ES2169842T3 - Dispositivo de mando de un equipo de alta tension que comprende una organizacion sinoptica. - Google Patents

Dispositivo de mando de un equipo de alta tension que comprende una organizacion sinoptica.

Info

Publication number
ES2169842T3
ES2169842T3 ES97400696T ES97400696T ES2169842T3 ES 2169842 T3 ES2169842 T3 ES 2169842T3 ES 97400696 T ES97400696 T ES 97400696T ES 97400696 T ES97400696 T ES 97400696T ES 2169842 T3 ES2169842 T3 ES 2169842T3
Authority
ES
Spain
Prior art keywords
synoptic
team
organization
high voltage
command device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97400696T
Other languages
English (en)
Inventor
Jean Marmonier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Grid Solutions SAS
Original Assignee
GEC Alsthom T&D SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Alsthom T&D SA filed Critical GEC Alsthom T&D SA
Application granted granted Critical
Publication of ES2169842T3 publication Critical patent/ES2169842T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1481—User interface, e.g. status displays; Programming interface, e.g. connector for computer programming; Monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
    • H02B1/32—Mounting of devices therein
    • H02B1/34—Racks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B15/00—Supervisory desks or panels for centralised control or display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B15/00—Supervisory desks or panels for centralised control or display
    • H02B15/02—Supervisory desks or panels for centralised control or display with mimic diagrams

Abstract

LA PRESENTE INVENCION SE REFIERE A UN DISPOSITIVO DE CONTROL DE UN EQUIPO DE ALTA TENSION QUE LLEVA UN CALCULADOR (1) Y UNA DISPOSICION SINOPTICA CONSTITUIDA POR UN DISPOSITIVO DE SOPORTE (2) QUE LLEVA EN SU CARA VISIBLE UN DESCRIPTIVO (3) DE ESQUEMA SINOPTICO DE SEÑALIZACION DE ESTADOS DEL EQUIPO ASOCIADO A LAMPARAS DE SEÑALIZACION (4). LA DISPOSICION SINOPTICA LLEVA TAMBIEN AL MENOS UN CONECTOR (6), DIRECTAMENTE CONECTADO AL CORDON DE TRANSMISION (7), QUE LLEVA LAS MENCIONADAS LAMPARAS DE SEÑALIZACION (4) Y ESTA CONECTADO DE MANERA AMOVIBLE AL CALCULADOR (1) POR UNA CARA (1A) DE ESTE LLAMADA CARA DE CONEXION, ESTANDO EL DISPOSITIVO DE SOPORTE (2) Y EL CONECTOR (6) DISPUESTOS DE TAL MANERA QUE ESTE ULTIMO PRESENTA LAS LAMPARAS DE SEÑALIZACION (4) ASOCIADA AL DESCRIPTIVO (4) DEL DISPOSITIVO DE SOPORTE (2), YA ESTE CONECTADO AL CALCULADOR (1) EN POSICION LLAMADA NORMAL O DESCONECTADO DEL CALCULADOR (1) EN POSICION LLAMADA DE URGENCIA.
ES97400696T 1996-04-03 1997-03-27 Dispositivo de mando de un equipo de alta tension que comprende una organizacion sinoptica. Expired - Lifetime ES2169842T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9604191A FR2747243B1 (fr) 1996-04-03 1996-04-03 Dispositif de commande d'appareillage haute tension comportant un agencement synoptique

Publications (1)

Publication Number Publication Date
ES2169842T3 true ES2169842T3 (es) 2002-07-16

Family

ID=9490874

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97400696T Expired - Lifetime ES2169842T3 (es) 1996-04-03 1997-03-27 Dispositivo de mando de un equipo de alta tension que comprende una organizacion sinoptica.

Country Status (7)

Country Link
US (1) US5859591A (es)
EP (1) EP0800248B1 (es)
AT (1) ATE213103T1 (es)
CA (1) CA2201037C (es)
DE (1) DE69710239T2 (es)
ES (1) ES2169842T3 (es)
FR (1) FR2747243B1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6366301B1 (en) 1998-09-17 2002-04-02 General Electric Company Man-machine interface for a virtual lockout/tagout panel display
US7170753B2 (en) 2003-12-30 2007-01-30 Intel Corporation Interface enhancement for modular platform applications
US7315251B1 (en) * 2005-01-31 2008-01-01 Network Appliance, Inc. Alert for indicating field replaceable unit status and configuration
US20070008345A1 (en) * 2005-07-08 2007-01-11 Mcdonald R M Display system for an industrial device
US7965493B2 (en) * 2009-08-05 2011-06-21 Eaton Corporation Motor control center and subunit therefor
US9454823B2 (en) 2010-07-28 2016-09-27 arian Medical Systems, Inc. Knowledge-based automatic image segmentation
CN115332962B (zh) * 2022-10-13 2023-05-23 哈尔滨凯纳科技股份有限公司 一种供水泵站的电气控制装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582927A (en) * 1969-06-30 1971-06-01 Lester Associates Inc Power network display panels and controls
US4176941A (en) * 1978-02-27 1979-12-04 Van Dyk Research Corporation Malfunction display system for electrophotographic copying machines
JPS57139782A (en) * 1981-02-24 1982-08-28 Tokyo Shibaura Electric Co Indicator
AT383690B (de) * 1984-07-20 1987-08-10 Vaillant Gmbh Mit elektronischen anzeige-, bedienungsund/oder einstellelemtenten ausgeruestete, am netzstrom anschliessbare regelvorrichtung, insbesondere heizungsregler
US4949035A (en) * 1989-01-06 1990-08-14 Digital Equipment Corporation Connector alignment verification and monitoring system

Also Published As

Publication number Publication date
DE69710239T2 (de) 2002-10-17
CA2201037A1 (fr) 1997-10-03
EP0800248B1 (fr) 2002-02-06
DE69710239D1 (de) 2002-03-21
US5859591A (en) 1999-01-12
EP0800248A1 (fr) 1997-10-08
FR2747243A1 (fr) 1997-10-10
ATE213103T1 (de) 2002-02-15
FR2747243B1 (fr) 1998-05-15
CA2201037C (fr) 2001-05-08

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