ES2121042T3 - Modulo laser de semiconductores. - Google Patents
Modulo laser de semiconductores.Info
- Publication number
- ES2121042T3 ES2121042T3 ES93114627T ES93114627T ES2121042T3 ES 2121042 T3 ES2121042 T3 ES 2121042T3 ES 93114627 T ES93114627 T ES 93114627T ES 93114627 T ES93114627 T ES 93114627T ES 2121042 T3 ES2121042 T3 ES 2121042T3
- Authority
- ES
- Spain
- Prior art keywords
- laser
- lens
- support
- semiconductor
- sustained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
UN MODULO LASER-SEMICONDUCTOR (10) ESTA PROVISTO CON UNA DISPOSICION EN LINEA DE UN LASER-SEMICONDUCTOR (28) MONTADO EN UNA CARCASA BUTTERFLY (11), CON UNA PRIMERA LENTE (31) SOSTENIDA EN UN SOPORTE (32,33) Y UN AISLADOR (46) Y CON UNA SEGUNDA LENTE (51) SOSTENIDA EN UN SOPORTE (47) Y UNA FIBRA OPTICA (52) SOSTENIDA EN UN CASQUILLO (54,55) QUE PRESENTA UNA SUPERFICIE FINAL OBLICUA (53), ESTANDO SOSTENIDOS LOS DOS EN UNA PARED FINAL (18) DE LA CARCASA (11) Y EXTENDIENDOSE HACIA SU CARA EXTERIOR. UN MODULO LASERSEMICONDUCTOR, QUE SE CARACTERIZA CON EL EMPLEO ESTANDAR DE UNA CARCASA BUTTERFLY Y SU EQUIPAMIENTO DE CONEXION, POR SU REACCION EXTREMADAMENTE BAJA SOBRE EL LASER-SEMICONDUCTOR CON EL RENDIMIENTO DE ACOPLAMIENTO MEJOR POSIBLE, PORQUE ESTA FORMADO DE TAL MODO QUE LA PRIMERA LENTE ES UNA LENTE ESFERICA (31) QUE TRANSFORMA LA LUZ DEL LASER-SEMICONDUCTOR (28) EN UN RAYO PARALELO, QUE CON SU SOPORTE (32,33) SE PUEDE AJUSTAR EN COMPARACION DE LA POSICION FIJA DEL LASER-SEMICONDUCTOR (28) ENTRES DIRECCIONES ESPACIALES Y SE PUEDE FIJAR CON PREFERENCIA MEDIANTE SOLDADURA POR LASER, PORQUE ENTRE LA PRIMERA LENTE (31) Y EL AISLADOR (46) ESTA MONTADA UNA DISPOSICION DE VENTANA FORMADA COMO REALIZACION DE CARCASA HERMETICA CON UNA VENTANA (41) INCLINADA BAJO UN ANGULO AGUDO, PORQUE LA SEGUNDA LENTE ES UNA LENTE PLANOCONVEXA (51), LA CUAL ESTA MONTADA LIGERAMENTE EXCENTRICA EN SU SOPORTE (47) Y CON SU SOPORTE (47) ES AJUSTABLE SOBRE LA PARED FINAL (18) DE LA CARCASA (11) EN LAS DOS DIRECCIONES PERPENDICULARES ENTRE SI DE LOS PLANOS DE LA PARED FINAL Y SE PUEDE FIJAR CON PREFERENCIA MEDIANTE SOLDADURA POR LASER, Y PORQUE LA FIBRA OPTICA (52) ESTA SUJETA EN UN CASQUILLO DE AJUSTE (55) QUE CON PREFERENCIA SE PUEDE SOLDAR CON LASER A TOPE SOBRE EL CORRESPONDIENTE SUPLEMENTO ANULAR (57) DEL SOPORTE (47) DE LA SEGUNDA LENTE (51).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4232327A DE4232327A1 (de) | 1992-09-26 | 1992-09-26 | Halbleiter-Lasermodul |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2121042T3 true ES2121042T3 (es) | 1998-11-16 |
Family
ID=6468929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93114627T Expired - Lifetime ES2121042T3 (es) | 1992-09-26 | 1993-09-11 | Modulo laser de semiconductores. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0590393B1 (es) |
DE (2) | DE4232327A1 (es) |
ES (1) | ES2121042T3 (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4422322C1 (de) * | 1994-06-27 | 1995-09-14 | Ant Nachrichtentech | Lasermodul |
DE4431285C1 (de) | 1994-09-02 | 1995-12-07 | Ant Nachrichtentech | Lasermodul |
CZ288941B6 (cs) * | 1994-09-15 | 2001-10-17 | Marconi Communications Gmbh | Laserový modul |
WO1996024872A2 (en) * | 1995-02-10 | 1996-08-15 | Philips Electronics N.V. | Optoelectronic device with a coupling between a semiconductor laser modulator or amplifier and two optical glass fibres |
EP0755529A1 (en) * | 1995-02-10 | 1997-01-29 | Koninklijke Philips Electronics N.V. | Optoelectronic device with a coupling between a semiconductor diode laser modulator or amplifier and two optical glass fibres |
DE19525814A1 (de) * | 1995-07-15 | 1997-01-16 | Bosch Gmbh Robert | Verfahren zur Herstellung eines Lasermoduls |
JP2993472B2 (ja) * | 1997-07-30 | 1999-12-20 | 住友電気工業株式会社 | 光半導体用気密封止容器及び光半導体モジュール |
JPH1152177A (ja) * | 1997-08-07 | 1999-02-26 | Asahi Optical Co Ltd | 発光素子と光ファイバーのカップリング構造 |
DE19746204A1 (de) | 1997-10-18 | 1999-04-29 | Deutsche Telekom Ag | Halbleiterlaserchip |
DE19805849A1 (de) * | 1998-02-13 | 1999-09-02 | Daimler Chrysler Ag | Verfahren zum Aufbauen und Verbinden von optischen Komponenten, insbesondere von optischen Komponenten in einem Laserresonator, und bei diesem Verfahren verwendeter Laserresonator |
DE19948372C2 (de) * | 1999-10-06 | 2001-10-31 | Infineon Technologies Ag | Faseroptisches Sende-Bauelement mit präzise einstellbarer Einkopplung |
DE19952363A1 (de) * | 1999-10-30 | 2001-05-03 | Bosch Gmbh Robert | Optoelektronischer Empfänger |
JP2003107295A (ja) | 2001-09-28 | 2003-04-09 | Opnext Japan Inc | 光伝送モジュール |
DE10108873B4 (de) * | 2001-01-15 | 2004-03-25 | Infineon Technologies Ag | Opto-elektronisches Modul |
EP1517166B1 (en) | 2003-09-15 | 2015-10-21 | Nuvotronics, LLC | Device package and methods for the fabrication and testing thereof |
CN100369340C (zh) * | 2005-09-22 | 2008-02-13 | 中国科学院半导体研究所 | 半导体激光器蝶形封装器件 |
EP1986028A3 (en) * | 2007-03-27 | 2008-11-05 | Rohm and Haas Electronic Materials LLC | Optical assemblies and their methods of formation |
CN104730655B (zh) | 2015-03-27 | 2017-01-04 | 青岛海信宽带多媒体技术有限公司 | 一种光学器件及收发一体光器件 |
US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4714315A (en) * | 1984-10-24 | 1987-12-22 | Siemens Aktiengesellschaft | Method for connecting elements of optical communication technology to one another or to elements of releasable plug connections |
JPS6370589A (ja) * | 1986-09-12 | 1988-03-30 | Nec Corp | 半導体レ−ザモジユ−ル |
DE68919327T2 (de) * | 1988-03-02 | 1995-04-27 | Fujitsu Ltd | Halbleiterlasermodul und methode zu seiner justierung. |
JP2682641B2 (ja) * | 1988-06-03 | 1997-11-26 | 株式会社リコー | 半導体レーザー光源装置 |
-
1992
- 1992-09-26 DE DE4232327A patent/DE4232327A1/de not_active Withdrawn
-
1993
- 1993-09-11 DE DE59308771T patent/DE59308771D1/de not_active Expired - Lifetime
- 1993-09-11 ES ES93114627T patent/ES2121042T3/es not_active Expired - Lifetime
- 1993-09-11 EP EP93114627A patent/EP0590393B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE59308771D1 (de) | 1998-08-20 |
EP0590393A1 (de) | 1994-04-06 |
DE4232327A1 (de) | 1994-03-31 |
EP0590393B1 (de) | 1998-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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