "production of composite materials with high thermal conductivity". (Machine-translation by Google Translate, not legally binding) - Google Patents

Improvements introduced in the invention patent p200700804 relating to "production of composite materials with high thermal conductivity". (Machine-translation by Google Translate, not legally binding) Download PDF

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Publication number
ES2380852A1
ES2380852A1 ES201001355A ES201001355A ES2380852A1 ES 2380852 A1 ES2380852 A1 ES 2380852A1 ES 201001355 A ES201001355 A ES 201001355A ES 201001355 A ES201001355 A ES 201001355A ES 2380852 A1 ES2380852 A1 ES 2380852A1
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phase
thermal conductivity
relating
high thermal
production
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ES201001355A
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ES2380852B2 (en
Inventor
Francisco Javier Narciso Romero
Enrique Louis Cereceda
Richard Prieto Alfonzo
Jose Miguel Molina Jorda
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Universidad de Alicante
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Universidad de Alicante
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5116—Ag or Au
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738—Semiconductor materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)

Abstract

Improvements introduced in the patent of invention p200700804 relating to production of composite materials with high thermal conductivity comprising three phases: i) a first phase a of graphite particles in the form of flakes; ii) a second phase b, of particles or fibers of a material that can act as a separator of the flakes; and iii) a third phase c, of metallic alloy used to consolidate the composite material and chosen in such a way as to help optimize the characteristics of the metal-graphite interface and whose major component is: a) al, ag and/or cu forming alloy with any of the following elements w, nb, zr, hf, mo and ta, together with the inevitable impurities; or, b) mg forming alloy or not with any of the following elements: si, cr, ti, al, mn, zn, cu, zr and th, together with the inevitable impurities. (Machine-translation by Google Translate, not legally binding)

Description

Mejoras introducidas en la patente de invención nº P 200700804 relativas a: "Producción de materiales compuestos con alta conductividad térmica".Improvements introduced in the invention patent nº P 200700804 related to: "Production of composite materials with high thermal conductivity ".

La presente invención está relacionada con mejoras introducidas en la patente de invención con número de solicitud P200700804, relativa a materiales de alta conductividad térmica para su utilización como disipadores de calor en dispositivos microelectrónicos, optoelectrónicos y generadores de potencia.The present invention is related to improvements in invention patent with number application P200700804, relating to high conductivity materials for use as thermal heat sinks microelectronic, optoelectronic and generator devices power.

Estado de la técnicaState of the art

La invención principal P200700804 describe un material compuesto que presenta una alta conductividad térmica para ser utilizado en dispositivos electrónicos como disipador de calor y un método para producir dicho material. El material compuesto está constituido por tres fases, una fase formada principalmente por copos de grafito, otra fase que puede ser un material cerámico como SiC, BN, AIN, TiB_{2}, diamante o fibras de carbono de altas prestaciones térmicas, y finalmente una tercera fase formada por una aleación metálica cuyo componente mayoritario puede ser Al, Ag y/o Cu, formando aleación con alguno de los siguientes elementos: Si, Cr, Ti, V y B, junto con las inevitables impurezas.The main invention P200700804 describes a composite material that has a high thermal conductivity for be used in electronic devices as a heat sink and a method to produce said material. The composite material is consisting of three phases, one phase consisting mainly of graphite flakes, another phase that can be a ceramic material like SiC, BN, AIN, TiB2, diamond or high carbon fibers thermal performance, and finally a third phase formed by a metallic alloy whose major component can be Al, Ag and / or Cu, forming alloy with any of the following elements: Yes, Cr, Ti, V and B, along with the inevitable impurities.

En la presente invención se propone, respecto a la tercera fase del procedimiento principal, añadir: i) W, Nb, Zr, Hf, Mo y Ta al grupo de elementos que forman aleación con los elementos principales (Al, Ag y/o Cu) y ii) magnesio como elemento principal formando aleación o no con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas.In the present invention it is proposed, with respect to the third phase of the main procedure, add: i) W, Nb, Zr, Hf, Mo and Ta to the group of elements that form alloy with the main elements (Al, Ag and / or Cu) and ii) magnesium as an element main forming alloy or with one of the following Elements: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, together with the inevitable impurities.

Los elementos aleantes propuestos para Al, Ag y/o Cu permiten mejorar la interfase entre metal y grafito a través de interacciones químicas controlables con las condiciones de fabricación del material. El hecho de añadir el Mg al grupo de elementos principales se debe a que las aplicaciones de materiales basados en este metal crecen día a día debido fundamentalmente a su baja densidad. Esta característica, unida a sus propiedades térmicas (Conductividad Térmica 167 W/mK y CTE de 27 x 10^{-6}K^{-1}) hacen que los materiales propuestos en la presente adición sean unos candidatos atractivos para su uso como disipadores de calor.The alloying elements proposed for Al, Ag and / or Cu allow to improve the interface between metal and graphite through of controllable chemical interactions with the conditions of material manufacturing The fact of adding Mg to the group of main elements is because the material applications based on this metal they grow day by day due mainly to their low density. This characteristic, together with its thermal properties (Thermal Conductivity 167 W / mK and CTE of 27 x 10 - 6 K - 1) they make the materials proposed in this addition be about Attractive candidates for use as heat sinks.

Explicación de la invenciónExplanation of the invention.

La presente invención describe un material compuesto con alta conductividad térmica que comprende tres fases: i) una primera fase A de partículas de grafito en forma de copos; ii) una segunda fase B, de partículas o fibras de un material que pueda actuar como separador de los copos; y una iii) tercera fase C, de aleación metálica, seleccionada de tal modo que mejore las características de la interfase metal-grafito. La fase C consta de: a) aleación de Al, Ag y/o Cu formando aleación con alguno de los siguientes elementos: W, Nb, Zr, Hf, Mo y Ta, junto con las inevitables impurezas; o bien, b) aleación metálica cuyo componente mayoritario es Mg formando aleación o no con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas.The present invention describes a material compound with high thermal conductivity comprising three phases: i) a first phase A of flake graphite particles; ii) a second phase B, of particles or fibers of a material that can act as a flake separator; and a iii) third phase C, of metallic alloy, selected in such a way that it improves the characteristics of the metal-graphite interface. The Phase C consists of: a) Al, Ag and / or Cu alloy forming alloy with any of the following elements: W, Nb, Zr, Hf, Mo and Ta, together with the inevitable impurities; or, b) metallic alloy whose Major component is Mg forming alloy or not with any of The following elements: Yes, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, together with the inevitable impurities.

Estos materiales presentan propiedades térmicas adecuadas para fabricar disipadores de calor.These materials have thermal properties suitable for manufacturing heat sinks.

A lo largo de la descripción y las reivindicaciones la palabra "comprende" y sus variantes no pretenden excluir otras características técnicas, aditivos, componentes o pasos. Para los expertos en la materia, otros objetos, ventajas y características de la invención se desprenderán en parte de la descripción y en parte de la práctica de la invención. Los siguientes ejemplos y dibujos se proporcionan a modo de ilustración, y no se pretende que restrinjan la presente invención. Además, la presente invención cubre todas las posibles combinaciones de realizaciones particulares y preferidas aquí indicadas.Throughout the description and the claims the word "comprises" and its variants not they intend to exclude other technical characteristics, additives, components or steps. For those skilled in the art, other objects, advantages and features of the invention will be partly detached of the description and in part of the practice of the invention. The following examples and drawings are provided by way of illustration, and are not intended to restrict the present invention. Besides, the The present invention covers all possible combinations of particular and preferred embodiments set forth herein.

Breve descripción de los figurasBrief description of the figures

Fig 1. Muestra la microestructura de material compuesto constituido por (a) Gr (46%)/SiC_{400} (34%)/Mg (resto) y (b) Gr (56%)/SiC_{600} (24%)/Mg (resto) donde "Gr" indica copos de grafito.Fig 1. Shows the material microstructure compound consisting of (a) Gr (46%) / SiC 400 (34%) / Mg (remainder) and (b) Gr (56%) / SiC_ {600} (24%) / Mg (remainder) where "Gr" indicates graphite flakes

Exposición detallada de modos de realización y EjemploDetailed statement of embodiments and Example

La presente invención se ilustra en el siguiente ejemplo acorde con lo indicado para la Fig. 1, que ilustra las propiedades térmicas del nuevo material propuesto en esta invención.The present invention is illustrated in the following example according to that indicated in Fig. 1, which illustrates the thermal properties of the new material proposed in this invention.

En este ejemplo se utilizó para la tercera fase C Mg puro (99.9%). La Figura 1 muestra la microestructura del material fabricado que está constituido por capas de copos de grafito orientadas alternando con capas de material compuesto de Mg/partículas de SiC.In this example it was used for the third phase C Pure Mg (99.9%). Figure 1 shows the microstructure of the manufactured material that consists of layers of flakes of graphite oriented alternating with layers of composite material Mg / SiC particles.

El material resultante es pues claramente anisótropo presentando sus mejores propiedades en el plano de los copos, como se muestra en la Tabla I. Los resultados recogidos en la Tabla I muestran claramente el potencial de estos materiales. Los materiales muestran una conductividad térmica y CTE que se adecúan para su utilización como disipadores de calor en dispositivos electrónicos.The resulting material is thus clearly Anisotropic presenting its best properties in the field of flakes, as shown in Table I. The results collected in the Table I clearly show the potential of these materials. The materials show a thermal conductivity and CTE that fit for use as heatsinks devices electronic

TABLA ITABLE I Propiedades principales de los materiales compuestos constituidos por Grafito/SiC_{400}/Mg y Grafito/SiC_{600}/Mg con las fracciones en volumen de los constituyentes que se indican en el ejemplo, en donde TC es la conductividad térmica y CTE el coeficiente de expansión térmicaMain properties of composite materials consisting of Graphite / SiC 400 / Mg and Graphite / SiC 600 / Mg with the volume fractions of the constituents indicated in the example, where TC is the thermal conductivity and CTE the Coefficient of thermal expansion

1one

Claims (2)

1. Mejoras introducidas en la patente de invención P200700804 relativas a producción de materiales compuestos con alta conductividad térmica que comprenden tres fases:1. Improvements introduced in the patent of invention P200700804 relating to production of composite materials with high thermal conductivity comprising three phases: i) una primera fase A de partículas de grafito en forma de copos; ii) una segunda fase B, de partículas o fibras de un material que pueda actuar como separador de los copos; iii) una tercera fase C utilizada para consolidar el material compuesto, que consta de un material metálico seleccionado entre:i) a first phase A graphite particle in the form of flakes; ii) a second phase B, of particles or fibers of a material that can act as a flake separator; iii) one third phase C used to consolidate the composite material, which It consists of a metallic material selected from:
a) to)
Al, Ag o Cu o combinaciones de los mismos, o los anteriores elementos (o sus combinaciones) formando aleación con alguno de los siguientes elementos: W, Nb, Zr, Hf, Mo y Ta, junto con las inevitables impurezas; o,Al, Ag or Cu or combinations thereof, or previous elements (or their combinations) forming alloy with any of the following elements: W, Nb, Zr, Hf, Mo and Ta, together with the inevitable impurities; or,
b) b)
un material metálico cuyo componente mayoritario es Mg formando aleación, o no, con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas.a metallic material whose majority component is Mg forming alloy, or not, with any of the following elements: Yes, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, along with the inevitable impurities 
         \vskip1.000000\baselineskip\ vskip1.000000
2. Uso del material de la reivindicación 1 para fabricar disipadores de calor.2. Use of the material of claim 1 for manufacture heat sinks.
ES201001355A 2010-10-21 2010-10-21 IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". Active ES2380852B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370546A1 (en) * 1988-11-11 1990-05-30 ENIRISORSE S.p.A. Process for producing composite materials with a metal matrix, with a controlled content of reinforcer agent
US5228494A (en) * 1992-05-01 1993-07-20 Rohatgi Pradeep K Synthesis of metal matrix composites containing flyash, graphite, glass, ceramics or other metals
EP0765946A1 (en) * 1995-09-22 1997-04-02 Suzuki Motor Corporation Processes for producing Mg-based composite materials
EP1168438A2 (en) * 2000-06-23 2002-01-02 Sumitomo Electric Industries, Ltd. High thermal conductivity composite material, and method for producing the same
KR20040027144A (en) * 2002-09-27 2004-04-01 국방과학연구소 High damping aluminum matrix composite

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370546A1 (en) * 1988-11-11 1990-05-30 ENIRISORSE S.p.A. Process for producing composite materials with a metal matrix, with a controlled content of reinforcer agent
US5228494A (en) * 1992-05-01 1993-07-20 Rohatgi Pradeep K Synthesis of metal matrix composites containing flyash, graphite, glass, ceramics or other metals
EP0765946A1 (en) * 1995-09-22 1997-04-02 Suzuki Motor Corporation Processes for producing Mg-based composite materials
EP1168438A2 (en) * 2000-06-23 2002-01-02 Sumitomo Electric Industries, Ltd. High thermal conductivity composite material, and method for producing the same
KR20040027144A (en) * 2002-09-27 2004-04-01 국방과학연구소 High damping aluminum matrix composite

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