ES2187365A1 - Diodo de potencia destinado especialmente a equipar el puente rectifivador de una maquina electrica giratoria, del tipo de un alternador para vehiculo automovil. - Google Patents

Diodo de potencia destinado especialmente a equipar el puente rectifivador de una maquina electrica giratoria, del tipo de un alternador para vehiculo automovil.

Info

Publication number
ES2187365A1
ES2187365A1 ES200101981A ES200101981A ES2187365A1 ES 2187365 A1 ES2187365 A1 ES 2187365A1 ES 200101981 A ES200101981 A ES 200101981A ES 200101981 A ES200101981 A ES 200101981A ES 2187365 A1 ES2187365 A1 ES 2187365A1
Authority
ES
Spain
Prior art keywords
resin
ring
sleeve
layer
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200101981A
Other languages
English (en)
Other versions
ES2187365B1 (es
Inventor
Georges-Louis Ledi
Corinne Volle
Laurent Thery
Dominique Sebille
Brice Lecole
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Publication of ES2187365A1 publication Critical patent/ES2187365A1/es
Application granted granted Critical
Publication of ES2187365B1 publication Critical patent/ES2187365B1/es
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01087Francium [Fr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Synchronous Machinery (AREA)

Abstract

Diodo de potencia destinado especialmente a equipar el puente rectificador de una máquina eléctrica giratoria, del tipo de un alternador para vehículo automóvil. El diodo de potencia comprende un apoyo (1) dotado de una parte principal (10) maciza prolongada axialmente por medio de un zócalo (2) que presenta en su extremo libre superior una cara de fijación (3) para un elemento semiconductor (101) cubierto por una resina (103) aislante eléctricamente solidaria con el apoyo (1), y está caracterizado por el hecho de que la periferia externa (20) del zócalo (2) presenta una ranura (4) implantada axialmente por debajo de la cara de fijación (3). Aplicación: puente rectificador de una máquina eléctrica giratoria.
ES200101981A 2000-08-31 2001-08-29 Diodo de potencia destinado especialmente a equipar el puente rectifivador de una maquina electrica giratoria, del tipo de un alternador para vehiculo automovil. Withdrawn - After Issue ES2187365B1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0011156A FR2813442A1 (fr) 2000-08-31 2000-08-31 Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante telle qu'un alternateur pour vehicule automobile
FR0011156 2000-08-31

Publications (2)

Publication Number Publication Date
ES2187365A1 true ES2187365A1 (es) 2003-06-01
ES2187365B1 ES2187365B1 (es) 2004-09-01

Family

ID=8853878

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200101981A Withdrawn - After Issue ES2187365B1 (es) 2000-08-31 2001-08-29 Diodo de potencia destinado especialmente a equipar el puente rectifivador de una maquina electrica giratoria, del tipo de un alternador para vehiculo automovil.

Country Status (2)

Country Link
ES (1) ES2187365B1 (es)
FR (1) FR2813442A1 (es)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
FR1587284A (es) * 1967-10-31 1970-03-13
US3515955A (en) * 1966-10-27 1970-06-02 Semikron G Fur Gleichrichtelba Semiconductor arrangement
US4107727A (en) * 1976-07-28 1978-08-15 Hitachi, Ltd. Resin sealed semiconductor device
FR2446541A1 (fr) * 1979-01-12 1980-08-08 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
FR2454699A2 (fr) * 1979-01-12 1980-11-14 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4328512A (en) * 1977-06-16 1982-05-04 Robert Bosch Gmbh Two-element semiconductor diode rectifier assembly structure
US5005069A (en) * 1990-04-30 1991-04-02 Motorola Inc. Rectifier and method
GB2308736A (en) * 1995-12-26 1997-07-02 Mitsubishi Electric Corp Mounting a semiconductor element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung
FR2660797A1 (fr) * 1990-04-06 1991-10-11 Motorola Semiconducteurs Boitier d'encapsulage perfectionne pour dispositif a semiconducteur.

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3515955A (en) * 1966-10-27 1970-06-02 Semikron G Fur Gleichrichtelba Semiconductor arrangement
FR1587284A (es) * 1967-10-31 1970-03-13
US4107727A (en) * 1976-07-28 1978-08-15 Hitachi, Ltd. Resin sealed semiconductor device
US4328512A (en) * 1977-06-16 1982-05-04 Robert Bosch Gmbh Two-element semiconductor diode rectifier assembly structure
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
FR2446541A1 (fr) * 1979-01-12 1980-08-08 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
FR2454699A2 (fr) * 1979-01-12 1980-11-14 Sev Alternateurs Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
US5005069A (en) * 1990-04-30 1991-04-02 Motorola Inc. Rectifier and method
GB2308736A (en) * 1995-12-26 1997-07-02 Mitsubishi Electric Corp Mounting a semiconductor element

Also Published As

Publication number Publication date
FR2813442A1 (fr) 2002-03-01
ES2187365B1 (es) 2004-09-01

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