ES2161340T3 - Cuerpo de refrigeracion para componentes semiconductores o similares. - Google Patents
Cuerpo de refrigeracion para componentes semiconductores o similares.Info
- Publication number
- ES2161340T3 ES2161340T3 ES96810159T ES96810159T ES2161340T3 ES 2161340 T3 ES2161340 T3 ES 2161340T3 ES 96810159 T ES96810159 T ES 96810159T ES 96810159 T ES96810159 T ES 96810159T ES 2161340 T3 ES2161340 T3 ES 2161340T3
- Authority
- ES
- Spain
- Prior art keywords
- cooling
- nerves
- cooling body
- basic plate
- nerve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title abstract 7
- 210000005036 nerve Anatomy 0.000 abstract 6
- 238000010276 construction Methods 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Catalysts (AREA)
Abstract
LA INVENCION SE REFIERE A CUERPOS HUECOS PARA ELEMENTOS CONSTRUCTIVOS SEMICONDUCTORES O APARATOS SIMILARES, EN PARTICULAR UNIDAD DE ENFRIAMIENTO DE ALTA POTENCIA A BASE DE ALUMINIO PRENSADO DE EXTRUSION U OTROS METALES LIGEROS, CON NERVIOS DE ENFRIAMIENTO APLICADOS A UNA DISTANCIA UNO DESPUES DE OTRO E INCLUIDOS EN UNA PLACA BASICA, QUE SE CONFIGURA RESPECTIVAMENTE COMO PERFIL HUECO CON DOS PAREDES DE NERVIOS PARALELOS UNO A OTRO Y CON BARRAS TRANSVERSALES DE UNION. LOS NERVIOS DE ENFRIAMIENTO SE ALOJAN DE MANERA FIJA EN UNA RANURA DE UTILIZACION O CAVIDAD SIMILAR DE LA PLACA BASICA. JUNTO A CADA UNO DE LAS RANURAS 22 DE UTILIZACION DEL CUERPO 10 DE ENFRIAMIENTO, CONTENIENDO UN NERVIO 10 DE ENFRIAMIENTO, SE DISPONE EN LA PLACA 14 BASICA UNA RANURA 24 DE UTILIZACION LIBRE, QUE RECIBE UN NERVIO 30A DE ENFRIAMIENTO EN SENTIDO CONTRARIO DE UN SEGUNDO CUERPO 10 DE ENFRIAMIENTO, EN CUYA PLACA BASICA ENGRANAN LOS NERVIOS 30 DE ENFRIAMIENTO DEL PRIMER CUERPO DE ENFRIAMIENTO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29505000 | 1995-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2161340T3 true ES2161340T3 (es) | 2001-12-01 |
Family
ID=8005817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96810159T Expired - Lifetime ES2161340T3 (es) | 1995-03-24 | 1996-03-14 | Cuerpo de refrigeracion para componentes semiconductores o similares. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5682948A (es) |
EP (1) | EP0734062B1 (es) |
AT (1) | ATE206245T1 (es) |
DE (2) | DE29602367U1 (es) |
DK (1) | DK0734062T3 (es) |
ES (1) | ES2161340T3 (es) |
NO (1) | NO961166L (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6009937A (en) * | 1995-12-20 | 2000-01-04 | Hoogovens Aluminium Profiltechnik Gmbh | Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same |
US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
WO2000077601A1 (en) * | 1999-06-11 | 2000-12-21 | Wang Jiung Jung | The heat-radiator of a portable computer's cpu |
JP4355412B2 (ja) * | 1999-11-26 | 2009-11-04 | 昭和電工株式会社 | ヒートシンクおよびその製造方法 |
DE10058574B4 (de) * | 2000-11-24 | 2005-09-15 | Danfoss Drives A/S | Kühlgerät für Leistungshalbleiter |
US6604575B1 (en) * | 2002-08-30 | 2003-08-12 | Southeastern Univer. Research Assn. Inc. | Heat exchange apparatus |
CN2701072Y (zh) * | 2004-04-29 | 2005-05-18 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN2783219Y (zh) * | 2004-11-24 | 2006-05-24 | 温耀生 | 热电制冷模块 |
US8499824B2 (en) * | 2005-10-04 | 2013-08-06 | Elektronische Bauelemente Gesellschaft M.B.H. | Heat sink |
DE102006038980B4 (de) * | 2006-08-21 | 2009-02-19 | Alcan Technology & Management Ag | Kühlkörper für Halbleiterbauelemente sowie Verfahren zu seiner Herstellung |
US8498116B2 (en) * | 2010-07-16 | 2013-07-30 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
US9279625B2 (en) | 2013-10-29 | 2016-03-08 | Caterpillar Inc. | Heat sink device for power modules of power converter assembly |
CN109578160A (zh) * | 2019-01-07 | 2019-04-05 | 浙江康思特动力机械有限公司 | 带有强制冷却风道的通用汽油机曲轴箱体 |
US11280559B2 (en) * | 2020-05-12 | 2022-03-22 | Hanon Systems | Dumbbell shaped plate fin |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2502472C2 (de) * | 1975-01-22 | 1982-09-02 | Siemens AG, 1000 Berlin und 8000 München | Kühlkörper für Thyristoren |
JPS5846660A (ja) * | 1981-09-15 | 1983-03-18 | Nippon Light Metal Co Ltd | ヒ−トシンクの製造法 |
DE8429523U1 (de) * | 1984-10-08 | 1984-11-29 | Nixdorf Computer Ag, 4790 Paderborn | Kühlkörper für elektronische Bauelemente und/oder Geräte |
DE3518310A1 (de) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
US4953058A (en) * | 1989-09-01 | 1990-08-28 | General Dynamics Corporation, Space Systems Div. | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules |
DE59106364D1 (de) * | 1990-10-24 | 1995-10-05 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente. |
JP3122173B2 (ja) * | 1990-11-09 | 2001-01-09 | 株式会社東芝 | 放熱器、放熱装置および放熱器の製造方法 |
JPH05259673A (ja) * | 1992-03-11 | 1993-10-08 | Fujitsu Ltd | 電子ユニットの冷却構造 |
DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
DE9409517U1 (de) * | 1994-06-13 | 1994-07-28 | Siemens Ag | Kühlkörper |
-
1996
- 1996-02-10 DE DE29602367U patent/DE29602367U1/de not_active Expired - Lifetime
- 1996-02-20 US US08/603,579 patent/US5682948A/en not_active Expired - Lifetime
- 1996-03-14 DE DE59607745T patent/DE59607745D1/de not_active Expired - Fee Related
- 1996-03-14 ES ES96810159T patent/ES2161340T3/es not_active Expired - Lifetime
- 1996-03-14 DK DK96810159T patent/DK0734062T3/da active
- 1996-03-14 EP EP96810159A patent/EP0734062B1/de not_active Expired - Lifetime
- 1996-03-14 AT AT96810159T patent/ATE206245T1/de not_active IP Right Cessation
- 1996-03-22 NO NO961166A patent/NO961166L/no unknown
Also Published As
Publication number | Publication date |
---|---|
NO961166L (no) | 1996-09-25 |
DE59607745D1 (de) | 2001-10-31 |
DE29602367U1 (de) | 1996-05-15 |
NO961166D0 (no) | 1996-03-22 |
DK0734062T3 (da) | 2002-01-21 |
EP0734062A2 (de) | 1996-09-25 |
US5682948A (en) | 1997-11-04 |
ATE206245T1 (de) | 2001-10-15 |
EP0734062A3 (de) | 1997-05-28 |
EP0734062B1 (de) | 2001-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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