ES2145367T3 - Procedimiento y dispositivo para la elaboracion de piezas de materiales solidos. - Google Patents
Procedimiento y dispositivo para la elaboracion de piezas de materiales solidos.Info
- Publication number
- ES2145367T3 ES2145367T3 ES96118884T ES96118884T ES2145367T3 ES 2145367 T3 ES2145367 T3 ES 2145367T3 ES 96118884 T ES96118884 T ES 96118884T ES 96118884 T ES96118884 T ES 96118884T ES 2145367 T3 ES2145367 T3 ES 2145367T3
- Authority
- ES
- Spain
- Prior art keywords
- mechanization
- ray
- reflected
- transmitted
- rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000011343 solid material Substances 0.000 title 1
- 239000000463 material Substances 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 230000009466 transformation Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/085—Tubes, rods or hollow products
- C03B33/0855—Tubes, rods or hollow products using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/04—Electric heat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/09—Tube
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Radiation-Therapy Devices (AREA)
- Saccharide Compounds (AREA)
- Materials For Medical Uses (AREA)
Abstract
EL PROCEDIMIENTO SIRVE PARA LA MECANIZACION DE PIEZAS (3) DE TRABAJO A BASE DE MATERIALES RESISTENTES, EN PARTICULAR DE VIDRIO EN UNA CONFIGURACION CON PREFERENCIA DE FORMA TUBULAR PARA APLICACION Y UTILIZACION EN EL CAMPO FARMACEUTICO, QUIMICO O MEDICINA VETERINARIA POR MEDIO DE RAYOS (1,2) DE MECANIZACION OPTICOS, QUE SE ENCUENTRA EN LA ZONA VISIBLE O EN LA ZONA QUE LIMITA ESPECTRALMENTE. PARA LA SEPARACION, PERFORACION O RETIRADA AL MISMO TIEMPO DE MATERIAL SE UTILIZA UN PRIMER RAYO (1) DE MECANIZACION ENFOCADO DE MANERA CORRESPONDIENTE EN UNA APLICACION AGUDA QUE MUESTRA UNA ALTA DENSIDAD DE POTENCIA. PARA LA TRANSFORMACION, REFUNDICION O PARA TRATAMIENTO TERMICO SIRVE UN SEGUNDO RAYO (2) DE MECANIZACION CON UNA DENSIDAD DE POTENCIA REDUCIDA, DONDE EL SEGUNDO RAYO (2) DE MECANIZACION CORRESPONDE A LA UTILIZACION DE FORMA ENFOCADA O TAMBIEN DE MANERA DIVERGENTE. AMBOS RAYOS (1,2) DE MECANIZACION SON AJUSTABLE DE TAL MODO QUE LOS RAYOS APARECEN EN ORGANOS DE MECANIZACION IGUALES O TAMBIENDIFERENTES BAJO DIRECCIONES PARALELA O INCLINADAS UNA CON RESPECTO A OTRA. PARA ELLO SE HA PREVISTO UN PRIMER MODULADOR (11) DE INTERFERENCIA PARA DESDOBLAMIENTO EN RAYOS (14,15) TRANSMITIDO Y REFLEJADO, DONDE EL RAYO (14) TRANSMITIDO SE REFLEJA EN UN ESPEJO (11,13) DE CAMBIO DE DIRECCION SEGUN UNA DISPOSICION DE TIPO DE PRISMAS Y EN LA DIRECCION CONTRARIA DISCURRE EL PRIMER MODULADOR (11) DE INTERFERENCIA. SE HA PREVISTO ADEMAS UN SEGUNDO MODULADOR (17) DE INTERFERENCIA, EN EL QUE SE REFLEJA DE NUEVO EL RAYO (15) REFLEJADO DESPUES DE DESARROLLO DE UN TELEKOPS (16), MIENTRAS EL RAYO (14) TRANSMITIDO DE FORMA DOBLE INCIDE EN EL OTRO LADO DEL SEGUNDO MODULADOR (17) DE INTERFERENCIA HACIA LA TRANSMISION RENOVADA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19609199A DE19609199A1 (de) | 1996-03-09 | 1996-03-09 | Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2145367T3 true ES2145367T3 (es) | 2000-07-01 |
Family
ID=7787744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96118884T Expired - Lifetime ES2145367T3 (es) | 1996-03-09 | 1996-11-26 | Procedimiento y dispositivo para la elaboracion de piezas de materiales solidos. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5779753A (es) |
EP (1) | EP0794031B1 (es) |
JP (1) | JP3205898B2 (es) |
AR (1) | AR006148A1 (es) |
AT (1) | ATE192682T1 (es) |
CA (1) | CA2198415C (es) |
DE (2) | DE19609199A1 (es) |
ES (1) | ES2145367T3 (es) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616327C2 (de) * | 1996-04-24 | 1999-07-22 | Schott Rohrglas Gmbh | Verfahren und Vorrichtung zum Trennen von dünnwandigen Glasrohren |
DE19736732A1 (de) | 1997-08-22 | 1999-03-11 | Lzh Laserzentrum Hannover Ev | Einrichtung und Verfahren zur Bearbeitung eines Werkstückes mittels elektromagnetischer Strahlung sowie Spiegel zur Reflexion von elektromagnetischer Strahlung, insbesondere von Laserlicht |
SE9703425D0 (sv) * | 1997-09-23 | 1997-09-23 | Pharmacia & Upjohn Ab | Prefilled ampooules and manufacture thereof |
US6341502B2 (en) * | 1998-11-19 | 2002-01-29 | Ampolletas, S.A. De C.V. | Method and machine for the manufacturing of syringes |
US6252197B1 (en) | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
EP1068923B1 (de) * | 1999-07-12 | 2007-10-17 | MDC Max Dätwyler AG Bleienbach | Verfahren zur Erzeugung einer Intensitätsverteilung über einen Arbeitslaserstrahl sowie Vorrichtung hierzu |
KR100603210B1 (ko) * | 1999-10-25 | 2006-07-20 | 삼성전자주식회사 | 유리 기판 절단용 레이저 커팅 장치 및 이를 이용한 유리 기판 절단 방법 |
ES2304987T3 (es) | 1999-11-24 | 2008-11-01 | Applied Photonics, Inc. | Metodo y aparato para separar materiales no metalicos. |
US6255621B1 (en) | 2000-01-31 | 2001-07-03 | International Business Machines Corporation | Laser cutting method for forming magnetic recording head sliders |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
AU2001249140A1 (en) * | 2000-09-20 | 2002-04-02 | Electro Scientific Industries, Inc. | Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
DE10105790A1 (de) * | 2001-02-07 | 2002-08-08 | Roesch Ag Medizintechnik | Verfahren zur Herstellung einer Ampulle |
DE10108958A1 (de) * | 2001-02-19 | 2002-09-12 | Arzneimittelgesellschaft Mit B | Vorrichtung und Verfahren zur Fertigstellung einer Spritze für medizinische Zwecke |
US20020170318A1 (en) * | 2001-04-02 | 2002-11-21 | Andreas Gartner | Brief summary of the invention |
JP2003160348A (ja) * | 2001-11-21 | 2003-06-03 | Nippon Sheet Glass Co Ltd | 情報記録媒体用ガラス基板及びその製造方法 |
CN1329325C (zh) * | 2002-07-25 | 2007-08-01 | 宫电高周波设备(上海)有限公司 | 管子密封方法及其装置 |
US20050029240A1 (en) * | 2003-08-07 | 2005-02-10 | Translume, Inc. | Dual light source machining method and system |
US7395679B2 (en) * | 2004-03-19 | 2008-07-08 | Konica Minolta Opto, Inc. | Method of manufacturing glass substrate for information recording medium |
JP5238255B2 (ja) * | 2004-09-30 | 2013-07-17 | ベクトン・ディキンソン・アンド・カンパニー | ガラス製容器内の残留物を削減又は除去するための方法及びそれにしたがって製造されたガラス製容器 |
EP2066592B1 (en) * | 2007-01-30 | 2012-08-22 | Corning Incorporated | Ultra thin glass drawing and blowing |
DE102007037565A1 (de) * | 2007-08-09 | 2009-02-12 | Mglas Ag | Spritzenkörper und Verfahren zur Herstellung eines Spritzenkörpers |
DE102010045094B4 (de) * | 2010-09-13 | 2013-03-07 | Schott Ag | Verfahren und Vorrichtung zur lasergestützten Glasformung |
JP5516994B2 (ja) * | 2011-01-14 | 2014-06-11 | 日本電気硝子株式会社 | リードスイッチ用ガラス管 |
US9010151B2 (en) * | 2011-09-15 | 2015-04-21 | Nippon Electric Glass Co., Ltd. | Glass sheet cutting method |
CN102608757B (zh) * | 2012-03-09 | 2014-10-01 | 中国科学院上海光学精密机械研究所 | 提高高能拍瓦激光聚焦功率密度的装置和方法 |
US9341781B2 (en) * | 2012-09-10 | 2016-05-17 | The United States of America, as represented by the Secretary of Commerce The National Institute of Standards & Technology | Laser machining and mechanical control of optical microresonators |
US10005152B2 (en) * | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
BR112016030522B1 (pt) * | 2014-07-03 | 2019-11-05 | Nippon Steel & Sumitomo Metal Corp | aparelho de processamento a laser |
DE102014214083C5 (de) * | 2014-07-18 | 2021-04-08 | Schott Ag | Vorrichtung und Verfahren zum thermischen Behandeln eines ringförmigen Bereichs einer inneren Oberfläche eines aus einem Borosilikat-Rohrglas hergestellten Glasbehälters |
DE102016112256A1 (de) * | 2015-08-28 | 2017-03-02 | Endress+Hauser Conducta Gmbh+Co. Kg | Verfahren zum automatisierten Herstellen eines ein Diaphragma aufweisenden Glaskörpers |
DE102015121807A1 (de) * | 2015-12-15 | 2017-06-22 | Endress+Hauser Conducta Gmbh+Co. Kg | Verfahren zum automatisierten Herstellen eines mindestens ein Diaphragma aufweisenden Werkstücks |
DE102016114104A1 (de) | 2016-07-29 | 2018-02-01 | Schott Ag | Verfahren zur lasergestützen Umformung von Glaskörpern |
CN109982808B (zh) * | 2016-11-22 | 2021-04-13 | 松下知识产权经营株式会社 | 激光加工装置以及激光加工方法 |
DE102016123865A1 (de) * | 2016-12-08 | 2018-06-14 | Schott Ag | Verfahren zum Weiterverarbeiten eines Glasrohr-Halbzeugs einschließlich einer thermischen Umformung |
DE102016124833A1 (de) | 2016-12-19 | 2018-06-21 | Schott Ag | Verfahren zum Herstellen eines Hohlglasprodukts aus einem Glasrohr-Halbzeug mit Markierungen, sowie Verwendungen hiervon |
CN107009032A (zh) * | 2017-04-24 | 2017-08-04 | 北京航空航天大学 | 一种原子气室尾管熔断装置及原子气室尾管熔断方法 |
DE102018100443A1 (de) * | 2018-01-10 | 2019-07-11 | Schott Ag | Verfahren und Vorrichtung zur Herstellung von Glasvorprodukten und von Glasprodukten |
CN111468842A (zh) * | 2020-05-28 | 2020-07-31 | 宁波飞图自动技术有限公司 | 一种包装容器辅助检测的切割方法及设备 |
Family Cites Families (22)
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DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
US3588440A (en) * | 1969-06-26 | 1971-06-28 | Hughes Aircraft Co | Laser combination energy system |
AT342232B (de) * | 1972-10-12 | 1978-03-28 | Glaverbel | Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material |
FR2228040B1 (es) * | 1973-05-04 | 1977-04-29 | Commissariat Energie Atomique | |
US4045201A (en) * | 1976-07-09 | 1977-08-30 | American Atomics Corporation | Method and apparatus for subdividing a gas filled glass tube |
DE2713904C3 (de) * | 1977-03-29 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum Bearbeiten von Werkstucken mittels eines Laserstrahles |
US4467168A (en) * | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
DE3145278C2 (de) * | 1981-11-14 | 1985-02-14 | Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel | Verfahren zum berührungslosen Abtragen von Material von der Oberfläche eines Glasgegenstandes und Vorrichtung zur Durchführung des Verfahrens |
JPS60251138A (ja) * | 1984-05-28 | 1985-12-11 | Hoya Corp | ガラスの切断方法 |
JPS61229487A (ja) * | 1985-04-03 | 1986-10-13 | Sasaki Glass Kk | レ−ザビ−ムによるガラス切断方法 |
NL8500985A (nl) * | 1985-04-03 | 1986-11-03 | Heineken Technische Beheer Bv | Werkwijze en stelsel voor het herstellen van mechanische en/of chemische beschadigingen aan het oppervlak van voor hergebruik bestemde flessen. |
DE3854564T2 (de) * | 1987-07-20 | 1996-03-28 | Mitsubishi Electric Corp | Laserbearbeitungsvorrichtung. |
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DD288933A5 (de) * | 1989-10-30 | 1991-04-11 | Friedrich-Schiller-Universitaet,De | Verfahren zur lasermaterialbearbeitung mit dynamischer fokussierung |
DE4124162C1 (en) * | 1991-07-20 | 1992-12-03 | Ludger Dipl.-Ing. Overmeyer | Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs |
JP3101636B2 (ja) * | 1991-11-21 | 2000-10-23 | 日本たばこ産業株式会社 | 帯状シートの穿孔装置 |
US5254883A (en) * | 1992-04-22 | 1993-10-19 | Rambus, Inc. | Electrical current source circuitry for a bus |
DE4224282A1 (de) * | 1992-07-23 | 1994-01-27 | Kristina Dipl Ing Schmidt | Verfahren zur abtragenden Mikrostrukturierung von Glas |
DE4305106C2 (de) * | 1993-02-19 | 1995-02-02 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung |
DE4411037C2 (de) * | 1993-04-02 | 1995-07-20 | Fraunhofer Ges Forschung | Verfahren zum Schneiden von Hohlglas |
US5512078A (en) * | 1994-03-24 | 1996-04-30 | Griffin; Stephen E. | Apparatus for making linearly tapered bores in quartz tubing with a controlled laser |
DE19616327C2 (de) * | 1996-04-24 | 1999-07-22 | Schott Rohrglas Gmbh | Verfahren und Vorrichtung zum Trennen von dünnwandigen Glasrohren |
-
1996
- 1996-03-09 DE DE19609199A patent/DE19609199A1/de not_active Withdrawn
- 1996-11-26 DE DE59605185T patent/DE59605185D1/de not_active Expired - Fee Related
- 1996-11-26 EP EP96118884A patent/EP0794031B1/de not_active Expired - Lifetime
- 1996-11-26 AT AT96118884T patent/ATE192682T1/de not_active IP Right Cessation
- 1996-11-26 ES ES96118884T patent/ES2145367T3/es not_active Expired - Lifetime
-
1997
- 1997-02-06 US US08/796,786 patent/US5779753A/en not_active Expired - Fee Related
- 1997-02-24 JP JP03916697A patent/JP3205898B2/ja not_active Expired - Fee Related
- 1997-02-25 CA CA002198415A patent/CA2198415C/en not_active Expired - Fee Related
- 1997-03-07 AR ARP970100919A patent/AR006148A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
EP0794031B1 (de) | 2000-05-10 |
MX9701769A (es) | 1998-03-31 |
EP0794031A2 (de) | 1997-09-10 |
CA2198415A1 (en) | 1997-09-09 |
ATE192682T1 (de) | 2000-05-15 |
JPH1025126A (ja) | 1998-01-27 |
CA2198415C (en) | 2001-04-03 |
US5779753A (en) | 1998-07-14 |
EP0794031A3 (de) | 1998-01-28 |
JP3205898B2 (ja) | 2001-09-04 |
DE19609199A1 (de) | 1997-09-11 |
DE59605185D1 (de) | 2000-06-15 |
AR006148A1 (es) | 1999-08-11 |
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