ES2380852B2 - IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". - Google Patents
IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". Download PDFInfo
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- ES2380852B2 ES2380852B2 ES201001355A ES201001355A ES2380852B2 ES 2380852 B2 ES2380852 B2 ES 2380852B2 ES 201001355 A ES201001355 A ES 201001355A ES 201001355 A ES201001355 A ES 201001355A ES 2380852 B2 ES2380852 B2 ES 2380852B2
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- 239000002131 composite material Substances 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000010439 graphite Substances 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 5
- 229910052776 Thorium Inorganic materials 0.000 claims abstract description 4
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 4
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 4
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 4
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000000835 fiber Substances 0.000 claims abstract description 3
- 239000007769 metal material Substances 0.000 claims 2
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 4
- 239000011777 magnesium Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012850 fabricated material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5116—Ag or Au
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
Mejoras introducidas en la patente de invención P200700804 relativas a producción de materiales compuestos con alta conductividad térmica que comprenden tres fases: i) una primera fase A de partículas de grafito en forma de copos; ii) una segunda fase B, de partículas o fibras de un material que pueda actuar como separador de los copos; y iii) una tercera fase C, de aleación metálica utilizada para consolidar el material compuesto y elegida de tal modo que ayude a optimizar las características de la interfase metal-grafito y cuyo componente mayoritario es: a) Al, Ag y/o Cu formando aleación con alguno de los siguientes elementos W, Nb, Zr, Hf, Mo y Ta, junto con las inevitables impurezas; o bien, b) Mg formando aleación o no con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas.Improvements introduced in the patent of invention P200700804 relating to production of composite materials with high thermal conductivity comprising three phases: i) a first phase A of graphite particles in the form of flakes; ii) a second phase B, of particles or fibers of a material that can act as a separator of the flakes; and iii) a third phase C, of metallic alloy used to consolidate the composite material and chosen in such a way as to help optimize the characteristics of the metal-graphite interface and whose major component is: a) Al, Ag and / or Cu forming alloy with any of the following elements W, Nb, Zr, Hf, Mo and Ta, together with the inevitable impurities; or, b) Mg forming alloy or not with any of the following elements: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, together with the inevitable impurities.
Description
- MEJORAS INTRODUCIDAS EN LA PATENTE DE INVENCIÓN P200700804 RELATIVAS A "PRODUCCIÓN DE MATERIALES COMPUESTOS CON ALTA CONDUCTIVIDAD TÉRMICA" IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY"
- 5 5
- DESCRIPCIÓN DESCRIPTION
- 1 O 1 O
- La presente invención está relacionada con mejoras introducidas en la patente de invención con número de solicitud P200700804, relativa a materiales de alta conductividad térmica para su utilización como disipadores de calor en dispositivos microelectrónicos, optoelectrónicos y generadores de potencia. The present invention relates to improvements introduced in the patent of invention with application number P200700804, relating to high thermal conductivity materials for use as heat sinks in microelectronic, optoelectronic and power generators.
- ESTADO DE LA TÉCNICA STATE OF THE ART
- 15 2O 15 2O
- La invención principal P200700804 describe un material compuesto que presenta una alta conductividad térmica para ser utilizado en dispositivos electrónicos como disipador de calor y un método para producir dicho material. El material compuesto está constituido por tres fases, una fase formada principalmente por copos de grafito, otra fase que puede ser un material cerámico como SiC, BN, AIN, TiB2, diamante o fibras de carbono de altas prestaciones térmicas, y finalmente una tercera fase formada por una aleación metálica cuyo componente mayoritario puede ser Al, Ag y/o Cu, formando aleación con alguno de los siguientes elementos: Si, Cr, Ti, V y B, junto con las inevitables impurezas. The main invention P200700804 describes a composite material having a high thermal conductivity to be used in electronic devices as a heat sink and a method for producing said material. The composite material consists of three phases, a phase consisting mainly of graphite flakes, another phase that can be a ceramic material such as SiC, BN, AIN, TiB2, diamond or carbon fibers of high thermal performance, and finally a third phase formed by a metallic alloy whose major component can be Al, Ag and / or Cu, forming an alloy with one of the following elements: Si, Cr, Ti, V and B, together with the inevitable impurities.
- 2 5 2 5
- En la presente invención se propone, respecto a la tercera fase del procedimiento principal, añadir: i) W, Nb, Zr, Hf, Mo y Ta al grupo de elementos que forman aleación con los elementos principales (Al, Ag y/o Cu) y ii) magnesio como elemento principal formando aleación o no con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas. In the present invention, it is proposed, with respect to the third phase of the main procedure, to add: i) W, Nb, Zr, Hf, Mo and Ta to the group of elements that form an alloy with the main elements (Al, Ag and / or Cu) ) and ii) magnesium as the main element forming alloy or not with any of the following elements: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, together with the inevitable impurities.
- 3O 3 5 3O 3 5
- Los elementos aleantes propuestos para Al, Ag y/o Cu permiten mejorar la interfase entre metal y grafito a través de interacciones químicas controlables con las condiciones de fabricación del material. El hecho de añadir el Mg al grupo de elementos principales se debe a que las aplicaciones de materiales basados en este metal crecen día a día debido fundamentalmente a su baja densidad. Esta característica, unida a sus propiedades térmicas (Conductividad Térmica 167 W/mK y CTE de 27 x 1 o-6K"1) hacen que los materiales propuestos en la presente adición sean unos candidatos atractivos para su uso como disipadores de calor. The alloying elements proposed for Al, Ag and / or Cu allow to improve the interface between metal and graphite through controllable chemical interactions with the manufacturing conditions of the material. The fact of adding the Mg to the group of main elements is due to the fact that the applications of materials based on this metal grow day by day mainly due to its low density. This characteristic, together with its thermal properties (Thermal Conductivity 167 W / mK and CTE of 27 x 1 o-6K "1) make the materials proposed in the present addition attractive candidates for use as heat sinks.
- EXPLICACIÓN DE LA INVENCIÓN EXPLANATION OF THE INVENTION
- 5 10 5 10
- La presente invención describe un material compuesto con alta conductividad térmica que comprende tres fases: i) una primera fase A de partículas de grafito en forma de copos; ii) una segunda fase 8, de partículas o fibras de un material que pueda actuar como separador de los copos; y una iii) tercera fase C, de aleación metálica, seleccionada de tal modo que mejore las características de la interfase metal-grafito. La fase C consta de: a) aleación de Al, Ag y/o Cu formando aleación con alguno de los siguientes elementos: W, Nb, Zr, Hf, Mo y Ta, junto con las inevitables impurezas; o bien, b) aleación metálica cuyo componente mayoritario es Mg formando aleación o no con alguno de los siguientes elementos: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr y Th, junto con las inevitables impurezas. The present invention describes a composite material with high thermal conductivity comprising three phases: i) a first phase A of graphite particles in the form of flakes; ii) a second phase 8, of particles or fibers of a material that can act as a separator of the flakes; and a third phase C, of metal alloy, selected in such a way as to improve the characteristics of the metal-graphite interface. Phase C consists of: a) alloy of Al, Ag and / or Cu forming an alloy with one of the following elements: W, Nb, Zr, Hf, Mo and Ta, together with the inevitable impurities; or, b) metallic alloy whose major component is Mg forming alloy or not with any of the following elements: Si, Cr, Ti, Al, Mn, Zn, Cu, Zr and Th, together with the inevitable impurities.
- 15 fifteen
- Estos materiales presentan disipadores de calor. propiedades térmicas adecuadas para fabricar These materials have heat sinks. properties thermal adequate for manufacture
- 2o 2 5 2o 2 5
- A lo largo de la descripción y las reivindicaciones la palabra "comprende" y sus variantes no pretenden excluir otras características técnicas, aditivos, componentes o pasos. Para los expertos en la materia, otros objetos, ventajas y características de la invención se desprenderán en parte de la descripción y en parte de la práctica de la invención. Los siguientes ejemplos y dibujos se proporcionan a modo de ilustración, y no se pretende que restrinjan la presente invención. Además, la presente invención cubre todas las posibles combinaciones de realizaciones particulares y preferidas aquí indicadas. Throughout the description and the claims the word "comprises" and its variants do not intend to exclude other technical characteristics, additives, components or steps. For those skilled in the art, other objects, advantages and characteristics of the invention will emerge partly from the description and partly from the practice of the invention. The following examples and drawings are provided by way of illustration, and are not intended to restrict the present invention. In addition, the present invention covers all possible combinations of particular and preferred embodiments indicated herein.
- BREVE DESCRIPCIÓN DE LOS FIGURAS BRIEF DESCRIPTION OF THE FIGURES
- 30 30
- FIG 1. Muestra la microestructura de material compuesto constituido por (a) Gr (46%)/SiC400 (34%)/Mg (resto) y (b) Gr (56%)/SiCsoo (24%)/Mg (resto) donde "Gr'' indica copos de grafito. FIG 1. Shows the microstructure of composite material constituted by (a) Gr (46%) / SiC400 (34%) / Mg (remainder) and (b) Gr (56%) / SiCsoo (24%) / Mg (remainder) where "Gr" indicates flakes of graphite.
- EXPOSICIÓN DETALLADA DE MODOS DE REALIZACIÓN Y EJEMPLO DETAILED EXHIBITION OF MODES OF EXECUTION AND EXAMPLE
- 3 5 3 5
- La presente invención se ilustra en el siguiente ejemplo acorde con lo indicado para la FIG.1, que ilustra las propiedades térmicas del nuevo material propuesto en esta invención. The present invention is illustrated in the following example according to that indicated for FIG. 1, which illustrates the thermal properties of the new material proposed in this invention.
- 5 5
- En este ejemplo se utilizó para la tercera fase C Mg puro (99.9%). La Figura 1 muestra la microestructura del material fabricado que está constituido por capas de copos de grafito orientadas alternando con capas de material compuesto de Mg/partículas de SiC. In this example, pure Mg Mg (99.9%) was used for the third phase. Figure 1 shows the microstructure of the fabricated material which is constituted by layers of graphite flakes oriented alternating with layers of Mg composite / SiC particles.
- 1 O 1 O
- El material resultante es pues claramente anisótropo presentando sus mejores propiedades en el plano de los copos, como se muestra en la Tabla l. Los resultados recogidos en la Tabla 1 muestran claramente el potencial de estos materiales. Los materiales muestran una conductividad térmica y CTE que se adecuan para su utilización como disipadores de calor en dispositivos electrónicos. The resulting material is thus clearly anisotropic presenting its best properties in the plane of the flakes, as shown in Table 1. The results collected in Table 1 clearly show the potential of these materials. The materials show a thermal conductivity and CTE that are suitable for use as heat sinks in electronic devices.
- 15 fifteen
- TABLA l. Propiedades principales de los materiales compuestos constituidos por Grafito/SiC4oo/Mg y Grafito/SiC6oo/Mg con las fracciones en volumen de los constituyentes que se indican en el ejemplo, en donde TC es la conductividad térmica y CTE el coeficiente de expansión térmica. TABLE l. Main properties of the composite materials constituted by Graphite / SiC4oo / Mg and Graphite / SiC6oo / Mg with the volume fractions of the constituents indicated in the example, where TC is the thermal conductivity and CTE the coefficient of thermal expansion.
- Material Material
- TC (W/mK) Plano xy CTE (1 o-6K"1) Densidad (g/cm3 } TC (W / mK) xy plane CTE (1 o-6K "1) Density (g / cm3)
- Gr(46%)/SiC4oo(34%)/Mg(resto) Gr (46%) / SiC4oo (34%) / Mg (rest)
- 471 Plano xy: 9. 76 z: 16.59 2.2 471 Plane xy: 9. 76 z: 16.59 2.2
- Gr(56%)/SiC6oo(24%)/Mg(resto) Gr (56%) / SiC6oo (24%) / Mg (rest)
- 486 Plano xy: 10.17 z:15.39 2.2 486 Plane xy: 10.17 z: 15.39 2.2
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES201001355A ES2380852B2 (en) | 2010-10-21 | 2010-10-21 | IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES201001355A ES2380852B2 (en) | 2010-10-21 | 2010-10-21 | IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2380852A1 ES2380852A1 (en) | 2012-05-21 |
| ES2380852B2 true ES2380852B2 (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES201001355A Active ES2380852B2 (en) | 2010-10-21 | 2010-10-21 | IMPROVEMENTS INTRODUCED IN THE INVENTION PATENT P200700804 RELATING TO "PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY". |
Country Status (1)
| Country | Link |
|---|---|
| ES (1) | ES2380852B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1230629B (en) * | 1988-11-11 | 1991-10-28 | Nuova Samin Spa | PROCEDURE FOR THE PRODUCTION OF METALLIC MATRIX COMPOSITE MATERIALS WITH CONTROLLED REINFORCEMENT CONTENT |
| US5228494A (en) * | 1992-05-01 | 1993-07-20 | Rohatgi Pradeep K | Synthesis of metal matrix composites containing flyash, graphite, glass, ceramics or other metals |
| US5791397A (en) * | 1995-09-22 | 1998-08-11 | Suzuki Motor Corporation | Processes for producing Mg-based composite materials |
| JP2002080280A (en) * | 2000-06-23 | 2002-03-19 | Sumitomo Electric Ind Ltd | High temperature conductive composite material and method of manufacturing the same |
| KR100471649B1 (en) * | 2002-09-27 | 2005-03-08 | 국방과학연구소 | High damping aluminum matrix composite |
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| ES2380852A1 (en) | 2012-05-21 |
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