ES2290638T3 - Metodo y aparato para enfriar una estructura de generacion de calor. - Google Patents

Metodo y aparato para enfriar una estructura de generacion de calor. Download PDF

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Publication number
ES2290638T3
ES2290638T3 ES04256509T ES04256509T ES2290638T3 ES 2290638 T3 ES2290638 T3 ES 2290638T3 ES 04256509 T ES04256509 T ES 04256509T ES 04256509 T ES04256509 T ES 04256509T ES 2290638 T3 ES2290638 T3 ES 2290638T3
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ES
Spain
Prior art keywords
coolant
heat
receiving portion
receives
heat receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES04256509T
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English (en)
Inventor
Richard M Weber
George F Barson
Michael D Koehler
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Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ES2290638T3 publication Critical patent/ES2290638T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/02Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • General Induction Heating (AREA)

Abstract

Un aparato que comprende una estructura de enfriamiento que incluye: una parte de recepción de calor (103) configurada para recibir calor desde una estructura de generación de calor (22, 24), teniendo dicha parte de recepción de calor (103) un ancho en una primera dirección; una parte de entrada (160) para un refrigerante fluido, estando dispuesta dicha parte de entrada (160) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección; una parte de salida (162) para dicho refrigerante fluido, estando dispuesta dicha parte de salida (162) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, y estando separadas dicha parte de entrada (160) y dicha parte de salida (162) de dicha parte de recepción de calor (103) con respecto a una segunda dirección aproximadamente normal a dicha primera dirección; una parte de suministro de refrigerante (140) configurada para guiar un refrigerante fluido desde dichaparte de entrada (160) hasta una región de dicha parte de recepción de calor (103), estando dispuesta en su totalidad dicha parte de suministro de refrigerante (140) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, en el que dicha parte de entrada (160) y dicha parte de suministro de refrigerante (140) están dispuestas sobre un plano inferior de un primer lado de dicha estructura de enfriamiento; y una parte de aplicación de refrigerante (142) configurada para recibir dicho refrigerante desde dicha parte de suministro de refrigerante (140) y para guiar dicho refrigerante desde dicha región de dicha parte de recepción de calor (103) hasta dicha parte de salida (162), estando dispuesta en su totalidad dicha parte de aplicación de refrigerante (142) dentro de dicho ancho de dicha parte de recepción de calor (103) con respecto a dicha primera dirección, dicho refrigerante recibiendo calor en dicha región de dicha parte de recepción de calor (103) después de desplazarse a través de dicha parte de suministro de refrigerante (140) y antes de desplazarse a través de dicha parte de salida (162), en el que dicha parte de salida (162) y dicha parte de aplicación de refrigerante (142) están dispuestas sobre un plano superior de un segundo lado de dicha estructura de enfriamiento opuesto a dicho primer lado, incluyendo dicha estructura de enfriamiento aberturas (86) a la largo de la misma para permitir que el refrigerante fluya entre la parte de suministro de refrigerante (140) y la parte de aplicación de refrigerante (142).
ES04256509T 2003-10-31 2004-10-22 Metodo y aparato para enfriar una estructura de generacion de calor. Expired - Lifetime ES2290638T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/698,953 US6952345B2 (en) 2003-10-31 2003-10-31 Method and apparatus for cooling heat-generating structure

Publications (1)

Publication Number Publication Date
ES2290638T3 true ES2290638T3 (es) 2008-02-16

Family

ID=34423430

Family Applications (1)

Application Number Title Priority Date Filing Date
ES04256509T Expired - Lifetime ES2290638T3 (es) 2003-10-31 2004-10-22 Metodo y aparato para enfriar una estructura de generacion de calor.

Country Status (5)

Country Link
US (3) US6952345B2 (es)
EP (1) EP1528619B1 (es)
AT (1) ATE374438T1 (es)
DE (1) DE602004009140T2 (es)
ES (1) ES2290638T3 (es)

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Also Published As

Publication number Publication date
EP1528619B1 (en) 2007-09-26
EP1528619A2 (en) 2005-05-04
US7110260B2 (en) 2006-09-19
DE602004009140T2 (de) 2008-07-03
US20050243519A1 (en) 2005-11-03
ATE374438T1 (de) 2007-10-15
DE602004009140D1 (de) 2007-11-08
US20070014090A1 (en) 2007-01-18
EP1528619A3 (en) 2005-06-22
US20050094373A1 (en) 2005-05-05
US6952345B2 (en) 2005-10-04
US7227753B2 (en) 2007-06-05

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