ES2133976T3 - Procedimiento y dispositivo para el tratamiento quimico y electrolitico de placas y laminas para circuitos impresos. - Google Patents

Procedimiento y dispositivo para el tratamiento quimico y electrolitico de placas y laminas para circuitos impresos.

Info

Publication number
ES2133976T3
ES2133976T3 ES96925716T ES96925716T ES2133976T3 ES 2133976 T3 ES2133976 T3 ES 2133976T3 ES 96925716 T ES96925716 T ES 96925716T ES 96925716 T ES96925716 T ES 96925716T ES 2133976 T3 ES2133976 T3 ES 2133976T3
Authority
ES
Spain
Prior art keywords
liquid
treatment
treatment liquid
procedure
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96925716T
Other languages
English (en)
Inventor
David T Baron
Reinhard Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2133976T3 publication Critical patent/ES2133976T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/008—Processes for carrying out reactions under cavitation conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Food Preservation Except Freezing, Refrigeration, And Drying (AREA)

Abstract

LA PRESENTE INVENCION SE REFIERE A UN PROCEDIMIENTO SEGUN EL QUE LAS PLACAS Y LAMINAS DE CIRCUITOS IMPRESOS SE SOMETEN A UN TRATAMIENTO QUIMICO Y ELECTROLITICO RAPIDO Y DE ALTA PRECISION, PARA LO CUAL SE UTILIZA UN LIQUIDO DE TRATAMIENTO A TRAVES DEL QUE SE TRANSPORTAN LAS PLACAS Y LAS LAMINAS DE CIRCUITOS IMPRESOS EN POSICION HORIZONTAL Y EN DIRECCION HORIZONTAL DE TRANSPORTE. ASIMISMO LA INVENCION SE REFIERE TAMBIEN A UN DISPOSITIVO PARA LA REALIZACION DE DICHO PROCEDIMIENTO. PARA ACELERAR ESTOS PROCESOS, LA SUPERFICIE DEL PRODUCTO DE TRATAMIENTO DEBE EXPONERSE A UNA MACROCORRIENTE QUE PERMITE SUMINISTRAR EL LIQUIDO DE TRATAMIENTO ACTIVO. ADEMAS, DEBE INDUCIRSE EL INTERCAMBIO DE MICROFIBRAS HACIA EL INTERIOR DE LA CAPA DE DIFUSION. SEGUN LA INVENCION ESTO SE REALIZA MEDIANTE EL EMPLEO DE GENERADORES DE CAVITACION DE ACCION HIDRODINAMICA, CON LOS QUE SE CREAN BURBUJAS DE CAVITACION FORMADAS EN LAS VENAS LIQUIDAS (50) EN TANTO QUE EL LIQUIDO DE TRATAMIENTO SE FUERZA HACIA EL EXTERIOR DEL GENERADOR MEDIANTE EL SUMINISTRO DE UNA ALTA PRESION Y SE HACE QUE EL LIQUIDO DE TRATAMIENTO SE TRASLADE A LOS GENERADORES EN FORMA DE CORRIENTE PARASITA. MEDIANTE EL SUMINISTRO DE UNA ALTA PRESION, SE FUERZA LA CIRCULACION DEL LIQUIDO DE TRATAMIENTO A TRAVES DE LAS TOBERAS (10) QUE CREAN BURBUJAS DE CAVITACION, CON LO QUE DICHO LIQUIDO SE EXPULSA HACIA LA SUPERFICIE EN GRANDES CANTIDADES. LAS BURBUJAS DE CAVITACION CONTENIDAS EN EL LIQUIDO IMPLOSIONAN EN LA CAPA DE DIFUSION Y PRODUCEN, EN CONSECUENCIA, EL INTERCAMBIO DE MICROFIBRAS LA APLICACION DEL PROCEDIMIENTO RESULTA ESPECIALMENTE EFICAZ EN EL TRATAMIENTO DE PLACAS DE CIRCUITOS IMPRESOS FINAS CON PERFORACIONES FINAS Y TALADROS CIEGOS.
ES96925716T 1995-07-05 1996-07-05 Procedimiento y dispositivo para el tratamiento quimico y electrolitico de placas y laminas para circuitos impresos. Expired - Lifetime ES2133976T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19524523A DE19524523A1 (de) 1995-07-05 1995-07-05 Anwendung eines Verfahrens und einer Vorrichtung zum Behandeln von Fluiden in der Leiterplattentechnik

Publications (1)

Publication Number Publication Date
ES2133976T3 true ES2133976T3 (es) 1999-09-16

Family

ID=7766095

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96925716T Expired - Lifetime ES2133976T3 (es) 1995-07-05 1996-07-05 Procedimiento y dispositivo para el tratamiento quimico y electrolitico de placas y laminas para circuitos impresos.

Country Status (8)

Country Link
US (1) US6077359A (es)
EP (1) EP0838134B1 (es)
JP (1) JPH11508644A (es)
AT (1) ATE180622T1 (es)
CA (1) CA2225829A1 (es)
DE (2) DE19524523A1 (es)
ES (1) ES2133976T3 (es)
WO (1) WO1997002724A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934300C2 (de) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE10015349A1 (de) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
US20050045205A1 (en) * 2003-08-29 2005-03-03 Stach Steven R. Apparatus and method for cleaning printed circuit boards
DE202006018111U1 (de) * 2006-07-25 2007-02-08 Lang, Marcus Vorrichtung zum beschleunigten nasschemischen Behandeln von Oberflächen
WO2009096483A1 (ja) * 2008-01-31 2009-08-06 Yokogawa Denshikiki Co., Ltd. 洗浄装置
US20100059084A1 (en) * 2008-09-10 2010-03-11 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
WO2012048720A1 (de) * 2010-10-14 2012-04-19 Rena Gmbh Vorrichtung und verfahren zur sprühbehandlung von leiterplatten oder leiterfolien
CN105651501B (zh) * 2015-12-25 2018-04-20 广州兴森快捷电路科技有限公司 一种水平线下喷嘴状态的检测方法
CN112122190B (zh) * 2020-09-23 2023-07-25 格力电器（武汉）有限公司 表面清洁装置、pcb主板
CN112871109A (zh) * 2021-01-12 2021-06-01 广州德蔓生物科技有限公司 一种等离子体色素抑制反应装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1021078B (it) * 1973-07-12 1978-01-30 Cooper H Trattamento di fluidi con onde acustiche
GB1475307A (en) * 1973-07-12 1977-06-01 Burke P Method and apparatus for the treatment of articles with fluids
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
DE3813518A1 (de) * 1988-04-22 1989-11-02 Hoellmueller Maschbau H Maschine zum reinigen und/oder spuelen von bohrungen in leiterplatten
US5188135A (en) * 1990-02-23 1993-02-23 Neumann Industries, Inc. Method and apparatus for processing sheet metal blanks and continuous strip
JPH04341590A (ja) * 1991-05-17 1992-11-27 Nkk Corp 熱延鋼板の酸洗方法及びその装置
JPH04341588A (ja) * 1991-05-17 1992-11-27 Nkk Corp 熱延鋼板の酸洗方法
JPH04341589A (ja) * 1991-05-17 1992-11-27 Nkk Corp 熱延鋼板の酸洗方法
JPH05283852A (ja) * 1992-03-31 1993-10-29 Nec Corp 印刷配線板の表面処理装置

Also Published As

Publication number Publication date
JPH11508644A (ja) 1999-07-27
EP0838134B1 (de) 1999-05-26
DE59602010D1 (de) 1999-07-01
WO1997002724A1 (de) 1997-01-23
EP0838134A1 (de) 1998-04-29
ATE180622T1 (de) 1999-06-15
US6077359A (en) 2000-06-20
DE19524523A1 (de) 1997-01-09
CA2225829A1 (en) 1997-01-23

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