ES2164922T3 - Dispositivo hibrido de contactos aflorantes y de produccion de señales acusticas, y procedimiento de fabricacion. - Google Patents

Dispositivo hibrido de contactos aflorantes y de produccion de señales acusticas, y procedimiento de fabricacion.

Info

Publication number
ES2164922T3
ES2164922T3 ES96934969T ES96934969T ES2164922T3 ES 2164922 T3 ES2164922 T3 ES 2164922T3 ES 96934969 T ES96934969 T ES 96934969T ES 96934969 T ES96934969 T ES 96934969T ES 2164922 T3 ES2164922 T3 ES 2164922T3
Authority
ES
Spain
Prior art keywords
sheet
pct
card
contacts
affording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96934969T
Other languages
English (en)
Inventor
Philippe Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2164922T3 publication Critical patent/ES2164922T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0728—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being an optical or sound-based communication interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/26—Devices for calling a subscriber
    • H04M1/27—Devices whereby a plurality of signals may be stored simultaneously
    • H04M1/274—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc
    • H04M1/2745—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc using static electronic memories, e.g. chips
    • H04M1/275—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc using static electronic memories, e.g. chips implemented by means of portable electronic directories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Telephone Set Structure (AREA)
  • Communication Cables (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Dispositivo híbrido, que se presenta bajo la forma de una tarjeta de poco espesor, que puede funcionar como una tarjeta de chip de contactos a orantes y/o producir señales acústicas transmisibles por vía telefónica, caracterizado porque comprende: una primera hoja, que constituye la superficie trasera (100), que soporta un motivo de interconexiones (110) reservado a la fijación de componentes electrónicos, y comprende una perforación (120) que puede recibir un micromódulo de doble cara (10) con el fn de que unos contactos metálicos (12), pertenecientes a la primera cara, denominada cara externa (11), del micromódulo afloren por la cara inferior de la superficie trasera (100) y entren en contacto con un lector exterior para establecer una comunicación, a modo de una tarjeta de chip, una segunda hoja, que constituye la superficie delantera (300), y un intercalar (200), situado entre las dos primeras hojas, que comprende unas escotaduras (210, 215) que pueden enmarcar los componentes electrónicos fijados sobre la superficie trasera (100), y unas metalizaciones (260) que permiten realizar una conexión eléctrica, de una parte, con contactos metálicos (16) pertenecientes a la segunda cara, denominada cara interna (15), del micromódulo (10) y, de otra parte, con un circuito (150) de producción de señales sonoras, acoplado a un transductor sonoro y a un resonador compatible con el formato de tarjeta de chip normalizada, a saber aproximadamente 0,8 mm, por mediación del motivo de interconexiones (110) de la superficie trasera, con el fn de establecer una comunicación mediante señales acústicas transmisibles por vía telefónica.
ES96934969T 1995-10-26 1996-10-25 Dispositivo hibrido de contactos aflorantes y de produccion de señales acusticas, y procedimiento de fabricacion. Expired - Lifetime ES2164922T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9512661A FR2740582B1 (fr) 1995-10-26 1995-10-26 Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication

Publications (1)

Publication Number Publication Date
ES2164922T3 true ES2164922T3 (es) 2002-03-01

Family

ID=9483962

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96934969T Expired - Lifetime ES2164922T3 (es) 1995-10-26 1996-10-25 Dispositivo hibrido de contactos aflorantes y de produccion de señales acusticas, y procedimiento de fabricacion.

Country Status (8)

Country Link
US (1) US6060332A (es)
EP (1) EP0976101B1 (es)
JP (1) JPH11515125A (es)
AT (1) ATE205950T1 (es)
DE (1) DE69615416T2 (es)
ES (1) ES2164922T3 (es)
FR (1) FR2740582B1 (es)
WO (1) WO1997015899A1 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6893896B1 (en) * 1998-03-27 2005-05-17 The Trustees Of Princeton University Method for making multilayer thin-film electronics
IL125221A0 (en) 1998-07-06 1999-03-12 Toy Control Ltd Motion activation using passive sound source
IL127569A0 (en) 1998-09-16 1999-10-28 Comsense Technologies Ltd Interactive toys
NL1009976C2 (nl) * 1998-08-31 2000-03-02 Chess Engineering B V Geïntegreerde schakeling met elektrisch contact.
NL1009975C2 (nl) * 1998-08-31 2000-03-02 Chess Engineering B V Chipkaart met meerdere gekoppelde geïntegreerde schakelingen.
US6607136B1 (en) 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
CA2345745A1 (en) 1998-10-02 2000-04-13 Comsense Technologies, Ltd. Card for interaction with a computer
US7260221B1 (en) 1998-11-16 2007-08-21 Beepcard Ltd. Personal communicator authentication
FR2796512B1 (fr) * 1999-07-13 2001-10-05 Elva Sa Carte a memoire pour emettre des signaux acoustiques
US8019609B2 (en) * 1999-10-04 2011-09-13 Dialware Inc. Sonic/ultrasonic authentication method
US7280970B2 (en) * 1999-10-04 2007-10-09 Beepcard Ltd. Sonic/ultrasonic authentication device
JP2001200224A (ja) * 2000-01-18 2001-07-24 Murata Mfg Co Ltd 異方導電性接着剤およびそれを用いたラダーフィルタ
US9219708B2 (en) 2001-03-22 2015-12-22 DialwareInc. Method and system for remotely authenticating identification devices
FR2831718B1 (fr) * 2001-10-31 2004-09-24 Gemplus Card Int Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puce
US7992067B1 (en) 2001-11-09 2011-08-02 Identita Technologies International SRL Method of improving successful recognition of genuine acoustic authentication devices
FR2872362B1 (fr) * 2004-06-29 2007-06-01 Audiosmartcard Internat Sa Sa Carte a memoire a clavier
FI20085468A0 (fi) * 2008-05-16 2008-05-16 Polar Electro Oy Sähköpiirijärjestely
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD786878S1 (en) * 2015-12-04 2017-05-16 Capital One Services, Llc Payment card chip
CN112712154A (zh) * 2020-01-07 2021-04-27 深圳市文鼎创数据科技有限公司 可蜂鸣智能卡

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073982B2 (ja) * 1985-09-25 1995-01-18 松下電工株式会社 ダイヤルカ−ド
WO1992020048A1 (en) * 1991-05-08 1992-11-12 Elysium Aktiebolag Audio information exchange
US5418688A (en) * 1993-03-29 1995-05-23 Motorola, Inc. Cardlike electronic device
FR2715526B1 (fr) * 1994-01-25 1996-03-29 Gemplus Card Int Dispositif de production de signaux acoustiques, transmissibles par voie téléphonique.

Also Published As

Publication number Publication date
DE69615416D1 (de) 2001-10-25
FR2740582A1 (fr) 1997-04-30
DE69615416T2 (de) 2002-06-20
EP0976101A1 (fr) 2000-02-02
JPH11515125A (ja) 1999-12-21
ATE205950T1 (de) 2001-10-15
FR2740582B1 (fr) 1997-11-28
EP0976101B1 (fr) 2001-09-19
WO1997015899A1 (fr) 1997-05-01
US6060332A (en) 2000-05-09

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