ES2290638T3 - Metodo y aparato para enfriar una estructura de generacion de calor. - Google Patents
Metodo y aparato para enfriar una estructura de generacion de calor. Download PDFInfo
- Publication number
- ES2290638T3 ES2290638T3 ES04256509T ES04256509T ES2290638T3 ES 2290638 T3 ES2290638 T3 ES 2290638T3 ES 04256509 T ES04256509 T ES 04256509T ES 04256509 T ES04256509 T ES 04256509T ES 2290638 T3 ES2290638 T3 ES 2290638T3
- Authority
- ES
- Spain
- Prior art keywords
- coolant
- heat
- receiving portion
- receives
- heat receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000020169 heat generation Effects 0.000 title 1
- 239000002826 coolant Substances 0.000 abstract 6
- 238000001816 cooling Methods 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- General Induction Heating (AREA)
Abstract
Un aparato que comprende una estructura de enfriamiento que incluye: una parte de recepción de calor (103) configurada para recibir calor desde una estructura de generación de calor (22, 24), teniendo dicha parte de recepción de calor (103) un ancho en una primera dirección; una parte de entrada (160) para un refrigerante fluido, estando dispuesta dicha parte de entrada (160) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección; una parte de salida (162) para dicho refrigerante fluido, estando dispuesta dicha parte de salida (162) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, y estando separadas dicha parte de entrada (160) y dicha parte de salida (162) de dicha parte de recepción de calor (103) con respecto a una segunda dirección aproximadamente normal a dicha primera dirección; una parte de suministro de refrigerante (140) configurada para guiar un refrigerante fluido desde dichaparte de entrada (160) hasta una región de dicha parte de recepción de calor (103), estando dispuesta en su totalidad dicha parte de suministro de refrigerante (140) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, en el que dicha parte de entrada (160) y dicha parte de suministro de refrigerante (140) están dispuestas sobre un plano inferior de un primer lado de dicha estructura de enfriamiento; y una parte de aplicación de refrigerante (142) configurada para recibir dicho refrigerante desde dicha parte de suministro de refrigerante (140) y para guiar dicho refrigerante desde dicha región de dicha parte de recepción de calor (103) hasta dicha parte de salida (162), estando dispuesta en su totalidad dicha parte de aplicación de refrigerante (142) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, dicho refrigerante recibiendo calor en dicha región de dicha parte de recepción de calor (103) después de desplazarse a través de dicha parte de suministro de refrigerante (140) y antes de desplazarse a través de dicha parte de salida (162), en el que dicha parte de salida (162) y dicha parte de aplicación de refrigerante (142) están dispuestas sobre un plano superior de un segundo lado de dicha estructura de enfriamiento opuesto a dicho primer lado, incluyendo dicha estructura de enfriamiento aberturas (86) a la largo de la misma para permitir que el refrigerante fluya entre la parte de suministro de refrigerante (140) y la parte de aplicación de refrigerante (142).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/698,953 US6952345B2 (en) | 2003-10-31 | 2003-10-31 | Method and apparatus for cooling heat-generating structure |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2290638T3 true ES2290638T3 (es) | 2008-02-16 |
Family
ID=34423430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES04256509T Expired - Lifetime ES2290638T3 (es) | 2003-10-31 | 2004-10-22 | Metodo y aparato para enfriar una estructura de generacion de calor. |
Country Status (5)
Country | Link |
---|---|
US (3) | US6952345B2 (es) |
EP (1) | EP1528619B1 (es) |
AT (1) | ATE374438T1 (es) |
DE (1) | DE602004009140T2 (es) |
ES (1) | ES2290638T3 (es) |
Families Citing this family (64)
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US7000691B1 (en) * | 2002-07-11 | 2006-02-21 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
US7971632B2 (en) | 2003-11-07 | 2011-07-05 | Asetek A/S | Cooling system for a computer system |
US20050262861A1 (en) * | 2004-05-25 | 2005-12-01 | Weber Richard M | Method and apparatus for controlling cooling with coolant at a subambient pressure |
US20050274139A1 (en) * | 2004-06-14 | 2005-12-15 | Wyatt William G | Sub-ambient refrigerating cycle |
US7406829B2 (en) * | 2004-06-18 | 2008-08-05 | General Electric Company | Cryogenic liquid oxidizer cooled high energy system |
US7254957B2 (en) * | 2005-02-15 | 2007-08-14 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
DE202005021675U1 (de) | 2005-05-06 | 2009-10-01 | Asetek A/S | Kühlsystem für ein Computersystem |
US7443354B2 (en) * | 2005-08-09 | 2008-10-28 | The Boeing Company | Compliant, internally cooled antenna apparatus and method |
US7671801B2 (en) * | 2005-09-19 | 2010-03-02 | Raytheon Company | Armor for an electronically scanned array |
US20070119572A1 (en) * | 2005-11-30 | 2007-05-31 | Raytheon Company | System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements |
US20070119568A1 (en) * | 2005-11-30 | 2007-05-31 | Raytheon Company | System and method of enhanced boiling heat transfer using pin fins |
US20070209782A1 (en) * | 2006-03-08 | 2007-09-13 | Raytheon Company | System and method for cooling a server-based data center with sub-ambient cooling |
US7908874B2 (en) | 2006-05-02 | 2011-03-22 | Raytheon Company | Method and apparatus for cooling electronics with a coolant at a subambient pressure |
US7548424B2 (en) * | 2007-03-12 | 2009-06-16 | Raytheon Company | Distributed transmit/receive integrated microwave module chip level cooling system |
US8651172B2 (en) | 2007-03-22 | 2014-02-18 | Raytheon Company | System and method for separating components of a fluid coolant for cooling a structure |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US20090071630A1 (en) * | 2007-09-17 | 2009-03-19 | Raytheon Company | Cooling System for High Power Vacuum Tubes |
US7921655B2 (en) | 2007-09-21 | 2011-04-12 | Raytheon Company | Topping cycle for a sub-ambient cooling system |
US20090101311A1 (en) * | 2007-10-22 | 2009-04-23 | Raytheon Company | System and Method for Cooling Using Two Separate Coolants |
US9644869B2 (en) * | 2007-10-25 | 2017-05-09 | Raytheon Company | System and method for cooling structures having both an active state and an inactive state |
US8351200B2 (en) * | 2007-11-19 | 2013-01-08 | International Business Machines Corporation | Convergence of air water cooling of an electronics rack and a computer room in a single unit |
US8387249B2 (en) | 2007-11-19 | 2013-03-05 | International Business Machines Corporation | Apparatus and method for facilitating servicing of a liquid-cooled electronics rack |
US7757506B2 (en) * | 2007-11-19 | 2010-07-20 | International Business Machines Corporation | System and method for facilitating cooling of a liquid-cooled electronics rack |
US8503941B2 (en) | 2008-02-21 | 2013-08-06 | The Boeing Company | System and method for optimized unmanned vehicle communication using telemetry |
US7934386B2 (en) * | 2008-02-25 | 2011-05-03 | Raytheon Company | System and method for cooling a heat generating structure |
US7907409B2 (en) * | 2008-03-25 | 2011-03-15 | Raytheon Company | Systems and methods for cooling a computing component in a computing rack |
US8490678B2 (en) * | 2008-06-02 | 2013-07-23 | Gerald Ho Kim | Silicon-based thermal energy transfer device and apparatus |
ATE546853T1 (de) * | 2008-07-18 | 2012-03-15 | Selex Sistemi Integrati Spa | Einrichtung zum halten, unterbringen und kühlen von strahlungsmodulen einer antenne, insbesondere gruppenantenne |
US20100044005A1 (en) * | 2008-08-20 | 2010-02-25 | International Business Machines Corporation | Coolant pumping system for mobile electronic systems |
US7872867B2 (en) * | 2008-09-02 | 2011-01-18 | International Business Machines Corporation | Cooling system for an electronic component system cabinet |
US9112562B2 (en) * | 2008-09-02 | 2015-08-18 | Intel Corporation | Techniques utilizing adaptive codebooks for beamforming in wireless networks |
US9811097B2 (en) * | 2009-04-16 | 2017-11-07 | Darpa | Environmental control of liquid cooled electronics |
US8045329B2 (en) * | 2009-04-29 | 2011-10-25 | Raytheon Company | Thermal dissipation mechanism for an antenna |
US7907406B1 (en) | 2009-09-28 | 2011-03-15 | International Business Machines Corporation | System and method for standby mode cooling of a liquid-cooled electronics rack |
US7924564B1 (en) * | 2009-10-30 | 2011-04-12 | Raytheon Company | Integrated antenna structure with an embedded cooling channel |
US9927181B2 (en) | 2009-12-15 | 2018-03-27 | Rouchon Industries, Inc. | Radiator with integrated pump for actively cooling electronic devices |
US8274790B2 (en) | 2010-11-16 | 2012-09-25 | International Business Machines Corporation | Automatically reconfigurable liquid-cooling apparatus for an electronics rack |
US8514575B2 (en) | 2010-11-16 | 2013-08-20 | International Business Machines Corporation | Multimodal cooling apparatus for an electronic system |
US20140076522A1 (en) * | 2011-04-04 | 2014-03-20 | Danfoss A/S | Cooling system for a power module |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US9677793B2 (en) | 2011-09-26 | 2017-06-13 | Raytheon Company | Multi mode thermal management system and methods |
US8817474B2 (en) | 2011-10-31 | 2014-08-26 | International Business Machines Corporation | Multi-rack assembly with shared cooling unit |
US8760863B2 (en) | 2011-10-31 | 2014-06-24 | International Business Machines Corporation | Multi-rack assembly with shared cooling apparatus |
DE202012008739U1 (de) * | 2012-09-12 | 2013-12-16 | Abb Technology Ag | Kühlkreislauf mit ausreichend knapp bemessenem Wärmetauscher |
US8925333B2 (en) | 2012-09-13 | 2015-01-06 | International Business Machines Corporation | Thermoelectric-enhanced air and liquid cooling of an electronic system |
US8934246B1 (en) * | 2013-01-04 | 2015-01-13 | James Nelson Keig | Modular motor control unit for marine use |
US10270220B1 (en) * | 2013-03-13 | 2019-04-23 | Science Research Laboratory, Inc. | Methods and systems for heat flux heat removal |
IL228426B (en) | 2013-09-15 | 2018-10-31 | Elta Systems Ltd | Temperature control for show array antenna |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US10462939B2 (en) * | 2015-01-22 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
CN109921819B (zh) * | 2019-03-07 | 2023-11-21 | 成都天锐星通科技有限公司 | 一种相控阵多频段tr模块及信号传输方法 |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11411295B2 (en) * | 2020-09-18 | 2022-08-09 | Raytheon Company | Antenna sub-array blocks having heat dissipation |
US12076805B2 (en) | 2020-11-24 | 2024-09-03 | Raytheon Company | Building liquid flow-through plates |
CN113074473B (zh) * | 2021-03-17 | 2022-06-28 | 中国电子科技集团公司第二十九研究所 | 一种消耗性蒸发制冷装置及使用方法 |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
EP4279160A1 (en) * | 2022-05-19 | 2023-11-22 | Van Rooyen, Willem | Device suitable for distilling a solvent |
Family Cites Families (13)
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US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
US6519955B2 (en) | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
US6292364B1 (en) * | 2000-04-28 | 2001-09-18 | Raytheon Company | Liquid spray cooled module |
US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
US7017651B1 (en) | 2000-09-13 | 2006-03-28 | Raytheon Company | Method and apparatus for temperature gradient control in an electronic system |
CA2329408C (en) * | 2000-12-21 | 2007-12-04 | Long Manufacturing Ltd. | Finned plate heat exchanger |
US6594479B2 (en) * | 2000-12-28 | 2003-07-15 | Lockheed Martin Corporation | Low cost MMW transceiver packaging |
US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
US6937471B1 (en) | 2002-07-11 | 2005-08-30 | Raytheon Company | Method and apparatus for removing heat from a circuit |
US7000691B1 (en) | 2002-07-11 | 2006-02-21 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
US6957550B2 (en) * | 2003-05-19 | 2005-10-25 | Raytheon Company | Method and apparatus for extracting non-condensable gases in a cooling system |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
-
2003
- 2003-10-31 US US10/698,953 patent/US6952345B2/en not_active Expired - Lifetime
-
2004
- 2004-10-22 ES ES04256509T patent/ES2290638T3/es not_active Expired - Lifetime
- 2004-10-22 EP EP04256509A patent/EP1528619B1/en not_active Expired - Lifetime
- 2004-10-22 DE DE602004009140T patent/DE602004009140T2/de not_active Expired - Lifetime
- 2004-10-22 AT AT04256509T patent/ATE374438T1/de not_active IP Right Cessation
-
2005
- 2005-06-15 US US11/154,107 patent/US7110260B2/en not_active Expired - Lifetime
-
2006
- 2006-09-19 US US11/533,219 patent/US7227753B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1528619B1 (en) | 2007-09-26 |
EP1528619A2 (en) | 2005-05-04 |
US7110260B2 (en) | 2006-09-19 |
DE602004009140T2 (de) | 2008-07-03 |
US20050243519A1 (en) | 2005-11-03 |
ATE374438T1 (de) | 2007-10-15 |
DE602004009140D1 (de) | 2007-11-08 |
US20070014090A1 (en) | 2007-01-18 |
EP1528619A3 (en) | 2005-06-22 |
US20050094373A1 (en) | 2005-05-05 |
US6952345B2 (en) | 2005-10-04 |
US7227753B2 (en) | 2007-06-05 |
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